公开(公告)号：US20170316959A1

公开(公告)日：2017-11-02

申请号：US15522596

申请日：2015-10-20

Applicant: Ebara Corporation

Inventor： Tomoatsu ISHIBASHI

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/08 ,  B08B1/04 ,  B08B1/00

CPC classification number: H01L21/67046 ,  B08B1/001 ,  B08B1/04 ,  B08B3/08 ,  H01L21/02065 ,  H01L21/02074 ,  H01L21/02087

Abstract: A substrate cleaning roll that has a cylindrical shape and scrubs a surface of a substrate by rotating about a rotational axis in a longitudinal direction in contact with the substrate, the longitudinal direction being parallel to the surface of the substrate, the substrate cleaning roll including a bevel cleaner at least at one end of the substrate cleaning roll in the longitudinal direction, the bevel cleaner including a sloping surface to be in contact with an outermost edge of a bevel portion at a rim of the substrate when the substrate cleaning roll comes into contact with the substrate and cleans the surface of the substrate.

公开(公告)号：US20160126113A1

公开(公告)日：2016-05-05

申请号：US14920045

申请日：2015-10-22

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: H01L21/67 ,  B08B1/04 ,  B08B3/10 ,  B08B1/00

CPC classification number: B08B3/10 ,  H01L21/67046

Abstract: A roll-type cleaning member for scrubbing and cleaning a target cleaning surface of a substrate includes a plurality of nodules formed on a surface thereof. Each nodule includes a slit which extends so as not to be parallel to the rotation direction of the roll-type cleaning member, upstream edges are formed by the slit so as to serve as edges first contacting the target cleaning surface when a cleaning surface of the nodule contacts the target cleaning surface of the substrate by the rotation of the roll-type cleaning member, and the upstream edges are provided at a plurality of positions of the cleaning surface of the nodule in the circumferential direction.

Abstract translation: 用于清洗和清洁基材的目标清洁表面的辊式清洁部件包括在其表面上形成的多个结节。 每个结节包括狭缝，其延伸成不平行于辊型清洁构件的旋转方向，上游边缘由狭缝形成，以便当第一接触部分的清洁表面 结节通过辊型清洁构件的旋转而接触基板的目标清洁表面，并且上游边缘设置在结节的清洁表面的圆周方向上的多个位置处。

公开(公告)号：US20140331440A1

公开(公告)日：2014-11-13

申请号：US14260220

申请日：2014-04-23

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: H01L21/67

CPC classification number: H01L21/67046 ,  B08B11/02 ,  H01L21/67051

Abstract: A substrate cleaning apparatus including a self-cleaning device is disclosed. The substrate cleaning apparatus includes a self-cleaning device configured to clean a cylindrical scrub-cleaning tool that is rubbed against a substrate surface. The self-cleaning device includes a cleaning body having an inner circumferential surface that is shaped along an circumferential surface of the scrub-cleaning tool, and at least one cleaning nozzle configured to eject a cleaning fluid toward the circumferential surface of the scrub-cleaning tool through a gap between the circumferential surface of the scrub-cleaning tool and the inner circumferential surface of the cleaning body.

Abstract translation: 公开了一种包括自清洁装置的基板清洁装置。 基板清洁装置包括自清洁装置，其被配置为清洁与基板表面摩擦的圆柱形擦洗清洁工具。 自清洁装置包括具有沿着擦洗清洁工具的圆周表面成形的内圆周表面的清洁体，以及构造成朝向擦洗清洁工具的圆周表面喷射清洁流体的至少一个清洁喷嘴 通过擦洗清洁工具的圆周表面与清洁体的内圆周表面之间的间隙。

公开(公告)号：US20140299163A1

公开(公告)日：2014-10-09

申请号：US14242797

申请日：2014-04-01

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: H01L21/02

CPC classification number: H01L21/02052 ,  H01L21/02074 ,  H01L21/67051 ,  H01L21/68728

Abstract: A substrate processing method which can reduce electrostatic charge of a substrate surface is disclosed. The substrate processing method includes: performing a first processing step of supplying a liquid containing pure water onto a substrate while rotating the substrate; and then performing a second processing step of supplying the liquid onto the substrate, while rotating the substrate, under a condition in which a rate of increase in a surface potential of the substrate is lower than that in the first processing step.

Abstract translation: 公开了一种能够降低衬底表面的静电电荷的衬底处理方法。 基板处理方法包括：在旋转基板的同时进行将含有纯水的液体供给到基板上的第一处理工序; 然后进行第二处理步骤，在基板的表面电位增加速度低于第一处理步骤的条件下，同时旋转基板，将液体供应到基板上。

公开(公告)号：US20140248782A1

公开(公告)日：2014-09-04

申请号：US14191365

申请日：2014-02-26

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: H01L21/306

CPC classification number: H01L21/02065 ,  B08B3/00 ,  B08B3/02 ,  B08B3/024 ,  B08B3/04 ,  B08B7/00 ,  B08B7/0035 ,  B08B7/005 ,  B08B7/0057 ,  B24B37/10 ,  B24B37/34 ,  B24B49/12 ,  H01L21/0206 ,  H01L21/02074 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67115

Abstract: A substrate processing method includes rotating a substrate about a central axis thereof; starting irradiation of a surface of the substrate with soft X-rays; simultaneously with or after starting the irradiation of the surface of the substrate with the soft X-rays, starting supply of pure water onto the surface of the substrate; stopping the supply of the pure water onto the surface of the substrate; and then stopping the irradiation of the surface of the substrate with the soft X-rays.

Abstract translation: 基板处理方法包括使基板围绕其中心轴旋转; 用软X射线照射基片的表面; 与软X射线照射基板表面同时或之后，开始向基板表面供应纯水; 停止将纯水供应到基材的表面上; 然后用软X射线停止衬底表面的照射。

公开(公告)号：US20140187122A1

公开(公告)日：2014-07-03

申请号：US14139764

申请日：2013-12-23

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: B24B1/04 ,  B24B51/00

CPC classification number: B24B1/04 ,  B24B37/005 ,  B24B51/00 ,  B24B57/00

Abstract: A polishing apparatus includes: a pure water supply line configured to supply deaerated pure water into the polishing apparatus; a gas dissolving unit coupled to the pure water supply line and configured to dissolve a gas in the deaerated pure water to produce gas-dissolved pure water; a gas-dissolved pure water delivery line coupled to the gas dissolving unit and configured to deliver the gas-dissolved pure water; an ultrasonic cleaning unit coupled to the gas-dissolved pure water delivery line and configured to impart an ultrasonic vibration energy to the gas-dissolved pure water, which has been delivered through the gas-dissolved pure water delivery line, and then eject the gas-dissolved pure water onto an object to be cleaned; and a controller configured to control the gas dissolving unit and the ultrasonic cleaning unit.

Abstract translation: 抛光装置包括：纯水供应管线，其构造成将去除的纯水供应到抛光装置中; 气体溶解单元，其耦合到纯水供应管线并且被配置为将气体溶解在脱气的纯水中以产生溶解气体的纯水; 气溶解的纯水输送管线，其耦合到所述气体溶解单元并且构造成输送所述气体溶解的纯水; 超声波清洗单元，其耦合到溶解气体的纯水输送管线，并且被配置为向通过气体溶解的纯水输送管线输送的气体溶解的纯水赋予超声波振动能量， 将纯水溶解在待清洁的物体上; 以及控制器，被配置为控制所述气体溶解单元和所述超声波清洗单元。

公开(公告)号：US20140182632A1

公开(公告)日：2014-07-03

申请号：US14139626

申请日：2013-12-23

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01L21/02041 ,  H01L21/02065 ,  H01L21/02074 ,  H01L21/67051

Abstract: A substrate cleaning apparatus cleans a surface of a substrate such as a semiconductor wafer in a non-contact state by using two-fluid jet cleaning. The substrate cleaning apparatus includes a substrate holding mechanism configured to hold and rotate the substrate, with the front surface facing downward, in a horizontal state, and a two-fluid nozzle configured to jet a two-fluid jet flow, comprising a gas and a liquid, upwardly toward the front surface of the substrate held by the substrate holding mechanism.

Abstract translation: 基板清洗装置通过使用双流体喷射清洗来以非接触状态清洗诸如半导体晶片的基板的表面。 基板清洗装置包括：基板保持机构，其构造成保持和旋转基板，其前表面朝向水平状态;双流体喷嘴构造成喷射双流体喷射流，该二流体喷嘴包括气体和 液体，向上朝向由基板保持机构保持的基板的前表面。

公开(公告)号：US20140158160A1

公开(公告)日：2014-06-12

申请号：US14098471

申请日：2013-12-05

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01L21/02057 ,  H01L21/67046 ,  H01L21/67051

Abstract: A substrate cleaning apparatus performs scrub cleaning of a surface of a substrate such as a semiconductor wafer. The substrate cleaning apparatus includes a cleaning member having a lower-end contact surface, and a cleaning liquid supply nozzle configured to supply a cleaning liquid to the surface of the substrate. The cleaning member is configured to scrub-clean the surface of the substrate by moving the cleaning member in one direction while the cleaning member is being rotated about its rotational axis and by rubbing the lower-end contact surface of the cleaning member against the surface of the substrate which is being rotated horizontally in the presence of the cleaning liquid. The cleaning member has an inverted truncated-cone shape wherein the angle α between the lower-end contact surface and a straight line on an outer circumferential surface of the cleaning member is larger than 90° and is not more than 150°.

Abstract translation: 基板清洗装置对诸如半导体晶片的基板的表面进行擦洗清洗。 基板清洗装置包括具有下端接触面的清洗部件和构成为向基板的表面供给清洗液的清洗液供给喷嘴。 清洁构件被构造成通过沿清洁构件绕其旋转轴线旋转而沿着一个方向移动清洁构件来擦洗基板的表面，并且通过将清洁构件的下端接触表面摩擦清洁构件的表面 在存在洗涤液的同时水平旋转的基板。 清洁构件具有倒立的圆锥形状，其中下端接触表面和清洁构件的外周表面上的直线之间的角度α大于90°并且不大于150°。

公开(公告)号：US20190164769A1

公开(公告)日：2019-05-30

申请号：US16313442

申请日：2017-06-26

Applicant: EBARA CORPORATION

Inventor： Shinji KAJITA ,  Hisajiro NAKANO ,  Tomoatsu ISHIBASHI ,  Koichi FUKAYA ,  Yasuyuki MOTOSHIMA ,  Yohei ETO ,  Fumitoshi OIKAWA

IPC: H01L21/304 ,  H01L21/02 ,  H01L21/67 ,  H01L21/687

Abstract: An apparatus for cleaning a substrate has a holding unit 60 that holds a substrate W; a rotated unit 30 connected to the holding unit 60; a rotating unit 35 that is provided on a peripheral outer side of the rotated unit 30 and rotates the rotated unit 30; and a cleaning unit 10, 20 that physically cleans the substrate W held by the holding unit 60.

公开(公告)号：US20180126422A1

公开(公告)日：2018-05-10

申请号：US15569720

申请日：2017-02-13

Applicant: EBARA CORPORATION

Inventor： Tomoatsu ISHIBASHI

IPC: B08B1/00 ,  H01L21/67 ,  B08B1/02

CPC classification number: B08B1/001 ,  B08B1/02 ,  B08B3/022 ,  H01L21/6704

Abstract: A cleaning member 10, for use in cleaning a substrate W, comprises: a tip surface 13 configured to be in contact with the substrate W when cleaning the substrate W, and the tip surface 13 being not covered with a skin layer 11; and a circumferential part having a covered part 16, which is disposed on the base end side and a circumferential surface of which is covered with the skin layer 11, and an exposed part 17, which is disposed on the tip end side and a circumferential surface of which is not covered with the skin layer 11.