公开(公告)号：US20140117386A1

公开(公告)日：2014-05-01

申请号：US13833272

申请日：2013-03-15

Applicant: Cree, Inc.

Inventor： Fabian Rol ,  Eric Tarsa ,  Bernd Keller ,  Theodore D. Lowes ,  David T. Emerson

IPC: H01L33/58 ,  H01L33/08

CPC classification number: H01L33/08 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/54 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present disclosure is directed to LED components, and systems using such components, having a light emission profile that may be controlled independently of the lens shape by varying the position and/or orientation of LED chips with respect to one or both of an overlying lens and the surface of the component. For example, the optical centers of the LED emitting surface and the lens, which are normally aligned, may be offset from each other to generate a controlled and predictable emission profile. The LED chips may be positioned to provide a peak emission shifted from a perpendicular centerline of the lens base. The use of offset emitters allows for LED components with shifted or tilted emission patterns, without causing output at high angles of the components. This is beneficial as it allows a lighting system to have tilted emission from the LED component and primary optics.

Abstract translation: 本公开涉及LED组件和使用这种组件的系统，其具有可以通过改变LED芯片相对于上覆透镜中的一个或两个的位置和/或取向而独立于透镜形状的光发射分布 和组件的表面。 例如，通常对齐的LED发射表面和透镜的光学中心可以彼此偏移以产生受控且可预测的发射谱。 LED芯片可以被定位成提供从透镜基座的垂直中心线偏移的峰值发射。 偏移发射器的使用允许具有偏移或倾斜发射图案的LED组件，而不会在组件的高角度产生输出。 这是有益的，因为它允许照明系统具有来自LED组件和主要光学器件的倾斜发射。

公开(公告)号：US20160348000A1

公开(公告)日：2016-12-01

申请号：US15234433

申请日：2016-08-11

Applicant: Cree, Inc.

Inventor： Brian T. Collins ,  Christopher P. Hussell ,  David T. Emerson ,  Ronan P. Le Toquin

IPC: C09K11/77 ,  C09K11/02 ,  C04B35/597 ,  C09K11/08

CPC classification number: C09K11/7734 ,  C04B35/58 ,  C04B35/581 ,  C04B35/584 ,  C04B35/591 ,  C04B35/593 ,  C04B35/5935 ,  C04B35/597 ,  C04B2235/3224 ,  C04B2235/3852 ,  C04B2235/3865 ,  C04B2235/3869 ,  C04B2235/3873 ,  C04B2235/445 ,  C09K11/025 ,  C09K11/0883 ,  C09K11/7728

Abstract: A method is disclosed for forming a blended phosphor composition. The method includes the steps of firing precursor compositions that include europium and nitrides of at least calcium, strontium and aluminum, in a refractory metal crucible and in the presence of a gas that precludes the formation of nitride compositions between the nitride starting materials and the refractory metal that forms the crucible. The resulting compositions can include phosphors that convert frequencies in the blue portion of the visible spectrum into frequencies in the red portion of the visible spectrum.

Abstract translation: 公开了一种形成混合荧光粉组合物的方法。 该方法包括以下步骤：在耐火金属坩埚中，并且在气体存在下，将包含至少钙，锶和铝的铕和氮化物的前体组合物焙烧，以防止在氮化物起始材料和耐火材料之间形成氮化物组合物 形成坩埚的金属。 所得组合物可以包括将可见光谱的蓝色部分中的频率转换成可见光谱的红色部分中的频率的磷光体。

公开(公告)号：US20150048393A1

公开(公告)日：2015-02-19

申请号：US14531350

申请日：2014-11-03

Applicant: CREE, INC

Inventor： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

IPC: H01L33/62 ,  H01L33/58 ,  H01L33/48 ,  H01L25/075

CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  Y10T29/49002 ,  H01L2924/00014

Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

Abstract translation: 描述了高密度多芯片LED器件。 本发明的实施例提供了具有相对较高效率和小尺寸的光输出的高密度多芯片LED器件。 LED装置包括多个互连的LED芯片和诸如透镜的光学元件。 LED芯片可以分为两组，其中每组中的LED芯片并联连接，并且串联连接。 在一些实施例中，LED装置包括可由陶瓷制成的底座。 底座可以包括连接母线和与芯片接合的半圆形区域。 引线键可以连接到LED芯片，使得所有的引线键都布置在一组LED芯片的外部以最小化光吸收。

公开(公告)号：US20140097453A1

公开(公告)日：2014-04-10

申请号：US14043494

申请日：2013-10-01

Applicant: CREE, INC.

Inventor： Christopher P. Hussell ,  Peter Scott Andrews ,  Jesse Colin Reiherzer ,  David T. Emerson

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate, one or more LEDs disposed over the substrate, and the LEDs can include electrical connectors for connecting to an electrical element. A light emitting device can further include a retention material disposed over the substrate and the retention material can be disposed over at least a portion of the electrical connectors. The LEDs can be connected in a pattern that is non-linear.

Abstract translation: 公开了用于发光二极管（LED）的发光器件。 在一个实施例中，发光器件可以包括衬底，设置在衬底上的一个或多个LED，并且LED可以包括用于连接到电气元件的电连接器。 发光器件还可以包括设置在衬底上的保持材料，并且保持材料可以设置在至少一部分电连接器上。 LED可以以非线性的方式连接。