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公开(公告)号：US20120049980A1
公开(公告)日：2012-03-01
申请号：US13290405
申请日：2011-11-07
IPC分类号： H03H9/17
CPC分类号： H03H9/02834 , H03H9/02102 , H03H9/02228 , H03H9/02448 , H03H9/02574
摘要： Mechanical resonating structures are described, as well as related devices and methods. The mechanical resonating structures may have a compensating structure for compensating temperature variations.
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公开(公告)号：US08686614B2
公开(公告)日：2014-04-01
申请号：US12639260
申请日：2009-12-16
申请人： Jan H. Kuypers , Reimund Rebel , Alexei Gaidarzhy , David M. Chen , Guiti Zolfagharkhani , Klaus Juergen Schoepf
发明人： Jan H. Kuypers , Reimund Rebel , Alexei Gaidarzhy , David M. Chen , Guiti Zolfagharkhani , Klaus Juergen Schoepf
IPC分类号： H01L41/08
CPC分类号： H03H9/0095 , H03H9/02102 , H03H9/02228
摘要： Multi-port devices having multiple electrical ports are described, as are related methods. Some of the multi-port devices may have two input ports and two output ports, and may be driven differentially, in a single-ended mode, in a single-ended to differential mode, or in a differential to single-ended mode. The multi-port devices may include one or more transducers coupled to the electrical ports.
摘要翻译： 具有多个电端口的多端口设备也被描述为相关方法。 一些多端口设备可以具有两个输入端口和两个输出端口，并且可以以单端模式，单端到差分模式或差分到单端模式在差分地驱动。 多端口设备可以包括耦合到电端口的一个或多个换能器。
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公开(公告)号：US08664836B1
公开(公告)日：2014-03-04
申请号：US12885080
申请日：2010-09-17
IPC分类号： H01L41/16
CPC分类号： H03H9/02448 , H03H9/02228 , H03H2009/241
摘要： Passivated micromechanical resonators and related methods are described. Applicants have appreciated that polycrystalline conductive layers used as electrodes for some MEMS resonators are a source of mechanical and electrical instability. To inhibit or prevent contamination of such conductive layers, which may exacerbate the instabilities, passivation structures are used. The passivation structures can be grown, deposited, or otherwise formed.
摘要翻译： 描述了钝化的微机械谐振器和相关方法。 申请人已经意识到，用作一些MEMS谐振器的电极的多晶导体层是机械和电气不稳定性的来源。 为了抑制或防止这种导电层的污染，这可能加剧不稳定性，使用钝化结构。 钝化结构可以生长，沉积或以其它方式形成。
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公开(公告)号：US08174170B1
公开(公告)日：2012-05-08
申请号：US12764703
申请日：2010-04-21
IPC分类号： H01L41/09
CPC分类号： H03H9/02259 , H03H9/02 , H03H9/2463 , H03H2009/02251 , H03H2009/241
摘要： Mechanical resonating structures and related methods are described. The mechanical resonating structures may provide improved efficiency over conventional resonating structures. Some of the structures have lengths and widths and are designed to vibrate in a direction approximately parallel to either the length or width. They may have boundaries bounding the length and width dimensions, which may substantially align with nodes or anti-nodes of vibration.
摘要翻译： 描述机械谐振结构及相关方法。 与常规谐振结构相比，机械谐振结构可提供改进的效率。 一些结构具有长度和宽度，并且被设计成在大致平行于长度或宽度的方向上振动。 它们可以具有限定长度和宽度尺寸的边界，其可以基本上与振动的节点或反节点对齐。
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公开(公告)号：US20100301703A1
公开(公告)日：2010-12-02
申请号：US12750768
申请日：2010-03-31
IPC分类号： H01L41/053 , H01L41/107 , H01L41/22
CPC分类号： H03H3/007 , H03H9/02007 , H03H9/02244 , H03H9/02535
摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
摘要翻译： 描述了具有与基板一体化的压电材料结构的装置。 还描述了用于形成这种装置的制造技术。 该制造可以包括将压电材料晶片结合到不同材料的衬底。 然后可以由压电材料晶片形成诸如谐振器的结构。
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公开(公告)号：US08736150B2
公开(公告)日：2014-05-27
申请号：US13367745
申请日：2012-02-07
IPC分类号： H01L41/053
CPC分类号： H03H9/02259 , H03H9/02 , H03H9/2463 , H03H2009/02251 , H03H2009/241
摘要： Mechanical resonating structures and related methods are described. The mechanical resonating structures may provide improved efficiency over conventional resonating structures. Some of the structures have lengths and widths and are designed to vibrate in a direction approximately parallel to either the length or width. They may have boundaries bounding the length and width dimensions, which may substantially align with nodes or anti-nodes of vibration.
摘要翻译： 描述机械谐振结构及相关方法。 与常规谐振结构相比，机械谐振结构可提供改进的效率。 一些结构具有长度和宽度，并且被设计成在大致平行于长度或宽度的方向上振动。 它们可以具有限定长度和宽度尺寸的边界，其可以基本上与振动的节点或反节点对齐。
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17.发明授权公开(公告)号：US08629599B2
公开(公告)日：2014-01-14
申请号：US13290385
申请日：2011-11-07
CPC分类号： H03H9/02834 , H03H9/02102 , H03H9/02228 , H03H9/02448 , H03H9/02574
摘要： Mechanical resonating structures are described, as well as related devices and methods. The mechanical resonating structures may have a compensating structure for compensating temperature variations.
摘要翻译： 描述了机械谐振结构，以及相关的装置和方法。 机械谐振结构可以具有用于补偿温度变化的补偿结构。
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公开(公告)号：US08466606B2
公开(公告)日：2013-06-18
申请号：US12899447
申请日：2010-10-06
IPC分类号： H01L41/053
CPC分类号： H03H3/007 , H03H9/02007 , H03H9/02244 , H03H9/02535
摘要： Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
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公开(公告)号：US08441176B1
公开(公告)日：2013-05-14
申请号：US13367759
申请日：2012-02-07
IPC分类号： H01L41/09
CPC分类号： H03H9/02259 , H03H9/02 , H03H9/2463 , H03H2009/02251 , H03H2009/241
摘要： Mechanical resonating structures and related methods are described. The mechanical resonating structures may provide improved efficiency over conventional resonating structures. Some of the structures have lengths and widths and are designed to vibrate in a direction approximately parallel to either the length or width. They may have boundaries bounding the length and width dimensions, which may substantially align with nodes or anti-nodes of vibration.
摘要翻译： 描述机械谐振结构及相关方法。 与常规谐振结构相比，机械谐振结构可提供改进的效率。 一些结构具有长度和宽度，并且被设计成在大致平行于长度或宽度的方向上振动。 它们可以具有限定长度和宽度尺寸的边界，其可以基本上与振动的节点或反节点对齐。
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20.发明授权公开(公告)号：US08362675B2
公开(公告)日：2013-01-29
申请号：US13290405
申请日：2011-11-07
IPC分类号： H01L41/04
CPC分类号： H03H9/02834 , H03H9/02102 , H03H9/02228 , H03H9/02448 , H03H9/02574
摘要： Mechanical resonating structures are described, as well as related devices and methods. The mechanical resonating structures may have a compensating structure for compensating temperature variations.
摘要翻译： 描述了机械谐振结构，以及相关的装置和方法。 机械谐振结构可以具有用于补偿温度变化的补偿结构。
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