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    METHODS FOR FORMING THIN FILM TRANSISTORS ON A GLASS SUBSTRATE AND LIQUID CRYSTAL DISPLAYS FORMED THEREFROM
    11.
    发明申请
    METHODS FOR FORMING THIN FILM TRANSISTORS ON A GLASS SUBSTRATE AND LIQUID CRYSTAL DISPLAYS FORMED THEREFROM 有权

    公开(公告)号：US20210018780A1

    公开(公告)日：2021-01-21

    申请号：US17040073

    申请日：2019-03-26

    Applicant: CORNING INCORPORATED

    Inventor： Ming-Huang Huang ,  Robert Bumju Lee ,  Rajesh Vaddi ,  Bin Zhu

    IPC: G02F1/1368 ,  H01L29/786

    Abstract: A thin film transistor (TFT) liquid crystal display (LCD) comprises a plurality of image pixels demarcated between an overlying liquid crystal display layer and an underlying glass substrate. Each image pixel comprises a dedicated top-gate TFT disposed over the glass substrate. Each top-gate thin film transistor comprises a process sensitive semiconductor layer disposed over the glass substrate, and a source electrode and a drain electrode disposed over the process sensitive semiconductor layer. The process sensitive semiconductor layer forms a process sensitive semiconductor active layer between the source electrode and the drain electrode and an active layer protection film is disposed over the process sensitive semiconductor active layer. A gate dielectric layer is disposed over the active layer protection film between the source electrode and the drain electrode and a gate electrode is disposed over the gate dielectric layer.

    HERMETICALLY SEALED PACKAGE
    12.
    发明申请
    HERMETICALLY SEALED PACKAGE 审中-公开

    公开(公告)号：US20200051883A1

    公开(公告)日：2020-02-13

    申请号：US16529229

    申请日：2019-08-01

    Applicant: Corning Incorporated

    Inventor： Ming-Huang Huang ,  Hoon Kim ,  Xu Ouyang

    IPC: H01L23/31 ,  H01L21/56 ,  H01L21/768 ,  H01L21/02 ,  H01L23/498 ,  B81B7/00

    Abstract: An electrical component package includes a glass substrate, an interposer panel positioned on the glass substrate, the interposer panel comprising a device cavity, a wafer positioned on the interposer panel such that the device cavity is enclosed by the glass substrate, the interposer panel, and the wafer. The electrical component package further includes a metal seed layer disposed between the interposer panel and the wafer, and a dielectric coating. The dielectric coating hermetically seals the interposer panel to the glass substrate, the interposer panel to the metal seed layer and the wafer, and the interposer panel hermetically seals the metal seed layer to the glass substrate such that the device cavity is hermetically sealed from ambient atmosphere.

    THROUGH-SUBSTRATE LASER PATTERNING AND ISOLATING OF THIN CONDUCTIVE FILMS
    17.
    发明申请
    THROUGH-SUBSTRATE LASER PATTERNING AND ISOLATING OF THIN CONDUCTIVE FILMS 有权

    公开(公告)号：US20210070653A1

    公开(公告)日：2021-03-11

    申请号：US16961800

    申请日：2019-01-16

    Applicant: CORNING INCORPORATED ,  VIEW, INC.

    Inventor： James Gregory Couillard ,  Ming-Huang Huang ,  Xinghua Li

    IPC: C03C17/34 ,  G02F1/155

    Abstract: An invention disclosure discloses a composite structure. The composite structure includes a substrate layer (120), a conductive layer (140) and an overlayer (160). The substrate has a first face (124) and a second face (122). The conductive layer has a first face (148) and a second face (149). The first face of the conductive layer is disposed on the at least a part of the second face of the substrate layer. A portion (144) of the conductive layer has a resistivity at least about ten times higher than an adjacent region (146) on the conductive layer. The overlayer may have a first face (162) and a second face (166). The first face of the overlayer is disposed on at least a part of the second face of the conductive layer such that the conductive layer is disposed between the overlayer and the substrate layer. The substrate layer comprises a material that is optically transparent over at least a part of the electromagnetic spectrum from about 180 nm to about 20 μm. The conductive layer comprises a layer having a thickness of about 10 nm or greater and having a resistivity of about 10 Ohm-cm or less. The conductive layer comprises a material that may be optically translucent or opaque over at least a part of the electromagnetic spectrum from about 180 nm to about 20 μm.

    PARTICLE REDUCTION DURING SPUTTERING DEPOSITION
    19.
    发明申请
    PARTICLE REDUCTION DURING SPUTTERING DEPOSITION 审中-公开

    公开(公告)号：US20190284681A1

    公开(公告)日：2019-09-19

    申请号：US16348708

    申请日：2017-11-09

    Applicant: CORNING INCORPORATED

    Inventor： James Gregory Couillard ,  Ming-Huang Huang

    IPC: C23C14/50 ,  C23C14/56 ,  C03C17/00

    Abstract: Described herein are apparatuses and methods for holding a substrate in a position that minimizes particle contamination of the substrate when the substrate is being coated. Along with the apparatus, processes for reducing particle reduction on substrates are provided. The articles and processes described herein are useful in making coated glass substrates, such as used in electrochromic, photochromic, or photovoltaic technologies.

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