公开(公告)号：US20050077596A1

公开(公告)日：2005-04-14

申请号：US10889801

申请日：2004-07-13

申请人： Michael Bauer ,  Christian Birzer ,  Georg Ernst ,  Rainer Steiner ,  Hermann Vilsmeier ,  Holger Woerner

发明人： Michael Bauer ,  Christian Birzer ,  Georg Ernst ,  Rainer Steiner ,  Hermann Vilsmeier ,  Holger Woerner

IPC分类号： H01L23/29 ,  H01L23/552 ,  H01L29/00

CPC分类号： H01L23/552 ,  H01L23/295 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component with an electromagnetic shielding device against alpha radiation, beta radiation and high-frequency electromagnetic radiation is presented. The semiconductor component includes a semiconductor chip with a circuit integrated therein with a number of electrical terminal areas and at least one ground terminal area. The semiconductor also includes a package that contains the semiconductor chip and also a chip carrier. The chip carrier has a number of external electrical terminals and an external ground terminal. The electrical terminal areas and the ground terminal areas of the semiconductor chip are electrically connected to the external electrical terminals and the external ground terminals of the chip carrier by connecting means. The semiconductor chip and the connecting means are in this case encapsulated by an electrically insulating passivation. The semiconductor chip encapsulated in this way is in turn encapsulated with an electrically and thermally conductive plastics compound, which forms the package and is electrically connected to the ground terminal.

摘要翻译： 提出了具有抗α辐射，β辐射和高频电磁辐射的电磁屏蔽装置的半导体部件。 半导体部件包括半导体芯片，其中集成有多个电端子区域的电路和至少一个接地端子区域。 半导体还包括包含半导体芯片以及芯片载体的封装。 芯片载体具有多个外部电气端子和外部接地端子。 半导体芯片的电端子区域和接地端子区域通过连接装置电连接到芯片载体的外部电端子和外部接地端子。 在这种情况下，半导体芯片和连接装置被电绝缘钝化物封装。 以这种方式封装的半导体芯片又被形成封装并且电连接到接地端子的导电和导热塑料化合物封装。

公开(公告)号：US07524699B2

公开(公告)日：2009-04-28

申请号：US10529565

申请日：2004-07-08

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/3128 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/065 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2924/00012

摘要： One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.

摘要翻译： 本发明的一个实施例涉及具有堆叠的半导体芯片的电子部件和用于生产部件的面板。 在一种情况下，堆叠具有平坦的导体结构，其中布置有堆叠半导体芯片的芯片岛，而第一半导体芯片位于其下方。 芯片岛由具有接触柱的扁平导体包围。 这些接触柱具有支柱接触垫，其与第一半导体芯片的有源上表面和塑料封装化合物的上表面区域一起形成共面的整个上表面。

公开(公告)号：US20070145555A1

公开(公告)日：2007-06-28

申请号：US11685005

申请日：2007-03-12

申请人： Edward Fuergut ,  Thomas Kalin ,  Holger Woerner ,  Carsten Von Koblinski

发明人： Edward Fuergut ,  Thomas Kalin ,  Holger Woerner ,  Carsten Von Koblinski

IPC分类号： H01L23/02

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/92 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor structure includes: a carrier plate; a thermosensitive adhesive coupled to a top surface of the carrier plate, which is removable from the carrier plate at a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action; semiconductor chips having active top surfaces and back surfaces, where the active top surfaces include contact surfaces disposed on the thermosensitive adhesive; and a plastic embedding compound on the carrier plate, in which the semiconductor chips are embedded.

摘要翻译： 半导体结构包括：载板; 耦合到所述载体板的顶表面的热敏粘合剂，其在所述热敏粘合剂失去其粘合作用的预定的限定温度下可从所述载体板移除; 半导体芯片具有有效的顶表面和后表面，其中活性顶表面包括设置在热敏粘合剂上的接触表面; 以及嵌入半导体芯片的载体板上的塑料嵌入化合物。

公开(公告)号：US20070096305A1

公开(公告)日：2007-05-03

申请号：US11514315

申请日：2006-09-01

申请人： Edward Fuergut ,  Holger Woerner

发明人： Edward Fuergut ,  Holger Woerner

IPC分类号： H01L23/48

CPC分类号： H01L21/6835 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68331 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512

摘要： A semiconductor component includes a thin semiconductor chip and a wiring substrate that carries the semiconductor chip on its upper side and includes external contacts on its underside and/or its edge sides. The semiconductor chip is preferably produced from monocrystalline silicon having a thickness d≦25 μm.

摘要翻译： 半导体部件包括薄半导体芯片和在其上侧承载半导体芯片并且在其下侧和/或其边缘侧上包括外部触点的布线基板。 半导体芯片优选由厚度d <=25μm的单晶硅制成。

公开(公告)号：US07202107B2

公开(公告)日：2007-04-10

申请号：US11341895

申请日：2006-01-30

申请人： Edward Fuergut ,  Thomas Kalin ,  Holger Woerner ,  Carsten Von Koblinski

发明人： Edward Fuergut ,  Thomas Kalin ,  Holger Woerner ,  Carsten Von Koblinski

IPC分类号： H01L21/48

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/92 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： A process for producing a semiconductor component having a plastic housing in which at least one semiconductor chip is arranged includes providing a semiconductor wafer having semiconductor chips which are arranged in rows and columns and have active top surfaces and back surfaces, the active top surfaces being provided with contact surfaces. The semiconductor wafer are divided into individual semiconductor chips, which are mounted on a carrier plate that has a thermosensitive adhesive on its top surface, such that the active top surfaces of the individual semiconductor chips are placed onto the top surface of the carrier plate. A common carrier is produced from a plastic embedding compound on the carrier plate, with the semiconductor chips being embedded in the plastic embedding compound. The carrier plate is removed by heating the thermosensitive adhesive to a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action.

摘要翻译： 一种具有塑料壳体的半导体部件的制造方法，其中配置有至少一个半导体芯片包括提供半导体晶片，该半导体晶片具有排列成行和列的半导体芯片，并且具有有源顶表面和后表面，所述有源顶表面设置 具有接触面。 半导体晶片被分成单独的半导体芯片，其安装在其顶表面上具有热敏粘合剂的载体板上，使得各个半导体芯片的有源顶表面被放置在载体板的顶表面上。 在载体板上由塑料包埋化合物制造共同的载体，半导体芯片嵌入在塑料包埋化合物中。 通过将热敏粘合剂加热到热敏粘合剂失去其粘合作用的预定的限定温度来除去载体板。

公开(公告)号：US20060125042A1

公开(公告)日：2006-06-15

申请号：US10529565

申请日：2004-07-08

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： H01L29/00

CPC分类号： H01L23/3128 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/065 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2924/00012

摘要： One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.

摘要翻译： 本发明的一个实施例涉及具有堆叠的半导体芯片的电子部件和用于生产部件的面板。 在一种情况下，堆叠具有平坦的导体结构，其中布置有堆叠半导体芯片的芯片岛，而第一半导体芯片位于其下方。 芯片岛由具有接触柱的扁平导体包围。 这些接触柱具有支柱接触垫，其与第一半导体芯片的有源上表面和塑料封装化合物的上表面区域一起形成共面的整个上表面。

公开(公告)号：US07575173B2

公开(公告)日：2009-08-18

申请号：US11341892

申请日：2006-01-30

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： G06K19/00

CPC分类号： H01L21/568 ,  G06K19/07743 ,  G06K19/07745 ,  G06K19/07747 ,  H01L21/561 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/49 ,  H01L24/96 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surface that is coplanar with the active upper surface of the semiconductor chip, a first dielectric layer that is arranged on the plastic housing compound surface and on the active upper surface of the semiconductor chip, one or more interposer metallization levels, which are isolated via further dielectric layers and are connected to the active upper surface of the semiconductor chip, and external contact surfaces. The external contact surfaces are formed on the outermost interposer level and facilitate contact data transmission. The smart card module uses no bonding wires and has a very small physical volume.

摘要翻译： 用于联系数据传输的智能卡包括安装在卡体内的卡体和智能卡模块。 智能卡模块包括具有有源上表面的半导体芯片，围绕半导体芯片的塑料壳体化合物，并且包括至少一个与半导体芯片的有源上表面共面的表面;第一介电层，其布置在 塑料外壳复合表面和半导体芯片的有源上表面上，一个或多个中介层金属化层，其通过另外的电介质层隔离并连接到半导体芯片的有源上表面和外部接触表面。 外部接触表面形成在最外侧的插入层上，便于接触数据传输。 智能卡模块不使用接合线，体积非常小。

公开(公告)号：US20060183269A1

公开(公告)日：2006-08-17

申请号：US11341895

申请日：2006-01-30

申请人： Edward Fuergut ,  Thomas Kalin ,  Holger Woerner ,  Carsten Koblinski

发明人： Edward Fuergut ,  Thomas Kalin ,  Holger Woerner ,  Carsten Koblinski

IPC分类号： H01L21/50 ,  H01L23/02

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/92 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： A process for producing a semiconductor component having a plastic housing in which at least one semiconductor chip is arranged includes providing a semiconductor wafer having semiconductor chips which are arranged in rows and columns and have active top surfaces and back surfaces, the active top surfaces being provided with contact surfaces. The semiconductor wafer are divided into individual semiconductor chips, which are mounted on a carrier plate that has a thermosensitive adhesive on its top surface, such that the active top surfaces of the individual semiconductor chips are placed onto the top surface of the carrier plate. A common carrier is produced from a plastic embedding compound on the carrier plate, with the semiconductor chips being embedded in the plastic embedding compound. The carrier plate is removed by heating the thermosensitive adhesive to a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action.

摘要翻译： 一种具有塑料壳体的半导体部件的制造方法，其中配置有至少一个半导体芯片包括提供半导体晶片，该半导体晶片具有排列成行和列的半导体芯片，并且具有有源顶表面和后表面，所述有源顶表面设置 具有接触面。 半导体晶片被分成单独的半导体芯片，其安装在其顶表面上具有热敏粘合剂的载体板上，使得各个半导体芯片的有源顶表面被放置在载体板的顶表面上。 在载体板上由塑料包埋化合物制造共同的载体，半导体芯片嵌入在塑料包埋化合物中。 通过将热敏粘合剂加热到热敏粘合剂失去其粘合作用的预定的限定温度来除去载体板。

公开(公告)号：US07700956B2

公开(公告)日：2010-04-20

申请号：US10561819

申请日：2004-06-04

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： H01L27/15

CPC分类号： H04N5/2253 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/0411 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01032 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H04N5/2254 ,  H04N5/2257

摘要： A sensor component and a panel used for the production thereof is disclosed. The sensor component has, in addition to a sensor chip with a sensor region, a rear side and passive components. These are embedded jointly in a plastics composition, in such a way that their respective electrodes can be wired from an overall top side of a plastic plate.

摘要翻译： 公开了用于生产传感器部件和面板。 除了具有传感器区域的传感器芯片之外，传感器部件还具有后侧和无源部件。 它们共同地嵌入塑料组合物中，使得它们各自的电极可以从塑料板的整个顶侧布线。

公开(公告)号：US07622733B2

公开(公告)日：2009-11-24

申请号：US11685005

申请日：2007-03-12

申请人： Edward Fuergut ,  Thomas Kalin ,  Holger Woerner ,  Carsten Von Koblinski

发明人： Edward Fuergut ,  Thomas Kalin ,  Holger Woerner ,  Carsten Von Koblinski

IPC分类号： H01L35/24 ,  H01L51/00 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/92 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor structure includes: a carrier plate; a thermosensitive adhesive coupled to a top surface of the carrier plate, which is removable from the carrier plate at a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action; semiconductor chips having active top surfaces and back surfaces, where the active top surfaces include contact surfaces disposed on the thermosensitive adhesive; and a plastic embedding compound on the carrier plate, in which the semiconductor chips are embedded.

摘要翻译： 半导体结构包括：载板; 耦合到所述载体板的顶表面的热敏粘合剂，其在所述热敏粘合剂失去其粘合作用的预定的限定温度下可从所述载体板移除; 半导体芯片具有有效的顶表面和后表面，其中活性顶表面包括设置在热敏粘合剂上的接触表面; 以及嵌入半导体芯片的载体板上的塑料嵌入化合物。