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公开(公告)号：US20190203117A1
公开(公告)日：2019-07-04
申请号：US16296818
申请日：2019-03-08
Applicant: Cree, Inc.
Inventor： Brian T. Collins , Christopher P. Hussell , David T. Emerson , Ronan P. Le Toquin
IPC: C09K11/77 , C04B35/597 , C04B35/581 , C04B35/584 , C09K11/08 , C09K11/02 , C04B35/58
CPC classification number: C09K11/7734 , C04B35/58 , C04B35/581 , C04B35/584 , C04B35/591 , C04B35/593 , C04B35/5935 , C04B35/597 , C04B2235/3224 , C04B2235/3852 , C04B2235/3865 , C04B2235/3869 , C04B2235/3873 , C04B2235/445 , C09K11/025 , C09K11/0883 , C09K11/7728
Abstract: A method is disclosed for forming a blended phosphor composition. The method includes the steps of firing precursor compositions that include europium and nitrides of at least calcium, strontium and aluminum, in a refractory metal crucible and in the presence of a gas that precludes the formation of nitride compositions between the nitride starting materials and the refractory metal that forms the crucible. The resulting compositions can include phosphors that convert frequencies in the blue portion of the visible spectrum into frequencies in the red portion of the visible spectrum.
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公开(公告)号：US09786811B2
公开(公告)日：2017-10-10
申请号：US13833272
申请日：2013-03-15
Applicant: Cree, Inc.
Inventor： Fabian Rol , Eric Tarsa , Bernd Keller , Theodore D. Lowes , David T. Emerson
CPC classification number: H01L33/08 , H01L25/0753 , H01L33/20 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2924/00
Abstract: The present disclosure is directed to LED components, and systems using such components, having a light emission profile that may be controlled independently of the lens shape by varying the position and/or orientation of LED chips with respect to one or both of an overlying lens and the surface of the component. For example, the optical centers of the LED emitting surface and the lens, which are normally aligned, may be offset from each other to generate a controlled and predictable emission profile. The LED chips may be positioned to provide a peak emission shifted from a perpendicular centerline of the lens base. The use of offset emitters allows for LED components with shifted or tilted emission patterns, without causing output at high angles of the components. This is beneficial as it allows a lighting system to have tilted emission from the LED component and primary optics.
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公开(公告)号：US09203004B2
公开(公告)日：2015-12-01
申请号：US14043494
申请日：2013-10-01
Applicant: Cree, Inc.
IPC: H01L33/40 , H01L33/62 , H01L25/075 , H01L25/16 , H01L33/52
CPC classification number: H01L33/62 , H01L25/0753 , H01L25/167 , H01L33/52 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate, one or more LEDs disposed over the substrate, and the LEDs can include electrical connectors for connecting to an electrical element. A light emitting device can further include a retention material disposed over the substrate and the retention material can be disposed over at least a portion of the electrical connectors. The LEDs can be connected in a pattern that is non-linear.
Abstract translation: 公开了用于发光二极管（LED）的发光器件。 在一个实施例中，发光器件可以包括衬底，设置在衬底上的一个或多个LED，并且LED可以包括用于连接到电气元件的电连接器。 发光器件还可以包括设置在衬底上的保持材料，并且保持材料可以设置在至少一部分电连接器上。 LED可以以非线性的方式连接。
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公开(公告)号：US20140217434A1
公开(公告)日：2014-08-07
申请号：US14174559
申请日：2014-02-06
Applicant: Cree, Inc.
Inventor： Christopher P. Hussell , David T. Emerson , Jeffrey Carl Britt
CPC classification number: H01L27/153 , H01L25/0753 , H01L25/167 , H01L33/08 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/49113 , H01L2924/12032 , Y10T29/49117 , H01L2924/00014 , H01L2924/00
Abstract: Light emitting devices and methods such as light emitting diodes (LEDs) are disclosed for use in higher voltage applications. Variable arrangements of LEDs are disclosed herein. Arrangements can include one or more LED chips connected in series, parallel, and/or a combination thereof. LED chips can be disposed in a package body having at least one thermal element and one or more electrical components.
Abstract translation: 公开了用于较高电压应用的发光器件和诸如发光二极管（LED）的方法。 这里公开了LED的可变布置。 布置可以包括串联，并联和/或其组合的一个或多个LED芯片。 LED芯片可以设置在具有至少一个热元件和一个或多个电气部件的封装主体中。
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公开(公告)号：US09209354B2
公开(公告)日：2015-12-08
申请号：US14148102
申请日：2014-01-06
Applicant: Cree, Inc.
CPC classification number: H01L33/08 , H01L25/0753 , H01L25/167 , H01L33/52 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/01322 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed.
Abstract translation: 公开了用于发光二极管（LED）的发光器件。 在一个实施例中，发光器件可以包括衬底和布置在图案化阵列上的衬底上的多个发光二极管（LED）。 阵列可以包括一个或多个LED图案。 发光器件还可以包括围绕LED阵列设置的保持材料。 在一个方面，可以分配保留材料。
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Patent Agency Ranking
公开(公告)号：US20130322070A1
公开(公告)日：2013-12-05
申请号：US13713410
申请日：2012-12-13
Applicant: CREE, INC.
Inventor： Joseph G. Clark , Amber C. Abare , David T. Emerson , Jeremy S. Nevins , Raymond Rosado
CPC classification number: H01L33/58 , F21K9/233 , F21V7/00 , F21V21/00 , F21Y2105/18 , F21Y2115/10 , H01L25/0753 , H01L33/50 , H01L33/54 , H01L2224/48091 , H01L2924/00014
Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.
Abstract translation: 公开了具有改进性能的光发射器封装，系统和方法。 在一个方面，光发射器封装可以包括可以包括阳极和阴极的底座。 第一光发射器芯片可以安装在阴极的至少一部分上，并且第二发光芯片可以被引线接合到阳极的至少一部分。 多个光发射器芯片可以设置在第一和第二发光器芯片之间。
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公开(公告)号：US10767111B2
公开(公告)日：2020-09-08
申请号：US16296818
申请日：2019-03-08
Applicant: Cree, Inc.
Inventor： Brian T. Collins , Christopher P. Hussell , David T. Emerson , Ronan P. Le Toquin
IPC: C04B35/58 , C04B35/581 , C04B35/584 , C04B35/591 , C04B35/593 , C04B35/597 , C09K11/02 , C09K11/08 , C09K11/77
Abstract: A method is disclosed for forming a blended phosphor composition. The method includes the steps of firing precursor compositions that include europium and nitrides of at least calcium, strontium and aluminum, in a refractory metal crucible and in the presence of a gas that precludes the formation of nitride compositions between the nitride starting materials and the refractory metal that forms the crucible. The resulting compositions can include phosphors that convert frequencies in the blue portion of the visible spectrum into frequencies in the red portion of the visible spectrum.
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公开(公告)号：US10266767B2
公开(公告)日：2019-04-23
申请号：US15234433
申请日：2016-08-11
Applicant: Cree, Inc.
Inventor： Brian T. Collins , Christopher P. Hussell , David T. Emerson , Ronan P. Le Toquin
IPC: C09K11/77 , C09K11/02 , C04B35/597 , C09K11/08 , C04B35/58 , C04B35/581 , C04B35/584 , C04B35/591 , C04B35/593
Abstract: A method is disclosed for forming a blended phosphor composition. The method includes the steps of firing precursor compositions that include europium and nitrides of at least calcium, strontium and aluminum, in a refractory metal crucible and in the presence of a gas that precludes the formation of nitride compositions between the nitride starting materials and the refractory metal that forms the crucible. The resulting compositions can include phosphors that convert frequencies in the blue portion of the visible spectrum into frequencies in the red portion of the visible spectrum.
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公开(公告)号：US09349929B2
公开(公告)日：2016-05-24
申请号：US13713410
申请日：2012-12-13
Applicant: CREE, Inc.
Inventor： Joseph G. Clark , Amber C. Abare , David T. Emerson , Jeremy S. Nevins , Raymond Rosado , Michael Bergmann
IPC: H01L33/58 , F21V21/00 , H01L33/50 , F21V7/00 , H01L25/075 , H01L33/54 , F21K99/00 , F21Y101/02 , F21Y105/00
CPC classification number: H01L33/58 , F21K9/233 , F21V7/00 , F21V21/00 , F21Y2105/18 , F21Y2115/10 , H01L25/0753 , H01L33/50 , H01L33/54 , H01L2224/48091 , H01L2924/00014
Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.
Abstract translation: 公开了具有改进性能的光发射器封装，系统和方法。 在一个方面，光发射器封装可以包括可以包括阳极和阴极的底座。 第一光发射器芯片可以安装在阴极的至少一部分上，并且第二发光芯片可以被引线接合到阳极的至少一部分。 多个光发射器芯片可以设置在第一和第二发光器芯片之间。
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公开(公告)号：US20140183577A1
公开(公告)日：2014-07-03
申请号：US14148102
申请日：2014-01-06
Applicant: Cree, Inc.
CPC classification number: H01L33/08 , H01L25/0753 , H01L25/167 , H01L33/52 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/01322 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed.
Abstract translation: 公开了用于发光二极管（LED）的发光器件。 在一个实施例中，发光器件可以包括衬底和布置在图案化阵列上的衬底上的多个发光二极管（LED）。 阵列可以包括一个或多个LED图案。 发光器件还可以包括围绕LED阵列设置的保持材料。 在一个方面，可以分配保留材料。
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