公开(公告)号：US20160071648A1

公开(公告)日：2016-03-10

申请号：US14785753

申请日：2014-04-04

Applicant: EPCOS AG

Inventor： Oliver Dernovsek ,  Michael Stahl

IPC: H01G4/12 ,  H01C1/14 ,  H01G4/30 ,  H01G4/005 ,  C04B41/81 ,  H01L41/083 ,  C25D3/56 ,  C04B41/45 ,  C04B41/00 ,  H01C7/10 ,  H01G4/248

CPC classification number: H01G4/12 ,  C04B41/009 ,  C04B41/45 ,  C04B41/81 ,  C25D3/56 ,  H01C1/14 ,  H01C7/10 ,  H01C7/102 ,  H01G4/005 ,  H01G4/06 ,  H01G4/22 ,  H01G4/248 ,  H01G4/30 ,  H01L21/50 ,  H01L41/0533 ,  H01L41/083 ,  H01L41/23

Abstract: An electronic component has a main body. The main body includes a porous material having surface pores at a surface of the main body. A passivation liquid is arranged in the surface pores. A method of forming an electronic component is also disclosed as is a method of passivating a body.

Abstract translation: 电子部件具有主体。 主体包括在主体的表面具有表面孔的多孔材料。 钝化液体布置在表面孔中。 还公开了形成电子部件的方法，也就是钝化身体的方法。

公开(公告)号：US09337408B2

公开(公告)日：2016-05-10

申请号：US14422673

申请日：2013-07-22

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Sebastian Brunner ,  Oliver Dernovsek ,  Klaus-Dieter Aichholzer ,  Georg Krenn ,  Axel Pecina ,  Christian Faistauer

IPC: H01L33/64

CPC classification number: H01L33/644 ,  H01L33/642 ,  H01L33/647

Abstract: A light-emitting diode device has a first carrier and at least one light-emitting diode chip, which is arranged on the first carrier. The first carrier has at least one first and one second carrier part, wherein the light-emitting diode chip rests only on the first carrier part. Furthermore, the first and second carrier parts each have a thermal conductivity. The thermal conductivity of the first carrier part is at least 1.5 times the thermal conductivity of the second carrier part. The first carrier part is surrounded laterally by the second carrier part.

Abstract translation: 发光二极管装置具有第一载体和布置在第一载体上的至少一个发光二极管芯片。 第一载体具有至少一个第一和第二载体部分，其中发光二极管芯片仅在第一载体部分上。 此外，第一和第二载体部分各自具有导热性。 第一载体部分的热导率为第二载体部分的热导率的至少1.5倍。 第一载体部分被第二载体部分横向包围。

公开(公告)号：US09209619B2

公开(公告)日：2015-12-08

申请号：US14351051

申请日：2012-10-26

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Oliver Dernovsek

IPC: H01L33/64 ,  H01L33/62 ,  H01L23/00 ,  H02H9/04 ,  H01C7/12 ,  H01L25/16 ,  H01L23/28 ,  H01L23/60 ,  H01L23/62

CPC classification number: H02H9/04 ,  H01C7/12 ,  H01L23/28 ,  H01L23/60 ,  H01L23/62 ,  H01L25/167 ,  H01L33/62 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/16

Abstract: An ESD protection component includes a ceramic material and a BGA or LGA termination. In addition, an ESD protection component includes a basic body with a lower side. The basic body includes a ceramic material. At least one floating inner electrode is located at a distance from the lower side of two to 100 ceramic grains. Also a component includes a carrier, on which an LED and an ESD protection component are arranged.

Abstract translation: ESD保护组件包括陶瓷材料和BGA或LGA终端。 此外，ESD保护部件包括具有下侧的基体。 基体包括陶瓷材料。 至少一个浮动内部电极位于距离两个至100个陶瓷颗粒的下侧一定距离处。 而且，组件还包括载体，LED和ESD保护组件布置在该载体上。

公开(公告)号：US20150144983A1

公开(公告)日：2015-05-28

申请号：US14403143

申请日：2013-04-17

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Oliver Dernovsek ,  Klaus-Dieter Aichholzer ,  Sebastian Brunner

IPC: H01L27/02 ,  H01L33/48

CPC classification number: H01L27/0248 ,  H01L25/167 ,  H01L33/48 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light-emitting diode device includes a carrier having at least one cavity, a light-emitting diode chip is arranged in a manner at least partly recessed in the at least one cavity, and an ESD protection element, which is formed by a partial region of the carrier. Furthermore, a light-emitting diode device includes a carrier having at least one cavity, a light-emitting diode chip, arranged on the carrier, and an electrical component arranged at least partly recessed in the at least one cavity. Furthermore, the light-emitting diode device includes an ESD protection element, which is formed by a partial region of the carrier.

Abstract translation: 一种发光二极管器件包括具有至少一个空腔的载体，发光二极管芯片以至少部分地凹入至少一个空腔中的方式布置，并且ESD保护元件由部分区域 的承运人。 此外，发光二极管器件包括具有至少一个空腔的载体，布置在载体上的发光二极管芯片，以及至少部分地凹入至少一个空腔中的电气部件。 此外，发光二极管装置包括由载体的部分区域形成的ESD保护元件。

公开(公告)号：US20140252403A1

公开(公告)日：2014-09-11

申请号：US14351051

申请日：2012-10-26

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Oliver Dernovsek

IPC: H02H9/04 ,  H01L33/64 ,  H01L33/62

CPC classification number: H02H9/04 ,  H01C7/12 ,  H01L23/28 ,  H01L23/60 ,  H01L23/62 ,  H01L25/167 ,  H01L33/62 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/16

Abstract: An ESD protection component includes a ceramic material and a BGA or LGA termination. In addition, an ESD protection component includes a basic body with a lower side. The basic body includes a ceramic material. At least one floating inner electrode is located at a distance from the lower side of two to 100 ceramic grains. Also a component includes a carrier, on which an LED and an ESD protection component are arranged.

Abstract translation: ESD保护组件包括陶瓷材料和BGA或LGA终端。 此外，ESD保护部件包括具有下侧的基体。 基体包括陶瓷材料。 至少一个浮动内部电极位于距离两个至100个陶瓷颗粒的下侧一定距离处。 而且，组件还包括载体，LED和ESD保护组件布置在该载体上。