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11.发明授权公开(公告)号：US09575266B2
公开(公告)日：2017-02-21
申请号：US14687119
申请日：2015-04-15
Applicant: Cisco Technology, Inc.
Inventor： Kishor Desai , Ravinder Kachru , Vipulkumar Patel , Bipin Dama , Kalpendu Shastri , Soham Pathak
IPC: G02B6/12 , G02B6/42 , H01L33/52 , G02B6/43 , H01L23/04 , H01L23/48 , H01L25/16 , H01L31/0203 , G02B6/13 , H05K1/02 , H01L21/50
CPC classification number: G02B6/4255 , G02B6/12 , G02B6/13 , G02B6/4201 , G02B6/4257 , G02B6/4292 , G02B6/43 , H01L21/50 , H01L23/04 , H01L23/48 , H01L25/167 , H01L31/0203 , H01L33/52 , H01L2924/15311 , H01L2924/16152 , H01L2924/1616 , H01L2924/165 , H01L2924/16788 , H05K1/0268 , H05K1/0274 , H05K2201/10121 , H01L2924/0105 , H01L2924/01079
Abstract: An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.
Abstract translation: 提供了一种光电子组件，其包括用于支撑多个互连的光学和电气部件的基板（通常为硅或玻璃）。 设置一层密封材料以概述衬底的限定的周边区域。 将模制的玻璃盖设置在基底上并结合到基底上，其中模制的玻璃盖构造成产生与限定的基底周边区域匹配的覆盖区。 模制玻璃盖的底表面包括一层接合材料，其在接触时接触基底的密封材料层，形成结合组件。 在一种形式中，提出了一种晶片级组装工艺，其中多个光电组件设置在硅晶片上，并且多个玻璃盖被模制在一片玻璃中，然后将其粘合到硅晶片上。
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公开(公告)号：US09261652B2
公开(公告)日：2016-02-16
申请号：US13742483
申请日：2013-01-16
Applicant: Cisco Technology, Inc.
Inventor： John Fangman , Vipulkumar Patel , Ravinder Kachru
CPC classification number: G02B6/36 , B32B37/1292 , G02B6/32 , G02B6/4204 , G02B6/4214 , G02B6/4239 , G02B6/4244 , G02B6/4246
Abstract: An opto-electronic apparatus comprises a substrate for supporting a plurality of components forming an opto-electronic assembly and an optical component attached to the substrate with an adhesive material, such as a solder or epoxy. The optical component is formed to include a plurality of bond slots disposed in parallel across at least a portion of the bottom surface of the optical component, the plurality of bond slots providing a path for a liquid adhesive material and improving the ability to displace the liquid adhesive material as the component is pressed into the surface of the substrate during the attachment process.
Abstract translation: 光电设备包括用于支撑形成光电组件的多个部件的基板和用粘合剂材料（例如焊料或环氧树脂）附接到基板的光学部件。 光学部件被形成为包括平行地布置在光学部件的底表面的至少一部分上的多个接合槽，多个接合槽提供用于液体粘合剂材料的路径并且提高了使液体移位的能力 作为组分的粘合剂材料在附着过程中被压入基材的表面。
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公开(公告)号：US09213152B2
公开(公告)日：2015-12-15
申请号：US13737029
申请日：2013-01-09
Applicant: Cisco Technology, Inc.
Inventor： Kalpendu Shastri , Soham Pathak , John Fangman , Vipulkumar Patel , Kishor Desai , Ravinder Kachru
CPC classification number: G02B6/42 , G02B6/12 , G02B6/3886 , G02B6/4214 , G02B6/4259 , G02B6/4292 , Y10T29/49155
Abstract: An apparatus for providing releasable attachment between a fiber connector and an opto-electronic assembly, the opto-electronic assembly utilizing an interposer substrate to support a plurality of opto-electronic components that generates optical output signals and receives optical input signals. An enclosure is used to cover the interposer substrate and includes a transparent region through which the optical output and input signals pass unimpeded. A magnetic connector component is attached to the lid and positioned to surround the transparent region, with a fiber connector for supporting one or more optical fibers magnetically attached to the connector component by virtue of a metallic component contained in the fiber connector. This arrangement provides releasable attachment of the fiber connector to the enclosure in a manner where the optical output and input signals align with the optical fibers in the connector.
Abstract translation: 一种用于在光纤连接器和光电子组件之间提供可释放附件的装置，所述光电组件利用插入器基板来支撑产生光输出信号并接收光输入信号的多个光电元件。 外壳用于覆盖插入器基板，并且包括透明区域，光输出和输入信号通过该透明区域畅通无阻。 磁性连接器部件附接到盖子并且被定位成围绕透明区域，光纤连接器用于通过光纤连接器中包含的金属部件来支撑一个或多个磁性地附接到连接器部件的光纤。 这种布置以光输出和输入信号与连接器中的光纤对准的方式提供光纤连接器到外壳的可释放附接。
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公开(公告)号：US09557499B2
公开(公告)日：2017-01-31
申请号：US15045540
申请日：2016-02-17
Applicant: Cisco Technology, Inc.
Inventor： Ravinder Kachru , Chris Togami , Kishor Desai
IPC: G02B6/42 , G02B6/32 , G02B7/00 , H04B10/25 , H04B10/516
CPC classification number: G02B6/4226 , G02B6/32 , G02B6/42 , G02B6/4206 , G02B6/4214 , G02B7/005 , H04B10/2503 , H04B10/516
Abstract: Techniques for coupling light from a waveguide array to a single mode fiber array are described. In an embodiment, lateral misalignment of an array of focusing lenses and an array of optical fiber ferrules held into alignment by a lens holder sub-assembly is compensated by tilting the lens holder sub-assembly with respect to the propagation axis of the light being coupled by the lens holder-subassembly. Since the amount of tilt can be adjusted according to the degree of lateral misalignment, lens holder sub-assemblies manufactured with varying degrees of misalignment may be utilized to couple light into single mode fiber-optic cable. In addition, the same technique can also be used to compensate for other defects as well, such as angular errors in manufacturing or placement of a turning mirror or prism used to direct light into the lens holder sub-assembly.
Abstract translation: 描述了将光从波导阵列耦合到单模光纤阵列的技术。 在一个实施例中，聚焦透镜阵列的横向偏移和由透镜保持器子组件保持对准的光纤套圈阵列通过相对于被耦合的光的传播轴倾斜透镜保持器子组件来补偿 通过镜头架子组件。 由于可以根据横向偏移的程度来调节倾斜量，所以可以利用以不同程度的不对准制造的透镜保持器子组件将光耦合到单模光纤电缆中。 此外，也可以使用相同的技术来补偿其他缺陷，例如用于将光引导到透镜保持器子组件中的转向镜或棱镜的制造或放置中的角度误差。
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公开(公告)号：US09476763B2
公开(公告)日：2016-10-25
申请号：US14155927
申请日：2014-01-15
Applicant: Cisco Technology, Inc.
Inventor： Ravinder Kachru , Stefan Martin Pfnuer , Pangchen Sun
IPC: G01J1/04
CPC classification number: G01J1/0425 , G02B6/12019 , G02B6/4207 , G02B6/4214 , G02B6/4274 , H01L2224/48091 , H01L2224/73265 , Y10T29/41 , H01L2924/00014
Abstract: An apparatus is provided in which a photodiode supported on a planar light wave circuit assembly and arranged such that a photosensitive portion of the photodiode is aligned along an optical path from the output of the planar light wave circuit to the photodiode of the planar light wave circuit assembly. The photodiode is arranged such that a spot size of light output from the planar light wave circuit is incident on the photosensitive portion such that an optical signal transmitted by the light output is converted to an electric signal by the photodiode. A mounting structure is arranged between the planar light wave circuit assembly and the photodiode in order to support the photodiode on the planar light wave circuit assembly. The optical path of the light output from the planar light wave circuit does not contain any refractive optical elements.
Abstract translation: 提供一种装置，其中支撑在平面光波电路组件上的光电二极管被布置成使得光电二极管的感光部分沿着从平面光波电路的输出到平面光波电路的光电二极管的光路对准 部件。 光电二极管被布置成使得从平面光波电路输出的光的光斑尺寸入射到感光部分上，使得由光输出传输的光信号被光电二极管转换成电信号。 在平面光波电路组件和光电二极管之间设置安装结构，以便在平面光波电路组件上支撑光电二极管。 从平面光波电路输出的光的光路不包含任何折射光学元件。
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Patent Agency Ranking
公开(公告)号：US09417413B2
公开(公告)日：2016-08-16
申请号：US14255107
申请日：2014-04-17
Applicant: Cisco Technology, Inc.
Inventor： Stefan Pfnuer , Pangchen Sun , Matt Traverso , Ravinder Kachru
CPC classification number: G02B6/428 , G02B6/4214 , G02B6/4215 , G02B6/4248 , G02B6/4257 , H04B10/2504
Abstract: An optical assembly package is provided for the optical receive components of an optical transceiver. The optical assembly package includes a receptacle subassembly configured to receive an end of an optical fiber. A housing is provided having an opening at one end configured to receive the receptacle assembly. Optical routing and wavelength demultiplexing elements are mounted to a bottom wall of the housing. An electrical subassembly comprising a support plate, a circuit board mounted on the support plate, an integrated circuit mounted to the circuit board, and a plurality of photodetectors mounted to the support plate proximate an edge of the circuit board. The electrical subassembly is positioned a stacked arrangement beneath the housing to minimize an overall length of the optical assembly package.
Abstract translation: 为光收发器的光接收部件提供光学组件封装。 光学组件封装包括构造成接收光纤端部的插座子组件。 提供了一个壳体，其一端具有一开口，构造成容纳该插座组件。 光路由和波长解复用元件安装到壳体的底壁。 一种电气子组件，包括支撑板，安装在支撑板上的电路板，安装到电路板的集成电路以及安装到靠近电路板边缘的支撑板的多个光电检测器。 电子组件被定位在壳体下面的堆叠布置以最小化光学组件封装的总长度。
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公开(公告)号：US09417412B2
公开(公告)日：2016-08-16
申请号：US14339921
申请日：2014-07-24
Applicant: Cisco Technology, Inc.
Inventor： Kalpendu Shastri , Ravinder Kachru , Kishor Desai
CPC classification number: G02B6/423 , G01B11/14 , G02B6/4239 , G02B6/4249
Abstract: An arrangement for providing passive alignment of optical components on a common substrate uses a set of reference cavities, where each optical device is positioned within a separate reference cavity. The reference cavities are formed to have a predetermined depth, with perimeters slightly larger than the footprint of their associated optical components. The reference cavity includes at least one right-angle corner that is used as a registration corner against which a right-angle corner of an associated optical component is positioned. The placement of each optical component in its own reference cavity allows for passive optical alignment to be achieved by placing each component against its predefined registration corner.
Abstract translation: 用于在公共衬底上提供光学部件的被动对准的装置使用一组参考腔，其中每个光学装置定位在单独的参考腔内。 参考空腔形成为具有预定深度，其周长稍大于其相关联的光学部件的覆盖区。 参考腔包括至少一个直角角，其被用作相关联的光学部件的直角角位于其上的配准角。 每个光学部件在其自己的参考腔中的放置允许通过将每个部件放置在其预定义的配准角上来实现无源光学对准。
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公开(公告)号：US09274290B2
公开(公告)日：2016-03-01
申请号：US13715962
申请日：2012-12-14
Applicant: Cisco Technology, Inc.
Inventor： Ravinder Kachru , Chris Togami , Kishor Desai
CPC classification number: G02B6/4226 , G02B6/32 , G02B6/42 , G02B6/4206 , G02B6/4214 , G02B7/005 , H04B10/2503 , H04B10/516
Abstract: Techniques for coupling light from a waveguide array to a single mode fiber array are described. In an embodiment, lateral misalignment of an array of focusing lenses and an array of optical fiber ferrules held into alignment by a lens holder sub-assembly is compensated by tilting the lens holder sub-assembly with respect to the propagation axis of the light being coupled by the lens holder-subassembly. Since the amount of tilt can be adjusted according to the degree of lateral misalignment, lens holder sub-assemblies manufactured with varying degrees of misalignment may be utilized to couple light into single mode fiber-optic cable. In addition, the same technique can also be used to compensate for other defects as well, such as angular errors in manufacturing or placement of a turning mirror or prism used to direct light into the lens holder sub-assembly.
Abstract translation: 描述了将光从波导阵列耦合到单模光纤阵列的技术。 在一个实施例中，聚焦透镜阵列的横向偏移和由透镜保持器子组件保持对准的光纤套圈阵列通过相对于被耦合的光的传播轴倾斜透镜保持器子组件来补偿 通过镜头架子组件。 由于可以根据横向偏移的程度来调节倾斜量，所以可以利用以不同程度的不对准制造的透镜保持器子组件将光耦合到单模光纤电缆中。 此外，也可以使用相同的技术来补偿其他缺陷，例如用于将光引导到透镜保持器子组件中的转向镜或棱镜的制造或放置中的角度误差。
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19.发明申请公开(公告)号：US20150277068A1
公开(公告)日：2015-10-01
申请号：US14687119
申请日：2015-04-15
Applicant: Cisco Technology, Inc.
Inventor： Kishor DESAI , Ravinder Kachru , Vipulkumar Patel , Bipin Dama , Kalpendu Shastri , Soham Pathak
CPC classification number: G02B6/4255 , G02B6/12 , G02B6/13 , G02B6/4201 , G02B6/4257 , G02B6/4292 , G02B6/43 , H01L21/50 , H01L23/04 , H01L23/48 , H01L25/167 , H01L31/0203 , H01L33/52 , H01L2924/15311 , H01L2924/16152 , H01L2924/1616 , H01L2924/165 , H01L2924/16788 , H05K1/0268 , H05K1/0274 , H05K2201/10121 , H01L2924/0105 , H01L2924/01079
Abstract: An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.
Abstract translation: 提供了一种光电子组件，其包括用于支撑多个互连的光学和电气部件的基板（通常为硅或玻璃）。 设置一层密封材料以概述衬底的限定的周边区域。 将模制的玻璃盖设置在基底上并结合到基底上，其中模制的玻璃盖构造成产生与限定的基底周边区域匹配的覆盖区。 模制玻璃盖的底表面包括一层接合材料，其在接触时接触基底的密封材料层，形成结合组件。 在一种形式中，提出了一种晶片级组装工艺，其中多个光电组件设置在硅晶片上，并且多个玻璃盖被模制在一片玻璃中，然后将其粘合到硅晶片上。
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公开(公告)号：US20150198478A1
公开(公告)日：2015-07-16
申请号：US14155927
申请日：2014-01-15
Applicant: Cisco Technology, Inc.
Inventor： Ravinder Kachru , Stefan Martin Pfnuer , Pangchen Sun
IPC: G01J1/04
CPC classification number: G01J1/0425 , G02B6/12019 , G02B6/4207 , G02B6/4214 , G02B6/4274 , H01L2224/48091 , H01L2224/73265 , Y10T29/41 , H01L2924/00014
Abstract: An apparatus is provided in which a photodiode supported on a planar light wave circuit assembly and arranged such that a photosensitive portion of the photodiode is aligned along an optical path from the output of the planar light wave circuit to the photodiode of the planar light wave circuit assembly. The photodiode is arranged such that a spot size of light output from the planar light wave circuit is incident on the photosensitive portion such that an optical signal transmitted by the light output is converted to an electric signal by the photodiode. A mounting structure is arranged between the planar light wave circuit assembly and the photodiode in order to support the photodiode on the planar light wave circuit assembly. The optical path of the light output from the planar light wave circuit does not contain any refractive optical elements.
Abstract translation: 提供一种装置，其中支撑在平面光波电路组件上的光电二极管被布置成使得光电二极管的感光部分沿着从平面光波电路的输出到平面光波电路的光电二极管的光路对准 部件。 光电二极管被布置成使得从平面光波电路输出的光的光斑尺寸入射到感光部分上，使得由光输出传输的光信号被光电二极管转换成电信号。 在平面光波电路组件和光电二极管之间设置安装结构，以便在平面光波电路组件上支撑光电二极管。 从平面光波形电路输出的光的光路不包含任何折射光学元件。
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