公开(公告)号：US20220153583A1

公开(公告)日：2022-05-19

申请号：US17441263

申请日：2020-03-25

Applicant: DENKA COMPANY LIMITED

Inventor： Go TAKEDA ,  Takaaki TANAKA

IPC: C01B21/064 ,  C08K3/38 ,  C08L63/00

Abstract: The present invention relates to aggregated boron nitride particles including hexagonal boron nitride primary particles aggregated, including a spacer type coupling agent. The thermally conductive resin composition of the present invention includes the aggregated boron nitride particles of the present invention. The heat dissipation member of the present invention includes the thermally conductive resin composition of the present invention. According to the present invention, aggregated boron nitride particles that can suppress the formation of voids in a heat dissipation member produced by mixing with a resin, a thermally conductive resin composition including the aggregated boron nitride particles, and a heat dissipation member using the thermally conductive resin composition can be provided.

公开(公告)号：US20210163288A1

公开(公告)日：2021-06-03

申请号：US17265841

申请日：2019-08-06

Applicant: DENKA COMPANY LIMITED

Inventor： Go TAKEDA ,  Masao TSUICHIHARA ,  Yoshitaka TANIGUCHI

IPC: C01B21/064

Abstract: A hexagonal boron powder having a purity of 98% by mass or more and a specific surface area of less than 2.0 m2/g.

公开(公告)号：US20230399264A1

公开(公告)日：2023-12-14

申请号：US18246811

申请日：2021-09-27

Applicant: Denka Company Limited

Inventor： Go TAKEDA ,  Hiroyuki SHIOTSUKI ,  Takaaki TANAKA

IPC: C04B35/583 ,  C04B35/626

CPC classification number: C04B35/583 ,  C04B35/62645 ,  C04B2235/5409 ,  C04B2235/5436 ,  C04B2235/386

Abstract: One aspect of the present disclosure provides a boron nitride powder containing agglomerated particles formed by agglomeration of primary particles of hexagonal boron nitride, in which a degree of purity is 98.5% by mass or more, and a number of particles containing carbon is 10 or less per 10 g of the boron nitride powder.

公开(公告)号：US20230357007A1

公开(公告)日：2023-11-09

申请号：US18246145

申请日：2021-09-27

Applicant: Denka Company Limited

Inventor： Go TAKEDA ,  Hiroyuki SHIOTSUKI ,  Takaaki TANAKA

IPC: C01B21/064

CPC classification number: C01B21/0648 ,  C01P2004/50 ,  C01P2006/80 ,  C01P2006/42 ,  C01P2004/61 ,  C01P2006/12

Abstract: One aspect of the present disclosure provides a boron nitride powder containing agglomerated particles formed by agglomeration of primary particles of hexagonal boron nitride, in which a degree of purity is 98.5% by mass or more, and a number of particles having a magnetizing ability is 10 or less per 10 g of the boron nitride powder.

公开(公告)号：US20220154059A1

公开(公告)日：2022-05-19

申请号：US17441266

申请日：2020-03-25

Applicant: DENKA COMPANY LIMITED

Inventor： Go TAKEDA ,  Takaaki TANAKA

IPC: C09K5/14 ,  C01B21/064 ,  C08K3/38

Abstract: The present invention relates to aggregated boron nitride particles including hexagonal boron nitride primary particles aggregated, having a specific surface area measured by the BET method of 2 to 6 m2/g and a crushing strength of 5 MPa or more. The thermally conductive resin composition of the present invention includes the aggregated boron nitride particles of the present invention. The heat dissipation member of the present invention includes the thermally conductive resin composition of the present invention. According to the present invention, aggregated boron nitride particles that can suppress the formation of voids in a heat dissipation member and can improve the insulation breakdown characteristics and the thermal conductivity of a heat dissipation member, a thermally conductive resin composition including the aggregated boron nitride particles, and a heat dissipation member using the thermally conductive resin composition can be provided.

公开(公告)号：US20210261413A1

公开(公告)日：2021-08-26

申请号：US17252920

申请日：2019-06-27

Applicant: DENKA COMPANY LIMITED

Inventor： Go TAKEDA ,  Yoshitaka TANIGUCHI

IPC: C01B21/064 ,  C08K3/38 ,  C09K5/14

Abstract: An aspect of the present disclosure provides aggregate boron nitride particles in which primary hexagonal boron nitride particles are aggregated, wherein an average value of an area proportion of the primary particles in a cross section is 45% or more, a standard deviation of the area proportion of the primary particles in a cross section is less than 25, and a crushing strength is 8.0 MPa or more.

公开(公告)号：US20200048091A1

公开(公告)日：2020-02-13

申请号：US16343574

申请日：2017-08-31

Applicant: DENKA COMPANY LIMITED

Inventor： Go TAKEDA ,  Yoshitaka TANIGUCHI ,  Takemi OGUMA

IPC: C01B21/064 ,  C08L101/00 ,  C08K3/38 ,  C08K9/04

Abstract: The present invention provides a spherical boron nitride fine powder and the other superior in filling property into resin. The present invention relates to a spherical boron nitride fine powder having the following characteristics (A) to (C): (A) the spherical boron nitride fine particles have any one or more of Si, Ti, Zr, Ce, Al, Mg, Ge, Ga, and V in an amount of 0.1 atm % or more and 3.0 atm % or less in its composition on the surface of 10 nm; (B) the spherical boron nitride fine powder has an average particle diameter of 0.05 μm or more and 1 μm or less; and (C) the spherical boron nitride fine powder has an average circularity of 0.8 or more.

公开(公告)号：US20180230352A1

公开(公告)日：2018-08-16

申请号：US15750369

申请日：2016-08-25

Applicant: DENKA COMPANY LIMITED

Inventor： Go TAKEDA

IPC: C09K5/14 ,  C08K3/38 ,  C08K7/18 ,  H05K7/20

CPC classification number: C09K5/14 ,  C08K3/38 ,  C08K7/18 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/014 ,  C08L101/00 ,  H01L23/3731 ,  H01L23/3737 ,  H05K7/2039 ,  C08L83/04

Abstract: A heat dissipation member having excellent thermal conductivity and dielectric breakdown characteristics is able to be achieved by using a thermally conductive resin composition according to the present invention. A thermally conductive resin composition which is characterized in that: the blending ratio of a spherical boron nitride fine powder having an average particle diameter of 0.05-1.0 μm, an average circularity of 0.80 or more and a purity of boron nitride of 96% by mass or more to a boron nitride coarse powder having an average particle diameter of 20-85 μm and a graphitization index of 1.5-4.0 is from 5:95 to 40:60 in terms of volume ratio; and the total content of the spherical boron nitride fine powder and the boron nitride coarse powder in the resin composition is 40-85% by volume. A heat dissipation sheet which uses this thermally conductive resin composition. A heat dissipation member for electronic components, which uses this thermally conductive resin composition.