METHODS AND APPARATUS FOR ALTERING LITHOGRAPHIC PATTERNS TO ADJUST PLATING UNIFORMITY

    公开(公告)号:US20230304183A1

    公开(公告)日:2023-09-28

    申请号:US18118336

    申请日:2023-03-07

    CPC classification number: C25D5/022 H01L21/2885 H01L22/12 C25D21/12 G03F1/70

    Abstract: Methods and apparatus for electroplating a substrate incorporate aspects of digital lithography and feedback from electroplating processes to improve characteristics of plating material based on die patterns. In some embodiments, a method of electroplating a substrate may include receiving a die design, forming a first lithographic pattern for a first substrate based on the die design, using a digital lithography process to pattern the first substrate with the first lithographic pattern, using an electroplating process to deposit material on the first substrate, using a metrology process to determine at least one parameter of the deposited material on the first substrate, and forming a second lithographic pattern from the first lithographic pattern for a second substrate based, at least in part, on the at least one parameter received directly from the metrology process on the first substrate by the digital lithographic process for the second substrate.

    PACKAGE CORE ASSEMBLY AND FABRICATION METHODS

    公开(公告)号:US20210159158A1

    公开(公告)日:2021-05-27

    申请号:US16698680

    申请日:2019-11-27

    Abstract: The present disclosure relates to semiconductor core assemblies and methods of forming the same. The semiconductor core assemblies described herein may be utilized to form semiconductor package assemblies, PCB assemblies, PCB spacer assemblies, chip carrier assemblies, intermediate carrier assemblies (e.g., for graphics cards), and the like. In one embodiment, a silicon substrate core is structured by direct laser patterning. One or more conductive interconnections are formed in the substrate core and one or more redistribution layers are formed on surfaces thereof. The silicon substrate core may thereafter be utilized as a core structure for a semiconductor package, PCB, PCB spacer, chip carrier, intermediate carrier, or the like.

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