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30 条记录 (耗时 0.043 秒)

    Guard Ring for Improved Matching
    11.
    发明申请
    Guard Ring for Improved Matching 有权
    护环改善匹配

    公开(公告)号：US20070212873A1

    公开(公告)日：2007-09-13

    申请号：US11748569

    申请日：2007-05-15

    申请人： Daniel Kerr ,  Roscoe Luce ,  Michele Jamison ,  Alan Chen ,  William Russell

    发明人： Daniel Kerr ,  Roscoe Luce ,  Michele Jamison ,  Alan Chen ,  William Russell

    IPC分类号： H01L21/4763

    CPC分类号： H01L21/0271 ,  H01L23/585 ,  H01L2924/0002 ,  Y10S438/942 ,  Y10S438/947 ,  Y10S438/95 ,  H01L2924/00

    摘要： A semiconductor manufacturing method comprises forming a leveling guard ring defining an interior area into which are fabricated one or more devices. In certain embodiments two or more matched devices, such as in a common centroid layout, are fabricated in the interior area. The guard ring is formed on at least one particular layer for a particular processing step. By the guard ring overwhelming the effect of local features' elevation differences, photoresist thereafter applied consequently has a more uniform height across the interior area, resulting in more uniform devices. In some embodiments, a plurality of guard rings enclosing respective arrays of matched devices are arranged over the surface of a semiconductor wafer, spaced apart so as to be not local to one another. Based on the equalizing effect by each of the guard rings, the respective devices arranged in the interior areas are more evenly matched to equivalent devices in far-spaced guard rings. Thus, both local and global matching are achieved.

    摘要翻译： 半导体制造方法包括形成限定内部区域的调平保护环，其中制造了一个或多个装置。 在某些实施例中，在内部区域中制造两个或多个匹配的装置，例如以共同的质心布局。 保护环形成在用于特定加工步骤的至少一个特定层上。 由于保护环压倒了局部特征的高程差异的影响，因此其后应用的光致抗蚀剂在内部区域具有更均匀的高度，导致更均匀的装置。 在一些实施例中，包围匹配装置的相应阵列的多个保护环布置在半导体晶片的表面上，间隔开，以便彼此不是局部的。 基于每个保护环的均衡效应，布置在内部区域中的各个装置与远距离保护环中的等效装置更均匀地匹配。 因此，实现了本地和全局匹配。

    Leveraging real-time communications for device discovery
    13.
    发明申请
    Leveraging real-time communications for device discovery 审中-公开
    利用实时通信进行设备发现

    公开(公告)号：US20060215690A1

    公开(公告)日：2006-09-28

    申请号：US11091612

    申请日：2005-03-28

    申请人： Richard Wilson ,  William Russell

    发明人： Richard Wilson ,  William Russell

    IPC分类号： H04J3/16

    CPC分类号： H04L41/12 ,  H04L29/06027 ,  H04L65/103 ,  H04L65/104

    摘要： A system and method for discovering real-time communication protocol enabled devices comprising discovering at least one real-time communication server, logging onto the at least one real-time communication server, retrieving real-time communication protocol enabled device information from the real-time communication server, and automatically adding the retrieved real-time communication protocol enabled device information to a real-time communication protocol contact collection.

    摘要翻译： 一种用于发现实时通信协议的设备的系统和方法，包括发现至少一个实时通信服务器，登录到所述至少一个实时通信服务器，从实时检索启用的实时设备信息 通信服务器，并将检索到的实时通信协议启用的设备信息自动添加到实时通信协议联系人集合。

    Structure and method for adjusting integrated circuit resistor value
    16.
    发明申请
    Structure and method for adjusting integrated circuit resistor value 有权
    集成电路电阻值调整的结构和方法

    公开(公告)号：US20060087401A1

    公开(公告)日：2006-04-27

    申请号：US10953478

    申请日：2004-09-29

    申请人： Daniel Kerr ,  Roger Key ,  Bradley Albers ,  William Russell ,  Alan Chen

    发明人： Daniel Kerr ,  Roger Key ,  Bradley Albers ,  William Russell ,  Alan Chen

    IPC分类号： H01C1/012

    CPC分类号： H01L23/5228 ,  H01L28/20 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A resistor formed on a material layer of a semiconductor integrated circuit and a method for forming the resistor. The resistor comprises a region of resistive material with a plurality of conductive contacts or plugs in electrical contact with and extending away from the resistive material. A first and a second interconnect line are formed overlying the plugs and in conductive contact with one or more of the plurality of plugs, such that a portion of the resistive material between the first and the second interconnect lines provides a desired resistance. According to a method of the present invention, the plurality of conductive contacts are formed using a first photolithographic mask and the first and the second interconnect lines are formed using a second photolithographic mask. The desired resistance is changed by modifying the first or the second mask such that one or more dimensions of a region of the resistive material between the first and the second interconnect lines is altered.

    摘要翻译： 形成在半导体集成电路的材料层上的电阻器和形成该电阻器的方法。 电阻器包括电阻材料的区域，其具有与电阻材料电接触并远离电阻材料的多个导电触点或插塞。 第一和第二互连线形成在插头上方并与多个插头中的一个或多个导电接触，使得第一和第二互连线之间的电阻材料的一部分提供期望的电阻。 根据本发明的方法，使用第一光刻掩模形成多个导电触点，并且使用第二光刻掩模形成第一和第二布线。 通过修改第一或第二掩模来改变期望的电阻，使得在第一和第二互连线之间的电阻材料的区域的一个或多个维度被改变。

    Structure and method for improved heat conduction for semiconductor devices
    17.
    发明申请
    Structure and method for improved heat conduction for semiconductor devices 有权
    用于半导体器件的热传导的结构和方法

    公开(公告)号：US20050167801A1

    公开(公告)日：2005-08-04

    申请号：US10955238

    申请日：2004-09-30

    申请人： Daniel Kerr ,  Alan Chen ,  Edward Martin ,  Amal Hamad ,  William Russell

    发明人： Daniel Kerr ,  Alan Chen ,  Edward Martin ,  Amal Hamad ,  William Russell

    IPC分类号： H01L23/02 ,  H01L23/367

    CPC分类号： H01L23/3677 ,  H01L2224/48091 ,  H01L2924/01327 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A thermally conductive structure for a semiconductor integrated circuit and a method for making the structure. The structure comprises one or more vertical and/or horizontal thermally conductive elements disposed proximate a device for improving thermal conductivity from the device to a substrate of the integrated circuit. In one embodiment a heat sink is affixed to the integrated circuit for heat flow from the integrated circuit. The method comprises forming openings in material layers overlying the semiconductor substrate, wherein the openings are disposed proximate the device and extend to the substrate. A thermally conductive material is formed in the openings to provide a thermal path from the device to the substrate.

    摘要翻译： 一种用于半导体集成电路的导热结构及其制造方法。 该结构包括一个或多个垂直和/或水平导热元件，其设置在靠近器件的位置，以改善从器件到集成电路的衬底的导热性。 在一个实施例中，散热器固定到集成电路以用于来自集成电路的热流。 该方法包括在覆盖半导体衬底的材料层中形成开口，其中开口设置在器件附近并延伸到衬底。 在开口中形成导热材料以提供从器件到衬底的热路径。

    Internally pocketed zip opening shipping and marketing business communication package for use as a presentation folder
    18.
    发明申请
    Internally pocketed zip opening shipping and marketing business communication package for use as a presentation folder 审中-公开
    内部口袋拉链开放运输和营销业务通讯包用作演示文件夹

    公开(公告)号：US20070114270A1

    公开(公告)日：2007-05-24

    申请号：US11282782

    申请日：2005-11-18

    申请人： William Russell

    发明人： William Russell

    IPC分类号： B65D27/00

    CPC分类号： B65D27/08 ,  B65D27/14 ,  B65D27/34

    摘要： The present invention relates to a presentation folder that may be provided in a unique arrangement such as with a shipping package configuration thereby eliminating the need to provide a separate envelope and business communication piece. The construction is created from a relatively planar paperboard material that can be handled efficiently by courier or delivery companies in a folded or assembled state and which includes at least one and preferably two pockets that are adhered to separate faces of the paperboard blank. The assembly may include other arrangements such as a pocket on one face and a removable printed advertising piece on the other face. The pocketed faces of the paperboard blank are brought into contact with one another and through use of a closure portion, which may include foldable flaps or adhesive coated tabs, the closure portion is used to seal the construction into a parcel delivery configuration.

    摘要翻译： 本发明涉及可以以诸如运送包装配置的独特布置来提供的呈现文件夹，从而消除了提供单独的信封和商务通信件的需要。 该结构由相对平面的纸板材料制成，其可以由折叠或装配状态的快递或运输公司有效地处理，并且包括至少一个并且优选地两个粘附到纸板坯的分离面上的袋。 组件可以包括其他布置，例如一个面上的口袋和另一面上的可移除的印刷广告片。 纸板坯料的袋状表面彼此接触并且通过使用封闭部分，该封闭部分可以包括可折叠的折片或粘合剂涂覆的突片，封闭部分用于将结构密封成包裹递送构造。

    Lubricant system for cold forming, process and composition therefor
    20.
    发明申请
    Lubricant system for cold forming, process and composition therefor 审中-公开
    用于冷成型，加工和组成的润滑系统

    公开(公告)号：US20060060265A1

    公开(公告)日：2006-03-23

    申请号：US11195917

    申请日：2005-08-03

    申请人： Richard Church ,  William Russell ,  Paul Kulongowski ,  Kenneth Hacias

    发明人： Richard Church ,  William Russell ,  Paul Kulongowski ,  Kenneth Hacias

    IPC分类号： C23C22/78

    CPC分类号： C10M129/40 ,  C10M2207/126 ,  C10N2240/405 ,  C10N2240/408 ,  C10N2250/121 ,  C10N2250/14 ,  C10N2280/00 ,  C23C22/13 ,  C23C22/80

    摘要： The invention is directed to a combination of a conditioner bath and a calcium modified zinc phosphating solution optionally containing hydroxylamine which provide an improved phosphate coating on the surface of ferrous metal articles. In a preferred embodiment, the treatment process further comprises coating the workpiece with a second lubricant. The three treatments work together to provide finer grained phosphate coatings, longer life of the second lubricant bath and improved adherence of the second lubricant, as compared to a similar phosphating bath that is used alone or with a similar second lubricant.

    摘要翻译： 本发明涉及一种调理剂浴和任选含有羟胺的钙改性锌磷酸盐溶液的组合，其在黑色金属制品的表面上提供改进的磷酸盐涂层。 在优选实施例中，处理过程还包括用第二润滑剂涂覆工件。 与单独使用或类似的第二润滑剂使用的类似的磷酸盐浴相比，这三种处理方式一起工作以提供更细粒度的磷酸盐涂层，延长第二润滑剂的使用寿命并提高第二润滑剂的粘附性。