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    SURFACE MOUNT TYPE PIEZOELECTRIC OSCILLATOR
    13.
    发明申请
    SURFACE MOUNT TYPE PIEZOELECTRIC OSCILLATOR 有权
    表面安装型压电振荡器

    公开(公告)号：US20150015341A1

    公开(公告)日：2015-01-15

    申请号：US14381117

    申请日：2013-01-08

    Applicant: Daishinku Corporation

    Inventor： Takuya Kojo

    IPC: H01L41/047

    CPC classification number: H01L41/047 ,  H01L41/0475 ,  H01L41/053 ,  H01L41/0913 ,  H01L2224/16225 ,  H01L2924/16195 ,  H03B5/32 ,  H03B2200/002 ,  H03B2200/0026 ,  H03H9/02086 ,  H03H9/0519 ,  H03H9/0523 ,  H03H9/0547 ,  H03H9/0552 ,  H03H9/10 ,  H03H9/1021 ,  H03H9/19

    Abstract: A piezoelectric oscillator has an insulating base having a housing portion where internal terminal pads are formed, an integrated circuit (IC) element having rectangular pads bonded to the internal terminal (IT) pads, and a piezoelectric oscillation element (POE) connected to the base and IC element. The IT pads include two opposing first IT pads connected to the POE, two opposing second IT pads, one of which is for AC output, and two opposing third IT pads formed between the first IT pads and the second IT pads. Along a part of perimeter of the first IT pads, the third IT pads and wiring patterns which respectively extend the third IT pads are formed as conductive paths for blocking radiation noise. The first IT pads and the second IT pads are spaced apart with the conductive paths interposed therebetween.

    Abstract translation: 压电振子具有绝缘基座，其具有形成有内部端子焊盘的壳体部分，具有与内部端子（IT）焊盘接合的矩形焊盘的集成电路（IC）元件，以及连接到基座的压电振荡元件（POE） 和IC元件。 IT焊盘包括连接到POE的两个相对的第一IT焊盘，两个相对的第二IT焊盘，其中一个用于AC输出，以及形成在第一IT焊盘和第二IT焊盘之间的两个相对的第三IT焊盘。 沿着第一IT垫的周边的一部分，分别延伸第三IT焊盘的第三IT焊盘和布线图形被形成为用于阻挡辐射噪声的导电路径。 第一IT焊盘和第二IT焊盘间隔开导电路径。

    Oven-controlled crystal oscillator
    14.
    发明授权
    Oven-controlled crystal oscillator 有权

    公开(公告)号：US12283919B2

    公开(公告)日：2025-04-22

    申请号：US18278424

    申请日：2022-02-28

    Applicant: DAISHINKU CORPORATION

    Inventor： Takuya Kojo

    IPC: H03B5/36 ,  H03B5/04

    Abstract: One or more embodiments of the disclosure may be an oven-controlled crystal oscillator that may include a core section hermetically encapsulated inside a thermal insulation package. The core section includes at least: an oscillation IC; a crystal resonator; and a heater IC. The core section is mounted on a core substrate that is mechanically connected to the package by a non-conductive adhesive. The core section and the package are electrically connected to each other by wire bonding. A space is provided between the core substrate and a bottom surface of the package.

    Oven-controlled crystal oscillator
    15.
    发明授权
    Oven-controlled crystal oscillator 有权

    公开(公告)号：US12249956B2

    公开(公告)日：2025-03-11

    申请号：US18271580

    申请日：2022-02-21

    Applicant: DAISHINKU CORPORATION

    Inventor： Takuya Kojo

    IPC: H03B5/04 ,  H03B5/32 ,  H03H9/05 ,  H03H9/08

    Abstract: An OCXO according to one or more embodiments may include a core section hermetically encapsulated in a heat insulation package. The core section includes: an oscillation IC; a crystal resonator; and a heater IC. The core section is supported by the package via a core substrate. The OCXO further includes a capacitor as an electronic component for adjustment, which is attached to the package by soldering. The core section is vacuum-sealed in a sealed space of the package, while the capacitor is disposed in a space other than the sealed space.

    Piezoelectric resonator device
    17.
    发明授权
    Piezoelectric resonator device 有权

    公开(公告)号：US10771037B2

    公开(公告)日：2020-09-08

    申请号：US15561037

    申请日：2016-02-05

    Applicant: Daishinku Corporation

    Inventor： Takuya Kojo ,  Satoru Ishino

    IPC: H03H9/02 ,  H01L23/04 ,  H03H9/05 ,  H03H9/10 ,  H01L41/047 ,  H01L41/316 ,  H01L41/319 ,  H03H9/17

    Abstract: A piezoelectric resonator device having a sandwich structure is provided, which is stably bonded to an external element. In the piezoelectric resonator device 1, at least a vibrating part 21 of a piezoelectric substrate 2 is sealed by a first sealing member 3 and a second sealing member 4. The piezoelectric substrate 2 includes: the vibrating part 21; and an external frame part 23 that is thicker than the vibrating part 21 and that surrounds the outer periphery of the vibrating part 21. External electrodes 31 to be connected to an external element 5 are provided on at least one of the first sealing member 3 and the second sealing member 4. The external element 5 is connected to the external electrodes 31 at least on the external frame part 23 of the piezoelectric substrate 2.

    Piezoelectric resonator device and system-in-package module including the same
    19.
    发明授权
    Piezoelectric resonator device and system-in-package module including the same 有权

    公开(公告)号：US11637544B2

    公开(公告)日：2023-04-25

    申请号：US16339714

    申请日：2017-11-21

    Applicant: Daishinku Corporation

    Inventor： Takuya Kojo

    IPC: H03H9/05 ,  H03H9/02 ,  H10N30/071 ,  H03H9/17 ,  H01L25/00 ,  H01L23/04 ,  H03B5/32

    Abstract: A crystal oscillator (101) includes: a piezoelectric resonator plate (2) on which a first excitation electrode and a second excitation electrode are formed; a first sealing member (3) covering the first excitation electrode of the piezoelectric resonator plate (2); a second sealing member (4) covering the second excitation electrode of the piezoelectric resonator plate (2); and an internal space (13) formed by bonding the first sealing member (3) to the piezoelectric resonator plate (2) and by bonding the second sealing member (4) to the piezoelectric resonator plate (2), so as to hermetically seal a vibrating part including the first excitation electrode and the second excitation electrode of the piezoelectric resonator plate (2). An electrode pattern (371) including a mounting pad for wire bonding is formed on an outer surface (first main surface (311)) of the first sealing member (3).

    Crystal resonator device
    20.
    发明授权
    Crystal resonator device 有权

    公开(公告)号：US11342899B2

    公开(公告)日：2022-05-24

    申请号：US16348492

    申请日：2017-10-30

    Applicant: Daishinku Corporation

    Inventor： Takuya Kojo

    IPC: H03H9/10 ,  H03H9/02 ,  H03H9/05 ,  H03H9/19 ,  H01L23/02 ,  H01L23/08 ,  H03B5/36

    Abstract: In a crystal oscillator, a crystal resonator and an IC chip are hermetically sealed in a package. The crystal resonator includes: a crystal resonator plate including a first excitation electrode formed on a first main surface, and a second excitation electrode, which makes a pair with the first excitation electrode, formed on a second main surface; a first sealing member covering the first excitation electrode of the crystal resonator plate; and a second sealing member covering the second excitation electrode of the crystal resonator plate. A vibrating part including the first excitation electrode and the second excitation electrode of the crystal resonator plate is hermetically sealed by bonding the first sealing member to the crystal resonator plate, and the second sealing member to the crystal resonator plate.

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