COMPREHENSIVELY NUTRITIOUS INSTANT FOOD
    12.
    发明申请

    公开(公告)号:US20170215465A1

    公开(公告)日:2017-08-03

    申请号:US15329231

    申请日:2015-07-31

    Applicant: Bin YANG

    Inventor: Bin YANG

    Abstract: A comprehensively nutritious instant food includes the following raw ingredients: rice powder 39.593849% to 44.930798%, soybean meal 29.695386% to 33.698099%, protein 8.908616% to 10.109430%, edible fiber 4.949231% to 5.616350%, carotene 0.000099% to 0.000112%, calcium 0.197969% to 0.224654%, iron 0.000356% to 0.000404%, zinc 0.000297% to 0.000337%, copper 0.000040% to 0.000045%, sodium 0.395938% to 0.449308%, potassium 0.395938% to 0.449308%, manganese 0.000040% to 0.000045%, selenium 0.000014% to 0.000016%, iodine 0.000030% to 0.000034%, phosphorus 0.013858% to 0.015726%, magnesium 0.007919% to 0.008986%, fluorine 0.000554% to 0.000629%, vitamin B1 0.000297% to 0.000337%, vitamin B2 0.000040% to 0.000045%, vitamin B6 0.000040% to 0.000045%, vitamin B12 0.000001% to 0.000001%, vitamin B3 0.000396% to 0.000449%, vitamin D 0.000013% to 0.000015%, vitamin K 0.000016% to 0.000018%, vitamin H 0.000059% to 0.000067%, vitamin B 0.000079% to 0.000090%, vitamin E 0.000178% to 0.000202%, vitamin C 0.001188% to 0.001348%, vitamin A 0.000020% to 0.000022%, edible fat 0 to 10.523458%, and refined sugar 0-5.939077%.

    SEMICONDUCTOR TRANSISTOR DEVICE STRUCTURE WITH BACK SIDE SOURCE/DRAIN CONTACT PLUGS, AND RELATED MANUFACTURING METHOD
    13.
    发明申请
    SEMICONDUCTOR TRANSISTOR DEVICE STRUCTURE WITH BACK SIDE SOURCE/DRAIN CONTACT PLUGS, AND RELATED MANUFACTURING METHOD 有权
    具有背面源/漏极接触片的半导体晶体管器件结构及相关制造方法

    公开(公告)号:US20110169083A1

    公开(公告)日:2011-07-14

    申请号:US12687607

    申请日:2010-01-14

    Abstract: A method of fabricating a semiconductor device with back side conductive plugs is provided here. The method begins by forming a gate structure overlying a semiconductor-on-insulator (SOI) substrate. The SOI substrate has a support layer, an insulating layer overlying the support layer, an active semiconductor region overlying the insulating layer, and an isolation region outboard of the active semiconductor region. A first section of the gate structure is formed overlying the isolation region and a second section of the gate structure is formed overlying the active semiconductor region. The method continues by forming source/drain regions in the active semiconductor region, and thereafter removing the support layer from the SOI substrate. Next, the method forms conductive plugs for the gate structure and the source/drain regions, where each of the conductive plugs passes through the insulating layer.

    Abstract translation: 此处提供制造具有背面导电插头的半导体器件的方法。 该方法通过形成覆盖绝缘体上半导体(SOI)衬底的栅极结构开始。 SOI衬底具有支撑层,覆盖在支撑层上的绝缘层,覆盖绝缘层的有源半导体区域和有源半导体区域外侧的隔离区域。 栅极结构的第一部分形成在隔离区域的上方,栅极结构的第二部分形成在有源半导体区域的上方。 该方法通过在有源半导体区域中形成源极/漏极区域继续,然后从SOI衬底去除支撑层。 接下来,该方法形成用于栅极结构和源极/漏极区域的导电插塞,其中每个导电插塞穿过绝缘层。

    METHOD FOR PRODUCING SILICON NANOWIRE DEVICES
    15.
    发明申请
    METHOD FOR PRODUCING SILICON NANOWIRE DEVICES 有权
    生产硅纳米装置的方法

    公开(公告)号:US20130102134A1

    公开(公告)日:2013-04-25

    申请号:US13659907

    申请日:2012-10-24

    Abstract: The invention provides a method for producing silicon nanowire devices, including the following steps: growing SiNW on a substrate; depositing an amorphous carbon layer and dielectric anti-reflectivity coating orderly; removing part of dielectric anti-reflectivity coating and amorphous carbon layer above the SiNW through dry etching to expose the SiNW device area; depositing an oxide film on the surface of the above structure; forming a metal pad connected with the SiNW in the SiNW device area; depositing a passivation layer on the surface of the above structure; applying photolithography and etching technology to form contact holes on the metal pad and to remove the passivation layer, the oxide film and the dielectric anti-reflectivity coating above the SiNW outside the device area, stopping on the amorphous carbon layer; removing the amorphous carbon layer above the SiNW outside the device area through ashing process to expose the SiNW.

    Abstract translation: 本发明提供一种生产硅纳米线器件的方法,包括以下步骤:在衬底上生长SiNW; 有序沉积无定形碳层和电介质抗反射涂层; 通过干蚀刻去除SiNW上方的介电抗反射涂层和无定形碳层的一部分,以暴露SiNW器件区域; 在上述结构的表面上沉积氧化膜; 在SiNW器件区域中形成与SiNW连接的金属焊盘; 在上述结构的表面上沉积钝化层; 施加光刻和蚀刻技术以在金属焊盘上形成接触孔,并在器件区域外的SiNW上方去除钝化层,氧化物膜和介电抗反射涂层,停止在无定形碳层上; 通过灰化处理去除器件区域外的SiNW以上的无定形碳层,以暴露SiNW。

    SEMICONDUCTOR DEVICES HAVING STRESSOR REGIONS AND RELATED FABRICATION METHODS
    16.
    发明申请
    SEMICONDUCTOR DEVICES HAVING STRESSOR REGIONS AND RELATED FABRICATION METHODS 有权
    具有压力区域的半导体器件及相关制造方法

    公开(公告)号:US20110303954A1

    公开(公告)日:2011-12-15

    申请号:US12814346

    申请日:2010-06-11

    Inventor: Bin YANG Man Fai NG

    Abstract: Apparatus for semiconductor device structures and related fabrication methods are provided. One method for fabricating a semiconductor device structure involves forming a gate structure overlying a region of semiconductor material, wherein the width of the gate structure is aligned with a crystal direction of the semiconductor material. The method continues by forming recesses about the gate structure and forming a stress-inducing semiconductor material in the recesses.

    Abstract translation: 提供了半导体器件结构和相关制造方法的装置。 制造半导体器件结构的一种方法包括形成覆盖半导体材料区域的栅极结构,其中栅极结构的宽度与半导体材料的<100>晶体方向对齐。 该方法通过在栅极结构周围形成凹槽并在凹部中形成应力诱导半导体材料来继续。

    METHOD FOR INCREASING BULKINESS OF RECONSTITUTED TOBACCO

    公开(公告)号:US20210259297A1

    公开(公告)日:2021-08-26

    申请号:US17037552

    申请日:2020-09-29

    Abstract: A method for increasing bulkiness of reconstituted tobacco by adding tobacco stem particles includes (1) pulverizing a first portion of tobacco stems to obtain tobacco stem particles; (2) classifying the tobacco stem particles with mesh sieves and selecting the tobacco stem particles with a predetermined mesh size; (3) extracting a second portion of the tobacco stems with water and grinding to form a tobacco stem slurry that has a beating degree of 12-14° SR, and mixing the tobacco stem slurry with tobacco leaves in a weight ratio of 6:4 and grinding to obtaining a tobacco slurry that has a beating degree of 18-20° SR; (4) cutting plant fiber pulp boards and dispersing in water to form a plant fiber pulp; (5) preparing a filler solution that contains 10 wt % of a mineral filler; (6) mixing, rolling and drying to obtain the reconstituted tobacco.

    MULTI-AXIS CAPACITIVE ACCELEROMETER
    20.
    发明申请
    MULTI-AXIS CAPACITIVE ACCELEROMETER 审中-公开
    多轴电容式加速度计

    公开(公告)号:US20110296915A1

    公开(公告)日:2011-12-08

    申请号:US12978590

    申请日:2010-12-26

    Inventor: Bin YANG Yi-Lin Yan

    CPC classification number: G01P15/125 G01P15/18

    Abstract: A accelerometer includes a base, a pair of fixed sensing blocks anchored to the base, a plurality of elastic linkages connected to the base, and a movable sensing block sandwiched between the pair of fixed sensing blocks and suspended in the base by the elastic linkages for moving either along a first or a second axes or shifting along a third axes. Each fixed sensing block defines four fixed sensing sections and each fixed sensing section sets in space with respect to the other fixed sensing sections. A projection of each fixed sensing section along a third axes exceeds the movable sensing block in a direction of the first and second axis, respectively.

    Abstract translation: 加速度计包括基座,锚固到基座的一对固定感测块,连接到基座的多个弹性连杆和夹在该对固定感测块之间的可移动感测块,并通过弹性连杆悬挂在基座中 沿着第一轴或第二轴移动或沿着第三轴移动。 每个固定感测块限定了四个固定感测部分,并且每个固定感测部分相对于其它固定感测部分设置在空间中。 每个固定感测部分沿着第三轴的突起分别在第一和第二轴线的方向上超过可移动感测块。

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