Isolation of short-circuited sensor cells for high-reliability operation of sensor array
    15.
    发明申请
    Isolation of short-circuited sensor cells for high-reliability operation of sensor array 有权
    隔离传感器阵列的高可靠性操作的短路传感器单元

    公开(公告)号:US20060145059A1

    公开(公告)日:2006-07-06

    申请号:US11028789

    申请日:2005-01-04

    IPC分类号: H01J40/14 G01J1/42 H03F3/08

    CPC分类号: H04R23/00 B06B1/0292

    摘要: A device comprising an array of sensors and a multiplicity of bus lines, each sensor being electrically connected to a respective bus line and comprising a respective multiplicity of groups of micromachined sensor cells, the sensor cell groups of a particular sensor being electrically coupled to each other via the bus line to which that sensor is connected, each sensor cell group comprising a respective multiplicity of micromachined sensor cells that are electrically interconnected to each other and not switchably disconnectable from each other, the device further comprising means for isolating any one of the sensor cell groups from its associated bus line and in response to any one of the micromachined sensor cells of that sensor cell group being short-circuited to ground. In one implementation, the isolating means comprise a multiplicity of fuses. In another implementation, the isolating means comprise a multiplicity of short circuit protection modules, each module comprising a current sensor circuit and an electrical isolation switch.

    摘要翻译: 一种包括传感器阵列和多条总线线路的设备,每个传感器电连接到相应的总线,并且包括相应多个微机械传感器单元组,特定传感器的传感器单元组彼此电耦合 通过连接该传感器的总线,每个传感器单元组包括彼此电互连并且不可切换地彼此分离的相应多个微机械传感器单元,该装置还包括用于隔离传感器 来自其相关联的总线线路的单元组以及响应于该传感器单元组的微机械传感器单元中的任一个被短路到地。 在一个实施方案中,隔离装置包括多个保险丝。 在另一实施方案中,隔离装置包括多个短路保护模块,每个模块包括电流传感器电路和电隔离开关。

    METHOD FOR PROTECTING THE DIAPHRAGM AND EXTENDING THE LIFE OF SIC AND/OR SI MEMS MICROVALVES
    16.
    发明申请
    METHOD FOR PROTECTING THE DIAPHRAGM AND EXTENDING THE LIFE OF SIC AND/OR SI MEMS MICROVALVES 有权
    保护膜片并延长SIC和/或SI MEMS微孔的寿命的方法

    公开(公告)号:US20050098749A1

    公开(公告)日:2005-05-12

    申请号:US10876072

    申请日:2004-06-24

    摘要: A microvalve and a method of forming a diaphragm stop for a microvalve. The microvalve includes a first layer and a diaphragm member to control the flow of fluid through the microvalve. The method comprises the step of forming a contoured shaped recess extending inward from a surface of the layer by using a laser to remove material in a series of areas, at successively greater depths extending inward from said surface. Preferably, the recess has a dome shape, and may be formed by a direct-write laser operated via a computer aided drawing program running on a computer. For example, CAD artwork files, comprising a set of concentric polygons approximating circles, may be generated to create the dome structure. The laser ablation depth can be controlled by modifying the offset step distance of the polygons and equating certain line widths to an equivalent laser tool definition. Preferably, the laser tool definition is combined with the CAD artwork, which defines a laser path such that the resulting geometry has no sharp edges that could cause the diaphragm of the valve to tear or rupture.

    摘要翻译: 微型阀和形成用于微型阀的隔膜止动件的方法。 微型阀包括第一层和隔膜构件,以控制通过微型阀的流体流动。 该方法包括以下步骤:在从所述表面向内延伸的连续更大的深度处,通过使用激光来形成从层的表面向内延伸的轮廓形状的凹槽,以移除一系列区域中的材料。 优选地,凹部具有圆顶形状,并且可以通过在计算机上运行的计算机辅助绘图程序来操作的直写激光器形成。 例如,可以生成包括近似圆的一组同心多边形的CAD图形文件,以创建圆顶结构。 可以通过修改多边形的偏移步距并将某些线宽等同于等效的激光工具定义来控制激光烧蚀深度。 优选地,激光工具定义与CAD图形组合,其限定激光路径,使得所得到的几何形状没有尖锐边缘,其可能导致阀的隔膜撕裂或破裂。

    Method of fabricating an integrated optoelectronic circuit
    17.
    发明授权
    Method of fabricating an integrated optoelectronic circuit 有权
    制造集成光电子电路的方法

    公开(公告)号:US06818466B2

    公开(公告)日:2004-11-16

    申请号:US10728148

    申请日:2003-12-04

    IPC分类号: H01L2100

    摘要: A method of fabricating an integrated optoelectronic circuit. The method includes positioning a microchip on a first flexible dielectric substrate. A polymer electro-optic waveguide is positioned on or within the first flexible dielectric substrate. A ground electrode is positioned along the electro-optic waveguide. A signal electrode is positioned along the electro-optic waveguide opposite the ground electrode. A first patterned metallization layer is applied to the first flexible dielectric substrate. A second flexible dielectric substrate is positioned along the first flexible dielectric substrate. A plurality of via openings are provided in the first and second flexible dielectric substrates. A second patterned metallization layer is applied to the second flexible dielectric substrate.

    摘要翻译: 一种制造集成光电子电路的方法。 该方法包括将微芯片定位在第一柔性电介质基片上。 聚合物电光波导位于第一柔性电介质基底上或内。 接地电极沿着电光波导定位。 信号电极沿着与接地电极相对的电光波导放置。 将第一图案化金属化层施加到第一柔性电介质基板。 第二柔性电介质基片沿着第一柔性电介质基片定位。 多个通孔开口设置在第一和第二柔性电介质基片中。 将第二图案化金属化层施加到第二柔性电介质基板。

    Integrated optoelectronic circuit and method of fabricating the same
    18.
    发明授权
    Integrated optoelectronic circuit and method of fabricating the same 有权
    集成光电子电路及其制造方法

    公开(公告)号:US06711312B1

    公开(公告)日:2004-03-23

    申请号:US10248148

    申请日:2002-12-20

    IPC分类号: G02B612

    摘要: The invention comprises a novel combination of microwave and photonic packaging to arrive a compact, self contained MZI modulator. The nature of the NLO polymer, that is, its large electro-optic coefficient reduces the drive requirements for the integrated power amplifier, allowing a small to medium power amplifier to be used. Microwave high density interconnect (HDI) packaging techniques allow the medium power amplifier to be fabricated into a small assembly, which can be mounted directly to the MZI substrate. The integrated amplifier and modulator provides a significant reduced size and lower power, and high bandwidth advantage when compared with existing devices based on inorganic materials.

    摘要翻译: 本发明包括微波和光子包装的新颖组合,以获得紧凑的,独立的MZI调制器。 NLO聚合物的性质,即其大的电光系数降低了集成功率放大器的驱动要求,允许使用中小功率放大器。 微波高密度互连(HDI)封装技术允许将中等功率放大器制造成小型组件,其可以直接安装到MZI衬底。 与基于无机材料的现有器件相比,集成放大器和调制器提供了显着的减小的尺寸和较低的功率,并且具有高带宽优势。