公开(公告)号：US20230364969A1

公开(公告)日：2023-11-16

申请号：US18356355

申请日：2023-07-21

Applicant: DENSO CORPORATION

Inventor： Takahiro MAEDA ,  Shota TERACHI ,  Kenshiro MATSUI ,  Takeshi YOSHINORI ,  Shinya KASAMATSU

IPC: B60H1/00 ,  B60H1/14

CPC classification number: B60H1/00921 ,  B60H1/00278 ,  B60H1/143 ,  B60H2001/00928 ,  B60H2001/00307

Abstract: A thermal management system includes refrigeration cycle equipment and a heating medium circuit. The heating medium circuit includes a high-temperature-side circuit connecting with the heating medium channel of the high-temperature-side water-refrigerant heat exchange portion, a low-temperature-side circuit connecting with a heating medium channel of a low-temperature-side water-refrigerant heat exchange portion, and a heat transfer portion connecting the high-temperature-side circuit and the low-temperature-side circuit. The low-temperature-side circuit includes a first heat exchange portion, a second heat exchange portion, a heating medium bypass channel, and a low-temperature-side circuit switching portion. While the heat transfer portion is transferring heat, the low-temperature-side circuit switching portion switches a circuit configuration of the low-temperature-side circuit to a circuit configuration that circulates the heating medium between the first heat exchange portion and the heating medium bypass channel.

公开(公告)号：US20200343603A1

公开(公告)日：2020-10-29

申请号：US16857100

申请日：2020-04-23

Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA ,  DENSO CORPORATION

Inventor： Satoko TOFUKUJI ,  Yusuke SUZUKI ,  Takeshi YOSHINORI ,  Yasumitsu OOMI ,  Kouji MIURA

IPC: H01M10/613 ,  B60K11/02 ,  F28D15/02 ,  H01M10/625 ,  H01M10/6556 ,  H01M10/6569

Abstract: A cooling device includes: an evaporator configured to cool a battery pack by evaporating a heat medium by heat exchange between the battery pack and the heat medium, the battery pack including a plurality of battery cells arranged in an arrangement direction; a condenser disposed above the evaporator and configured to radiate heat of the heat medium to an external fluid by condensing the heat medium by heat exchange between the heat medium and the external fluid; a gas-phase passage configured to guide the heat medium in a gas phase from the evaporator to the condenser; and a liquid-phase passage configured to guide the heat medium in a liquid phase from the condenser to the evaporator, wherein a cooling amount at an end of the evaporator in the arrangement direction is lower than a cooling amount at a center of the evaporator in the arrangement direction.

公开(公告)号：US20200088471A1

公开(公告)日：2020-03-19

申请号：US16692800

申请日：2019-11-22

Applicant: DENSO CORPORATION

Inventor： Yasumitsu OMI ,  Takeshi YOSHINORI ,  Koji MIURA ,  Masayuki TAKEUCHI

IPC: F28D15/02

Abstract: A thermosiphon applied to a moving body includes a condenser and a plurality of coolers. Each of the plurality of coolers includes a first flow channel forming member, a second flow channel forming member, and a third flow channel forming member. The second flow channel forming member defines a refrigerant inlet that is located below a center portion of a supply flow channel defined by the first flow channel forming member in a vertical direction. The plurality of coolers are arranged along a traveling direction of the moving body and the supply flow channel is fluidly connected in series with each other.

公开(公告)号：US20190226767A1

公开(公告)日：2019-07-25

申请号：US16373683

申请日：2019-04-03

Applicant: DENSO CORPORATION

Inventor： Yasumitsu OMI ,  Takeshi YOSHINORI ,  Masayuki TAKEUCHI ,  Koji MIURA

IPC: F28D15/02 ,  H01L23/427 ,  H01L23/46 ,  H05K7/20 ,  F24F11/70 ,  B60H1/00 ,  H01M10/613 ,  H01M10/625

Abstract: A first thermosiphon circuit includes a first evaporator configured to cool a first target device by a latent heat of evaporation of a working fluid that absorbs a heat from the first target device, and a first passage communicating with the first evaporator. A second thermosiphon circuit includes a second evaporator configured to cool a second target device by a latent heat of evaporation of a working fluid that absorbs a heat from the second target device, and a second passage communicating with the second evaporator. A main condenser includes a first heat exchanger provided in the first passage and a second heat exchanger provided in the second passage, and is configured to allow the working fluid flowing through the first heat exchanger, the working fluid flowing through the second heat exchanger, and a predetermined cold energy supply medium to exchange heat with each other.

公开(公告)号：US20190204014A1

公开(公告)日：2019-07-04

申请号：US16326403

申请日：2017-08-02

Applicant: DENSO CORPORATION

Inventor： Takeshi YOSHINORI ,  Takashi YAMANAKA ,  Yoshiki KATO ,  Masayuki TAKEUCHI ,  Koji MIURA ,  Yasumitsu OMI

IPC: F28D15/02 ,  H01M10/613 ,  H01M10/625 ,  H01M10/6556 ,  H01M10/6569 ,  H05K7/20

CPC classification number: F28D15/025 ,  F28D15/02 ,  F28D15/0266 ,  H01M10/613 ,  H01M10/625 ,  H01M10/6556 ,  H01M10/6569 ,  H01M2220/20 ,  H05K7/20 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327

Abstract: An evaporator includes a fluid chamber in which a working fluid flows. A condenser includes a gas-phase portion in which the working fluid evaporated in the evaporator flows and a liquid-phase portion in which the working fluid from the gas-phase portion, condensed by heat exchange with an external medium, flows. A gas-phase passage causes the working fluid evaporated in the evaporator to flow to the condenser. A liquid-phase passage causes the working fluid condensed in the condenser to flow to the evaporator. A bypass passage has one end connected to the liquid-phase portion of the condenser or the liquid-phase passage and another end connected to the gas-phase portion of the condenser or the gas-phase passage. A flow rate of a liquid-phase working fluid per unit volume in the bypass passage is smaller than a flow rate of a liquid-phase working fluid per unit volume in the liquid-phase portion of the condenser or the liquid-phase passage.

公开(公告)号：US20190186843A1

公开(公告)日：2019-06-20

申请号：US16282477

申请日：2019-02-22

Applicant: DENSO CORPORATION

Inventor： Masayuki TAKEUCHI ,  Yasumitsu OMI ,  Takashi YAMANAKA ,  Yoshiki KATO ,  Takeshi YOSHINORI ,  Koji MIURA

IPC: F28D15/06 ,  H01M10/613 ,  H01M10/625 ,  H01M10/63 ,  H01M10/647 ,  H01M10/6556 ,  H01M10/6569 ,  H05K7/20

CPC classification number: F28D15/06 ,  B60H2001/00307 ,  F28D15/02 ,  H01M10/613 ,  H01M10/625 ,  H01M10/63 ,  H01M10/633 ,  H01M10/647 ,  H01M10/652 ,  H01M10/6556 ,  H01M10/6569 ,  H01M2220/20 ,  H05K7/20

Abstract: A device temperature regulator includes a forward passage in which a forward flow passage is formed to cause a working fluid to flow to a heat absorber from a heat radiator, and a backward passage in which a backward flow passage is formed to cause the working fluid to flow to the heat radiator from the heat absorber. In addition, the device temperature regulator includes a bubble generator, which generates a bubble in the working fluid collecting in the heat absorber and having a liquid phase, and a controller that causes the bubble generator to generate the bubble in a precondition is satisfied.