公开(公告)号：US07529089B2

公开(公告)日：2009-05-05

申请号：US11847667

申请日：2007-08-30

Applicant: Chia-Chun Cheng

Inventor： Chia-Chun Cheng

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H01L23/427 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat-dissipating device includes a MOSFET heat dissipator, a south bridge heat dissipator, a north bridge heat dissipator and a water block connector. A heat pipe is provided between each heat dissipator to connect these heat dissipators in series. Further, the north bridge heat dissipator has a heat-dissipating bottom plate and a heat-dissipating body attached to a half portion of the heat-dissipating bottom plate. Further, the water block connector comprises a hollow base and two connecting tubes that are provided on two locations of the base and in communication with each other. The base of the water block connector is attached to the other half portion of the heat-dissipating bottom plate of the north bridge heat dissipater. When the water cooling is used, the two connecting tubes of the water block connector can be connected in series with a water-cooling circulation system.

Abstract translation: 散热装置包括MOSFET散热器，南桥散热器，北桥散热器和水阻塞连接器。 在每个散热器之间设置一个热管，以将这些散热器串联连接。 此外，北桥散热器具有散热底板和安装在散热底板的一半部分上的散热体。 此外，水封连接器包括中空基座和设置在基座的两个位置并彼此连通的两个连接管。 水封连接器的底座连接到北桥散热器的散热底板的另一半部分。 当使用水冷时，水封连接器的两个连接管可以与水冷循环系统串联连接。

公开(公告)号：US07468885B2

公开(公告)日：2008-12-23

申请号：US11748563

申请日：2007-05-15

Applicant: Chia-Chun Cheng

Inventor： Chia-Chun Cheng

IPC: H05K7/20 ,  H01L23/36

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cooling device for interface card for cooling a heating component on an interface card includes a heat sink and a water cooling head, wherein the heat sink has a heat conducting seat and a plurality of cooling fins. A cooling flow path is formed between any two adjacent cooling fins. In addition, the water block is attached onto the plural cooling fins of the heat sink. Thereby, the operational heat, generated from the heating element, is firstly absorbed by the heat-conducting seat and is then distributed uniformly cross to the plural fins. In addition to the heat dissipation proceeded between the fins and the ambient air, the operational heat is further conducted to the water block, undergoing a heat exchange with the coolant flowing in the water block, and thus a desired cooling effectiveness is achieved.

Abstract translation: 用于冷却接口卡上的加热部件的接口卡的冷却装置包括散热器和水冷却头，其中散热器具有导热座和多个散热片。 在任何两个相邻的散热片之间形成冷却流路。 此外，水块附着在散热片的多个散热片上。 由此，由加热元件产生的工作热量首先被导热座吸收，然后均匀地分布在多个散热片上。 除了翅片和环境空气之间的散热之外，操作热量进一步传导到水块，与水块中流动的冷却剂进行热交换，从而实现期望的冷却效果。

公开(公告)号：US07440278B2

公开(公告)日：2008-10-21

申请号：US11399333

申请日：2006-04-07

Applicant: Chia-Chun Cheng

Inventor： Chia-Chun Cheng

IPC: H05K7/20 ,  F28D15/00 ,  H05K1/00 ,  H01L23/34

CPC classification number: H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  F28F2275/085 ,  G06F1/20 ,  G06F2200/201 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A water-cooling heat dissipator mounted on an electronic heat-generating element includes a water-cooling head member and at least one heat pipe. The water-cooling head member includes a first cover and a second cover connected to the first cover. Both ends of the first cover and the second cover are formed with a receiving portion corresponding to each other, respectively. The receiving portions are adapted to be connected to the conduit connectors. A channel portion is formed between the first cover and the second cover for receiving one end of the heat pipe. With the above arrangement, the present invention can perform the heat dissipations of different heat-generating elements simultaneously to make the heat-generating elements operate under acceptable working temperatures. Further, the present invention can be widely used in the heat dissipation of compact electronic products.

Abstract translation: 安装在电子发热元件上的水冷散热器包括水冷头部件和至少一个热管。 水冷头部件包括第一盖和连接到第一盖的第二盖。 第一盖和第二盖的两端分别形成有彼此对应的接收部。 接收部分适于连接到导管连接器。 通道部分形成在第一盖和第二盖之间，用于接收热管的一端。 通过上述结构，本发明可以同时进行不同的发热元件的散热，使得发热元件在可接受的工作温度下工作。 此外，本发明可广泛用于紧凑型电子产品的散热。

公开(公告)号：US06503333B2

公开(公告)日：2003-01-07

申请号：US09726628

申请日：2000-11-30

Applicant: Jih-Churng Twu ,  Rong-Hui Kao ,  Chia-Chun Cheng

Inventor： Jih-Churng Twu ,  Rong-Hui Kao ,  Chia-Chun Cheng

IPC: C23G102

CPC classification number: H01L21/67028 ,  B08B3/08 ,  B08B2203/005 ,  Y10S134/902

Abstract: A method for cleaning a silicon wafer by a wet bench method with improved cleaning efficiency and without oxide formation is disclosed. In the method, the wafer may first be cleaned in a first cleaning solution that includes a base or an acid, and then the wafer is rinsed in a second solution that includes DI water and ozone. The ozone concentration in the DI water may be between about 1 ppm and about 20 ppm, and preferably between about 3 ppm and about 10 ppm. A diluted HF cleaning step may be utilized after the ozone/DI water rinsing step to remove any possible oxide formation on the silicon surface before a final rinsing step and drying step.

公开(公告)号：US5704986A

公开(公告)日：1998-01-06

申请号：US529635

申请日：1995-09-18

Applicant: Chien-Fong Chen ,  Chia-Chun Cheng ,  Chi-Fu Chang ,  Kuo-Sheng Chuang

Inventor： Chien-Fong Chen ,  Chia-Chun Cheng ,  Chi-Fu Chang ,  Kuo-Sheng Chuang

IPC: B08B7/00 ,  C23C16/02 ,  G03F7/42 ,  H01L21/02 ,  H01L21/28 ,  H01L21/306 ,  H01L21/311 ,  H01L21/316 ,  B08B5/00

CPC classification number: H01L21/02054 ,  B08B7/00 ,  C23C16/0236 ,  G03F7/42 ,  H01L21/02238 ,  H01L21/02255 ,  H01L21/02301 ,  H01L21/28185 ,  H01L21/28211 ,  H01L21/31133 ,  H01L21/31675

Abstract: A method for cleaning a semiconductor substrate. Introduced into a semiconductor substrate processing chamber is a semiconductor substrate. The semiconductor substrate and the semiconductor substrate processing chamber are maintained at a temperature not exceeding about 800 degrees centigrade. Introduced substantially simultaneously with the semiconductor substrate into the semiconductor substrate processing chamber is a low flow of a first oxidant gas. Introduced into the semiconductor substrate processing chamber immediately subsequent to the low flow of the first oxidant gas is a high flow of a second oxidant gas. Introduced into the semiconductor wafer processing chamber no earlier than the high flow of the second oxidant gas is a flow of a chlorine containing getter material. The semiconductor substrate is exposed to the high flow of the second oxidant gas and the flow of the chlorine containing getter material at a temperature not exceeding 800 degrees centigrade for a time period sufficient to remove organic contaminant residues and metal ion contaminant residues from the surface of the semiconductor substrate.

Abstract translation: 一种清洗半导体衬底的方法。 引入到半导体衬底处理室中的是半导体衬底。 半导体衬底和半导体衬底处理室保持在不超过约800摄氏度的温度。 与半导体基板基本上同时引入到半导体基板处理室中的是第一氧化剂气体的低流量。 在第一氧化剂气体的低流量之后立即引入到半导体衬底处理室中是高流量的第二氧化剂气体。 不迟于第二氧化剂气体的高流量而引入到半导体晶片处理室中是含氯吸气材料的流动。 将半导体衬底暴露于第二氧化剂气体的高流量和含氯吸气材料的流动温度不超过800摄氏度的时间内足以从有机污染物残留物和金属离子污染物残留物的表面去除 半导体衬底。

公开(公告)号：US11578649B2

公开(公告)日：2023-02-14

申请号：US17585708

申请日：2022-01-27

Applicant: Chia-Chun Cheng

Inventor： Chia-Chun Cheng

IPC: F02B75/24 ,  F02M35/10 ,  F01L1/14 ,  F01L1/047

Abstract: The disclosure relates to a charging system, which includes a crankshaft chamber, two cylinder chambers, a crankshaft connecting rod mechanism, two pistons, an intake pipe, two draft tubes, and a rotating rod control mechanism. The crankshaft connecting rod mechanism is installed in the crankshaft chamber. Each piston is received in the cylinder chambers and connected with the crankshaft connecting rod mechanism. The intake pipe only communicates with the crankshaft chamber. One end of each draft tube only communicates with the crankshaft chamber and another end only communicates with each cylinder chamber. The check valve is installed in the crankshaft chamber. The rotating rod control mechanism includes a rotating rod and a sealing block fixedly connected and rotating with the rotating rod. The sealing block blocks and seals a joint between the crankshaft chamber and each draft tube.

公开(公告)号：US08485698B2

公开(公告)日：2013-07-16

申请号：US13281430

申请日：2011-10-26

Applicant: Chia-Chun Cheng ,  Lei-Lei Liu

Inventor： Chia-Chun Cheng ,  Lei-Lei Liu

IPC: F21V29/00 ,  F21V29/02 ,  F28D15/02

CPC classification number: F21V29/51 ,  F21V29/713 ,  F21V29/763 ,  F21Y2105/00 ,  F28D15/0266 ,  F28D15/0275 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipating module includes a first heat conducting plate, a second heat conducting plate and at least one heat pipe. The second heat conducting plate is disposed opposite to the first heat conducting plate. Each of the at least one heat pipe includes a first fixing portion, a first curved portion, a second fixing portion, a second curved portion and a connecting portion. The first fixing portion is positioned on the first heat conducting plate and the second fixing portion is positioned on the second heat conducting plate. The first curved portion is curved and extended from the first fixing portion. The second curved portion is curved and extended from the second fixing portion. The connecting portion is connected between the first curved portion and the second curved portion. At least parts of the first curved portion and at least parts of the second curved portion are not coplanar.

Abstract translation: 散热模块包括第一导热板，第二导热板和至少一个热管。 第二导热板与第一导热板相对设置。 所述至少一个热管中的每一个包括第一固定部分，第一弯曲部分，第二固定部分，第二弯曲部分和连接部分。 第一固定部位于第一导热板上，第二固定部位于第二导热板上。 第一弯曲部分从第一固定部分弯曲并延伸。 第二弯曲部分从第二固定部分弯曲并延伸。 连接部分连接在第一弯曲部分和第二弯曲部分之间。 第一弯曲部分的至少部分和第二弯曲部分的至少部分不共面。

公开(公告)号：US20090072980A1

公开(公告)日：2009-03-19

申请号：US12219081

申请日：2008-07-16

Applicant: Chia-Chun Cheng

Inventor： Chia-Chun Cheng

IPC: G08B21/00

CPC classification number: G06F1/20

Abstract: The water-cooling heat dissipation alarm system according to the present invention comprises a water-cooling heat dissipation system and an alarm device, in which the water-cooling heat dissipation system is mutually connected to a water block, a heat exchanger, a water tank and a circulation pump through the pipe, wherein the circulation pump outputs a frequency signal being in proportional to the rotation speed thereof. The alarm device is placed in the circulation pump, which receives the frequency signal outputted from the circulation pump and determines action conditions in the water flow and the circulation pump, then performs alarm operation based the determination in order to provide precise system abnormality alarm.

Abstract translation: 根据本发明的水冷散热报警系统包括水冷散热系统和报警装置，其中水冷散热系统相互连接到水块，热交换器，水箱 以及通过所述管的循环泵，其中所述循环泵输出与其转速成比例的频率信号。 报警装置放置在循环泵中，其接收从循环泵输出的频率信号，并确定水流和循环泵的动作条件，然后根据确定进行报警操作，以提供精确的系统异常报警。

公开(公告)号：US07414846B2

公开(公告)日：2008-08-19

申请号：US11748561

申请日：2007-05-15

Applicant: Chia-Chun Cheng

Inventor： Chia-Chun Cheng

IPC: H05K7/20 ,  H01L23/467

CPC classification number: G06F1/20 ,  G06F2200/201

Abstract: A cooling structure for interface card for cooling the heating component on an interface card includes a heat sink, a metallic hood, and a water block, wherein the heat sink has a heat conducting seat and a plurality of cooling fins, while the heat conducting seat is attached to the heating component of the interface card. Furthermore, the metallic hood arranged on the heat sink is connected thereto. Finally, the water block is arranged on the metallic hood; thereby, the operational heat, generated from the heating element, is absorbed by the heat-conducting seat and is then conducted to the fins of the heat sink, so that the operational heat is distributed to the metallic hood by heat conducting process, making the operational heat that is generated by the heating component carried away through the heat exchanging function of the water block, and thus a desired cooling effectiveness is achieved.

Abstract translation: 用于冷却接口卡上的加热部件的接口卡的冷却结构包括散热器，金属罩和水块，其中散热器具有导热座和多个散热片，而导热座 连接到接口卡的加热部件。 此外，布置在散热器上的金属罩连接到其上。 最后，将水块布置在金属罩上; 由此，由加热元件产生的工作热量被导热座吸收，然后被传导到散热片的翅片，从而通过导热过程将工作热量分配到金属罩， 由通过水块的热交换功能携带的加热部件产生的操作热，从而实现期望的冷却效果。

公开(公告)号：US20070287324A1

公开(公告)日：2007-12-13

申请号：US11806859

申请日：2007-06-05

Applicant: Phon-Quan Lee ,  Chia-Chun Cheng

Inventor： Phon-Quan Lee ,  Chia-Chun Cheng

IPC: H01R4/26

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A water block includes a first casing, a solder paste, and a second casing. The first casing has a solder reserve area formed on an outer edge thereof. The solder paste is coated on the solder reserve area. The second casing is jointed with the first casing via the solder past to form a channel space. The present invention uses tin solder as a soldering material, so that the soldering temperature is between 200° C. and 400° C. Hence, the present invention avoids oxygenation and weakened bond strength due to high temperatures. Therefore, when the solder paste melts, the flux separates from the tin solder and bubbles of the tin solder are removed from the solder reserve area at a soldering temperature of between 200˜400° C. Moreover, the bond strength of the joint surface between two casings is increased, so cooling liquids won't easily leak out from the strong joint surface.

Abstract translation: 水块包括第一壳体，焊膏和第二壳体。 第一壳体具有形成在其外边缘上的焊料储备区域。 焊膏涂覆在焊料储备区上。 第二壳体通过焊料与第一壳体接合以形成通道空间。 本发明使用锡焊料作为焊接材料，使得焊接温度在200℃至400℃之间。因此，本发明避免了由于高温导致的氧合和弱键合强度。 因此，当焊膏熔化时，焊剂与锡焊料分离，锡焊料的气泡在200〜400℃的焊接温度下从焊料保留区域除去。此外，焊料表面的接合强度 两个壳体增加，因此冷却液体不会容易从强关节表面泄漏出来。