公开(公告)号：US10691095B2

公开(公告)日：2020-06-23

申请号：US15497278

申请日：2017-04-26

Applicant: Board of Regents, The University of Texas System

Inventor： Chi Yen Kim ,  David Espalin ,  Eric MacDonald ,  Ryan Wicker

IPC: G05B19/048 ,  B33Y50/02 ,  B29C64/386 ,  B29C64/118 ,  B29C64/209 ,  B29C64/321 ,  G05B19/042

Abstract: Methods and systems for diagnosing and controlling material deposition during a material extrusion 3D printing process. A current sensor can measure a current signal consumed by a material feed motor. The current signal can be analyzed in the time domain and frequency domain to detect material deposition characteristics and prescribe process parameter changes.

公开(公告)号：US20200009801A1

公开(公告)日：2020-01-09

申请号：US16459325

申请日：2019-07-01

Applicant: Board of Regents, The University of Texas System

Inventor： Chi Yen Kim ,  Ryan Wicker ,  David Espalin ,  Charlie Sullivan

IPC: B29C65/44 ,  B29C65/00

Abstract: A wire embedding system and methods are presented. A wire is embedded in a substrate at predetermined locations in a series of sequential embedding instances using heat and pressure. The heat and pressure are removed from the wire in between the series of sequential embedding instances.

公开(公告)号：US20170315526A1

公开(公告)日：2017-11-02

申请号：US15497278

申请日：2017-04-26

Applicant: Board of Regents, The University of Texas System

Inventor： Chi Yen Kim ,  David Espalin ,  Eric MacDonald ,  Ryan Wicker

IPC: G05B19/048 ,  B33Y50/02 ,  B29K105/00

CPC classification number: G05B19/048 ,  B29C64/118 ,  B29C64/209 ,  B29C64/321 ,  B29C64/386 ,  B33Y50/02 ,  G05B19/0428 ,  G05B2219/49023

Abstract: Methods and systems for diagnosing and controlling material deposition during a material extrusion 3D printing process. A current sensor can measure a current signal consumed by a material feed motor. The current signal can be analyzed in the time domain and frequency domain to detect material deposition characteristics and prescribe process parameter changes.

公开(公告)号：US10660214B2

公开(公告)日：2020-05-19

申请号：US15185078

申请日：2016-06-17

Applicant: Board of Regents, The University of Texas System

Inventor： Ryan B. Wicker ,  Francisco Medina ,  Eric MacDonald ,  Danny W. Muse ,  David Espalin

IPC: H01K3/10 ,  H05K3/10 ,  H05K1/02 ,  H01L23/00 ,  B33Y80/00 ,  H05K3/32 ,  H05K3/34

Abstract: Systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic, or electromechanical component/device.

公开(公告)号：US20200047482A1

公开(公告)日：2020-02-13

申请号：US16595144

申请日：2019-10-07

Applicant: Board of Regents, The University of Texas System

Inventor： Eric MacDonald ,  Ryan Wicker ,  David Espalin

IPC: B33Y80/00 ,  B33Y10/00 ,  B29C70/68 ,  B29C64/106 ,  B29C70/70

Abstract: A three-dimensional electronic, biological, chemical, thermal management, and/or electromechanical apparatus can be configured by depositing one or more layers of a three-dimensional structure on a substrate. Such a three-dimensional structure can include one or more internal cavities using an additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be further configured with structural integrated metal objects spanning the internal cavities (possibly filled with air or even evacuated) of the three-dimensional structure for enhanced electromagnetic properties.

公开(公告)号：US10518490B2

公开(公告)日：2019-12-31

申请号：US13829723

申请日：2013-03-14

Applicant: Board of Regents, The University of Texas System

Inventor： Ryan B. Wicker ,  Francisco Medina ,  Eric MacDonald ,  Danny W. Muse ,  David Espalin

IPC: B29C70/88 ,  B29C70/82 ,  B33Y10/00 ,  B33Y30/00 ,  H05K3/10 ,  B29C70/68 ,  H05K1/02 ,  B29C64/00

Abstract: The present invention provides systems and methods for embedding a filament or filament mesh in a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device by providing at least a first layer of a substrate material, and embedding at least a portion of a filament or filament mesh within the first layer of the substrate material such the portion of the filament or filament mesh is substantially flush with a top surface of the first layer and a substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer, allowing the continuation of an additive manufacturing process above the embedded filament or filament mesh. A method is provided for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.

公开(公告)号：US10464306B2

公开(公告)日：2019-11-05

申请号：US15099812

申请日：2016-04-15

Applicant: Board of Regents, The University of Texas System

Inventor： Eric MacDonald ,  Ryan Wicker ,  David Espalin

IPC: B33Y80/00 ,  B33Y10/00 ,  B29C70/68 ,  B29C70/70 ,  B29C64/106 ,  B29K105/20 ,  B29K705/00

Abstract: A three-dimensional electronic, biological, chemical, thermal management, and/or electromechanical apparatus can be configured by depositing one or more layers of a three-dimensional structure on a substrate. Such a three-dimensional structure can include one or more internal cavities using an additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be further configured with structural integrated metal objects spanning the internal cavities (possibly filled with air or even evacuated) of the three-dimensional structure for enhanced electromagnetic properties.

公开(公告)号：US20190039183A1

公开(公告)日：2019-02-07

申请号：US16057742

申请日：2018-08-07

Applicant: Board of Regents, The University of Texas System

Inventor： Philip Alexander Morton ,  Syed Zia Uddin ,  Ryan B. Wicker ,  David Espalin ,  Lawrence Eugene Murr

IPC: B23K26/342 ,  B33Y10/00 ,  B33Y70/00 ,  B23K26/03 ,  B23K26/082 ,  B23K26/70 ,  H05B6/10

Abstract: A method of forming a crack-free aluminum alloy structure using additive manufacturing is presented. A powder bed of precursor aluminum alloy powder is heated. The crack-free aluminum alloy structure is formed within a laser powder bed fusion system encompassing the powder bed during heating.

公开(公告)号：US20180079131A1

公开(公告)日：2018-03-22

申请号：US15559423

申请日：2016-03-14

Applicant: The Board of Regents, The University of Texas System

Inventor： David Espalin ,  Eric MacDonald ,  Ryan B. Wicker

IPC: B29C64/106 ,  B33Y10/00 ,  B33Y30/00 ,  B29C64/20

CPC classification number: B29C64/106 ,  B29C64/20 ,  B29C70/70 ,  B33Y10/00 ,  B33Y30/00

Abstract: Methods, systems, and devices for the manufacture of 3D printed components with structurally integrated metal objects using an additive manufacturing system enhanced with a range of possible secondary embedding processes. One or more layers of a three-dimensional substrate can be created by depositing a substrate, and then one or more 3D printed components can be configured on the substrate with one or more metal objects using additive manufacturing enhanced by one or more secondary embedding processes.

公开(公告)号：US20170359896A1

公开(公告)日：2017-12-14

申请号：US15618256

申请日：2017-06-09

Applicant: Board of Regents, The University of Texas System

Inventor： Chi Yen Kim ,  Ryan Wicker ,  Eric MacDonald ,  David Espalin

IPC: H05K1/11 ,  H01R12/57 ,  H05K3/40 ,  H05K3/10

CPC classification number: H05K1/113 ,  H05K3/103 ,  H05K3/381 ,  H05K3/4015 ,  H05K3/4046 ,  H05K2201/0355 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10303 ,  H05K2203/0228 ,  H05K2203/0271 ,  H05K2203/1105 ,  H05K2203/1189 ,  H05K2203/1446

Abstract: A 3D printed circuit apparatus includes a 3D printed circuit having a surface layer and one or more wires embedded under the surface layer, and a conductive metal pin that is cut to a desired length and inserted into the 3D printed circuit in order to attain contact with the wire or wires embedded under the surface layer.