Drive circuit, driving method therefor, and display device

    公开(公告)号:US11341919B2

    公开(公告)日:2022-05-24

    申请号:US17287536

    申请日:2020-08-31

    摘要: Disclosed are a drive circuit, a driving method therefor, and a display device. The drive circuit is configured to drive a device to be driven to work; the drive circuit and said device are connected in series between a first working voltage end (VL1) and a second working voltage end (VL2); the drive circuit is configured to control formation of a current path between the first working voltage end (VL1) and the second working voltage end (VL2); the drive circuit comprises a drive sub-circuit, a writing sub-circuit, a compensation sub-circuit, and a gray-scale control sub-circuit, wherein the compensation sub-circuit is separately connected to the first working voltage end (VL1), a first scan signal end (G_A), a first node (N1), and a third node (N3) and is configured to compensate for the first node (N1) under control of the first scan signal end (G_A) and the first working voltage end (VL1).

    Chip bonding method and bonding device

    公开(公告)号:US11239198B2

    公开(公告)日:2022-02-01

    申请号:US16830834

    申请日:2020-03-26

    IPC分类号: H01L23/00 H01L25/18 H01L25/00

    摘要: A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.

    Array substrate and methods of manufacturing and driving the same

    公开(公告)号:US10452190B2

    公开(公告)日:2019-10-22

    申请号:US15484259

    申请日:2017-04-11

    摘要: Embodiments of the present disclosure relate to the field of display technologies, and particularly, to an array substrate and methods of manufacturing and driving the same. With the embodiments of the present disclosure, undesirable phenomenon, e.g. color mixing and so on is avoid in a display device having the array substrate while simplifying the manufacture process of the array substrate. The array substrate comprises a substrate, thin-film transistors, pixel electrodes and a common electrode on the substrate, a plurality of leading wires and a color filter layer; wherein the common electrode comprises a plurality of common electrode blocks reusable as self-capacitance electrodes, and each of the leading wires has one end electrically connected to one of the common electrode blocks and the other end electrically connected to a touch integrated circuit. The array substrate according to the embodiments of the present disclosure is used in the display device.