公开(公告)号：US09850160B2

公开(公告)日：2017-12-26

申请号：US14529520

申请日：2014-10-31

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Helmut Schillinger ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/02 ,  C03B17/06 ,  B23K26/40 ,  B23K26/53

CPC classification number: C03B33/0222 ,  B23K26/0622 ,  B23K26/40 ,  B23K26/53 ,  B23K26/57 ,  B23K2103/172 ,  B23K2103/50 ,  C03B17/064 ,  C03B25/087 ,  C03B29/10 ,  C03B33/0215 ,  C03B33/07 ,  C03B33/091 ,  Y02P40/57 ,  Y10T428/24777 ,  Y10T428/249921

Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (

公开(公告)号：US09701564B2

公开(公告)日：2017-07-11

申请号：US14794378

申请日：2015-07-08

Applicant: Corning Incorporated

Inventor： Dana Craig Bookbinder ,  Lewis Kirk Klingensmith ,  Stephan Lvovich Logunov ,  Albert Roth Nieber ,  Helmut Schillinger ,  Pushkar Tandon ,  Sergio Tsuda

IPC: C03B33/06 ,  C03B17/04 ,  C03B33/09 ,  C03B33/10 ,  C03B33/02 ,  C03B9/12 ,  C03B33/095 ,  B23K103/00

CPC classification number: C03B33/06 ,  B23K2103/54 ,  C03B9/12 ,  C03B33/0222 ,  C03B33/095 ,  C03B33/0955

Abstract: Embodiments of the present method of laser cutting a laser wavelength transparent glass article comprises feeding at least one glass article to a pulsed laser assembly having at least one pulsed laser, wherein the pulsed laser defines a laser beam focal line with a length of 0.1-100 mm, the glass article being comprised of two end sections, and at least one lateral surface disposed lengthwise between the end sections. The method further comprises laser cutting at least one perforation line onto the lateral surface of the glass article while there is relative motion between the glass article and the pulsed laser and separating the glass article along the at least one perforation line to yield a laser cut glass article.

公开(公告)号：US20170100801A1

公开(公告)日：2017-04-13

申请号：US15285773

申请日：2016-10-05

Applicant: CORNING INCORPORATED

Inventor： Alejandro Antonio Becker ,  Tobias Christian Roeder ,  Helmut Schillinger ,  Ralf J. Terbrueggen

IPC: B23K26/402 ,  B26F3/06 ,  B26F3/00 ,  B23K26/364 ,  B23K26/142

CPC classification number: B23K26/402 ,  B23K26/0624 ,  B23K26/0738 ,  B23K26/082 ,  B23K26/142 ,  B23K26/18 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/34 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/54 ,  B26F3/002 ,  B26F3/06 ,  C03B33/074 ,  C03B33/091 ,  C03C17/32 ,  C03C2218/328

Abstract: A method for laser preparation of a coated substrate to be laser cut is provided. The method includes substantially removing a target portion of a polymer coating from a coated substrate by directing an ablative laser beam to the target portion, wherein the target portion of the polymer coating has a width of between about 10 μm and about 6.0 mm.

公开(公告)号：US20160009586A1

公开(公告)日：2016-01-14

申请号：US14794378

申请日：2015-07-08

Applicant: Corning Incorporated

Inventor： Dana Craig Bookbinder ,  Lewis Kirk Klingensmith ,  Stephan Lvovich Logunov ,  Albert Roth Nieber ,  Helmut Schillinger ,  Pushkar Tandon ,  Sergio Tsuda

IPC: C03B33/06 ,  C03B33/09 ,  C03B33/10 ,  C03B17/04

CPC classification number: C03B33/06 ,  B23K2103/54 ,  C03B9/12 ,  C03B33/0222 ,  C03B33/095 ,  C03B33/0955

Abstract: Embodiments of the present method of laser cutting a laser wavelength transparent glass article comprises feeding at least one glass article to a pulsed laser assembly having at least one pulsed laser, wherein the pulsed laser defines a laser beam focal line with a length of 0.1-100 mm, the glass article being comprised of two end sections, and at least one lateral surface disposed lengthwise between the end sections. The method further comprises laser cutting at least one perforation line onto the lateral surface of the glass article while there is relative motion between the glass article and the pulsed laser and separating the glass article along the at least one perforation line to yield a laser cut glass article.

Abstract translation: 激光切割激光波长透明玻璃制品的本方法的实施例包括将至少一个玻璃制品馈送到具有至少一个脉冲激光的脉冲激光组件，其中脉冲激光器限定长度为0.1-100的激光束焦线 mm，所述玻璃制品由两个端部部分组成，以及纵向设置在所述端部之间的至少一个侧面。 该方法还包括将玻璃制品的侧表面上的至少一个穿孔线激光切割，同时在玻璃制品和脉冲激光器之间存在相对运动并沿着至少一个穿孔线分离玻璃制品以产生激光切割玻璃 文章。

公开(公告)号：US20150232369A1

公开(公告)日：2015-08-20

申请号：US14529520

申请日：2014-10-31

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Helmut Schillinger ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/02

CPC classification number: C03B33/0222 ,  B23K26/0622 ,  B23K26/40 ,  B23K26/53 ,  B23K26/57 ,  B23K2103/172 ,  B23K2103/50 ,  C03B17/064 ,  C03B25/087 ,  C03B29/10 ,  C03B33/0215 ,  C03B33/07 ,  C03B33/091 ,  Y02P40/57 ,  Y10T428/24777 ,  Y10T428/249921

Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (

Abstract translation: 本发明涉及用于切割和分离透明材料薄基板的激光切割技术，例如切割主要用于制造薄膜晶体管（TFT）器件的显示玻璃组合物。 所描述的激光工艺可以用于例如以> 1m / sec的速度进行直线切割，以切割尖锐的半径外角（<1mm），并且产生包括形成内部孔和狭槽的任意弯曲形状。 激光加工碱土硼硅铝酸盐玻璃复合工件的方法包括将脉冲激光束聚焦到焦线中。 焦线被引导到玻璃复合工件中，在材料内产生诱导吸收。 工件和激光束相对于彼此平移以沿着轮廓形成多条缺陷线，其中相邻的缺陷线具有0.1-20微米的间隔。