Abstract:
A welded joint comprising an aluminum-based base material comprising an aluminum alloy or pure aluminum and a copper-based base material comprising a copper alloy or pure copper joined by a weld metal portion is provided. The weld metal portion contains copper in ranges of less than 75% by mass and silicon in ranges of less than 13% by mass and has a higher content of copper and silicon than the aluminum-based base material.
Abstract:
Disclosed is an aluminum alloy material for a heat exchanger fin, the aluminum alloy material containing Si: 1.0% to 5.0% by mass, Fe: 0.1% to 2.0% by mass, and Mn: 0.1% to 2.0% by mass with balance being Al and inevitable impurities, wherein 250 pieces/mm2 or more to 7×104 pieces/mm2 or less of Si-based intermetallic compound particles having equivalent circle diameters of 0.5 to 5 μm are present in a cross-section of the aluminum alloy material; and wherein 10 pieces/mm2 or more and 1000 pieces/mm2 or less of the Al—Fe—Mn—Si-based intermetallic compounds having equivalent circle diameters of more than 5 μm are present in a cross-section of the aluminum alloy material. The aluminum alloy material may further contain one or more additive elements of Mg, Cu, Zn, In, Sn, Ti, V, Zr, Cr, Ni, Be, Sr, Bi, Na, and Ca.
Abstract translation:公开了一种热交换器翅片用铝合金材料,含有Si:1.0〜5.0质量%,Fe:0.1〜2.0质量%,Mn:0.1〜2.0质量% Al和不可避免的杂质,其中在铝合金材料的横截面中存在250个/ mm 2以上至7×10 4个/ mm 2以下的具有当量圆直径为0.5至5μm的Si基金属间化合物颗粒; 并且在铝合金材料的截面中存在具有当量圆直径大于5μm的Al-Fe-Mn-Si系金属间化合物的10个/ mm 2以上且1000个/ mm 2以下的金属间化合物。 铝合金材料还可以含有Mg,Cu,Zn,In,Sn,Ti,V,Zr,Cr,Ni,Be,Sr,Bi,Na和Ca中的一种或多种添加元素。
Abstract:
A bonded body made of an aluminum alloy and a copper alloy and obtained by employing the aluminum alloy as one member to be bonded and the copper alloy as the other member to be bonded, the one bonded member and the other bonded member being bonded to each other through metallic connection, wherein the one bonded member is made of comprising an aluminum alloy containing Cu: 3.0 mass % to 8.0 mass % and Si: 0.1 mass % to 10 mass % with balance being Al and unavoidable inevitable impurities, and satisfying the chemical formula: C+2.4×S≧7.8 where C (mass %) is a Cu concentration and S (mass %) is a Si composition concentration is satisfied, and the other bonded member comprises a copper alloy having a higher solidus temperature than the one bonded member. A bonding method for the bonded body is provided.