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    SYSTEMS AND METHODS FOR A TARGET AND BACKING PLATE ASSEMBLY
    11.
    发明申请
    SYSTEMS AND METHODS FOR A TARGET AND BACKING PLATE ASSEMBLY 审中-公开
    目标和背板组件的系统和方法

    公开(公告)号：US20120267243A1

    公开(公告)日：2012-10-25

    申请号：US13541327

    申请日：2012-07-03

    申请人： Eugene Y. Ivanov

    发明人： Eugene Y. Ivanov

    IPC分类号： B23K20/22 ,  B23K20/24 ,  C23C14/34

    CPC分类号： C23C14/3407

    摘要： A target and backing plate assembly and method of making the same. The target and backing plate assembly provides a mechanical interlock between the target and backing plate in addition to diffusion bonding between dissimilar materials comprising the target and backing plate. An interlayer may also be used between the target and backing plate. A plurality of ridges, or other salient surface features on one of the target and backing plate are joined to corresponding members or channels on the other of the target and backing plate. The dissimilar materials of the target and backing plate fill negative angled cavities formed by the plurality of ridges and corresponding channels or members of the target and backing plate to accommodate the diffusion bonded dissimilar materials. A target and backing plate assembly with increased strength results.

    摘要翻译： 目标和背板组件及其制造方法。 除了在包括靶材和背板之间的不同材料之间的扩散结合之外，靶材和背板组件还提供靶材和背板之间的机械互锁。 也可以在靶材和背板之间使用中间层。 目标板和背板之一上的多个脊或其他突出的表面特征被连接到目标和背板的另一个上的对应的构件或通道。 目标和背板的不同材料填充由多个脊形成的负角度空腔以及目标和背板的相应通道或构件，以适应扩散接合的不同材料。 具有增加强度的目标和背板组件结果。

    Systems and methods for a target and backing plate assembly
    13.
    发明申请
    Systems and methods for a target and backing plate assembly 审中-公开
    目标和背板组件的系统和方法

    公开(公告)号：US20100038241A1

    公开(公告)日：2010-02-18

    申请号：US12586319

    申请日：2009-09-21

    申请人： Eugene Y. Ivanov

    发明人： Eugene Y. Ivanov

    IPC分类号： C23C14/16 ,  B23K20/00

    CPC分类号： C23C14/3407

    摘要： A target and backing plate assembly and method of making the same. The target and backing plate assembly provides a mechanical interlock between the target and backing plate in addition to diffusion bonding between dissimilar materials comprising the target and backing plate. An interlayer may also be used between the target and backing plate. A plurality of ridges, or other salient surface features on one of the target and backing plate are joined to corresponding members or channels on the other of the target and backing plate. The dissimilar materials of the target and backing plate fill negative angled cavities formed by the plurality of ridges and corresponding channels or members of the target and backing plate to accommodate the diffusion bonded dissimilar materials. A target and backing plate assembly with increased strength results.

    摘要翻译： 目标和背板组件及其制造方法。 除了在包括靶材和背板之间的不同材料之间的扩散结合之外，靶材和背板组件还提供靶材和背板之间的机械互锁。 也可以在靶材和背板之间使用中间层。 目标板和背板之一上的多个脊或其他突出的表面特征被连接到目标和背板的另一个上的对应的构件或通道。 目标和背板的不同材料填充由多个脊形成的负角度空腔以及目标和背板的相应通道或构件，以适应扩散接合的不同材料。 具有增加强度的目标和背板组件结果。

    Low temperature sputter target bonding method and target assemblies produced thereby
    14.
    发明授权
    Low temperature sputter target bonding method and target assemblies produced thereby 有权
    由此制造低温溅射靶接合方法和目标组件

    公开(公告)号：US06749103B1

    公开(公告)日：2004-06-15

    申请号：US09720347

    申请日：2000-12-21

    申请人： Eugene Y. Ivanov ,  Harry W. Conard

    发明人： Eugene Y. Ivanov ,  Harry W. Conard

    IPC分类号： B23K3102

    CPC分类号： C23C14/3407 ,  B23K31/02

    摘要： A low temperature target and backing plate bonding process and assemblies made thereby. A plurality of projections are formed in the harder member of the assembly. The assembly is bonded by conventional techniques around the peripheral assembly boundaries. The assembly is then pressure consolidated at low temperature so that the projections, circumscribed by the bonded zone, penetrate into the softer member promoting the formation of metal to metal cold diffusion type bonds.

    摘要翻译： 低温目标和背板接合工艺和由此制成的组件。 在组件的较硬构件中形成多个突起。 组件通过常规技术围绕外围组件边界进行粘合。 然后将组件在低温下进行压力固化，使得由接合区域限定的突起穿透进入较软的构件，促进金属与金属的冷扩散型键的形成。

    Method of assembling target and backing plates
    15.
    发明授权
    Method of assembling target and backing plates 有权
    目标和背板组装方法

    公开(公告)号：US06725522B1

    公开(公告)日：2004-04-27

    申请号：US10030996

    申请日：2002-01-09

    申请人： Eugene Y. Ivanov ,  Harry W. Conard

    发明人： Eugene Y. Ivanov ,  Harry W. Conard

    IPC分类号： B23P1100

    CPC分类号： B21K25/00 ,  C23C14/3407 ,  Y10T29/49945 ,  Y10T29/49968

    摘要： A low temperature target and backing plate bonding process and assemblies made thereby. A plurality of male projections (8) are formed in one member (2) of the assembly with a plurality of corresponding female recesses (9) formed in the other member (4). The assembly is bonded by conventional techniques around the peripheral boundary (25) that surrounds the male and female portions (8,9). The assembly is then pressure consolidated at low temperature so that the projections (8), circumscribed by the bonded zone, are force fit into the female recesses (9).

    摘要翻译： 低温目标和背板接合工艺和由此制成的组件。 多个阳突起（8）形成在组件的一个构件（2）中，在另一个构件（4）中形成有多个相应的阴凹槽（9）。 组件通过围绕阳和阴部分（8,9）的外围边界（25）的常规技术结合。 然后将组件在低温下进行压力固化，使得由接合区限定的突起（8）被力配合到阴凹部（9）中。

    SPUTTERING TARGET WITH AN INSULATING RING AND A GAP BETWEEN THE RING AND THE TARGET
    18.
    发明申请
    SPUTTERING TARGET WITH AN INSULATING RING AND A GAP BETWEEN THE RING AND THE TARGET 审中-公开
    具有绝缘环的喷射目标和环与目标之间的差距

    公开(公告)号：US20110139614A1

    公开(公告)日：2011-06-16

    申请号：US13031459

    申请日：2011-02-21

    申请人： Eugene Y. Ivanov ,  Erich Theado ,  Harry W. Conard ,  John E. Poole

    发明人： Eugene Y. Ivanov ,  Erich Theado ,  Harry W. Conard ,  John E. Poole

    IPC分类号： C23C14/34

    CPC分类号： H01J37/34 ,  H01J37/3414

    摘要： A sputtering plasma reactors for plasma vapor deposition (PVD) having an improved interface between a PVD target, a ceramic ring and a PVD chamber wall. The reactor includes a PVD chamber wall and a PVD target, wherein the target in conjunction with the PVD chamber wall form a vacuum chamber and wherein at least the portion of the target facing the vacuum chamber is composed of material to be sputtered. The reactor also includes an insulating ceramic ring positioned between the target and the PVD chamber wall. A first O-ring is provided to establish a vacuum seal between the target and the insulating ring and a second O-ring is provided to establish a vacuum seal between the insulating ring and the PVD chamber wall. At least one spacer is positioned between the target and insulating ring to maintain a gap G between the insulating ring and the target. The spacer is made of a suitable low coefficient of friction material and inhibits black marking, scratching or the like that may otherwise occur along the interface between the ceramic ring and the target.

    摘要翻译： 用于等离子体气相沉积（PVD）的溅射等离子体反应器，其具有PVD靶，陶瓷环和PVD室壁之间改进的界面。 反应器包括PVD室壁和PVD靶，其中与PVD室壁结合的目标物形成真空室，并且其中至少面对真空室的靶的部分由待溅射的材料组成。 反应器还包括定位在靶和PVD室壁之间的绝缘陶瓷环。 设置第一O形环以在靶和绝缘环之间建立真空密封，并且提供第二O形环以在绝缘环和PVD室壁之间建立真空密封。 至少一个间隔件定位在目标和绝缘环之间以保持绝缘环和靶之间的间隙G. 间隔件由合适的低摩擦系数材料制成，并且可以抑制否则沿陶瓷环和靶之间的界面发生的黑色标记，划痕等。

    Method of manufacturing sputter targets with internal cooling channels
    19.
    发明授权
    Method of manufacturing sputter targets with internal cooling channels 有权
    使用内部冷却通道制造溅射靶的方法

    公开(公告)号：US06840427B2

    公开(公告)日：2005-01-11

    申请号：US10344782

    申请日：2001-09-11

    申请人： Eugene Y. Ivanov

    发明人： Eugene Y. Ivanov

    IPC分类号： B21K25/00 ,  B23K20/02 ,  C23C14/34 ,  H01J37/34 ,  B23K20/12 ,  B23K31/02

    CPC分类号： H01J37/3497 ,  B21K25/00 ,  B23K20/02 ,  B23K20/023 ,  C23C14/3407 ,  H01J37/3435 ,  Y10T428/24298 ,  Y10T428/24744 ,  Y10T428/24996 ,  Y10T428/249974 ,  Y10T428/249981

    摘要： The present invention pertains to low temperature pressure consolidation methods which provide for bonding of target material (10) to the backing plate material (15) capable of withstanding the stresses imposed by high sputtering rates. The sputter target assemblies (5) in accordance with the present invention are preferably comprised of target materials (10) and backing plate materials (15) having dissimilar thermal expansion coefficients and incorporate internal cooling channels (20). In the preferred embodiment, the resulting bond and the formation of the cooling channels (20) are cooperative.

    摘要翻译： 本发明涉及低温压力固结方法，其提供了能够承受高溅射速率施加的应力的目标材料（10）与背板材料（15）的结合。 根据本发明的溅射靶组件（5）优选地由具有不同热膨胀系数的目标材料（10）和背板材料（15）组成并且包括内部冷却通道（20）。 在优选实施例中，所得到的结合和冷却通道（20）的形成是协同的。

    SPUTTER TARGET
    20.
    发明申请
    SPUTTER TARGET 审中-公开
    射击目标

    公开(公告)号：US20120305393A1

    公开(公告)日：2012-12-06

    申请号：US13577782

    申请日：2011-02-16

    申请人： Eugene Y. Ivanov ,  Alexander Leybovich ,  John Rizer

    发明人： Eugene Y. Ivanov ,  Alexander Leybovich ,  John Rizer

    IPC分类号： C23C14/34 ,  C23C14/14 ,  B23P11/00 ,  B05D5/12

    CPC分类号： C23C14/3407 ,  H01J37/3423 ,  H01J37/3426 ,  H01J37/3435 ,  Y10T29/49826

    摘要： In one aspect of the invention, a sputter target is provided comprising a backing plate (40) comprising a front surface and a back surface; and a sputtering plate mounted on said backing plate, the sputtering plate comprising a sputtering surface and a back surface. At least one of the back surface of the sputtering plate, the front surface of the backing plate, or the back surface of the backing plate has at least one groove (30) that is shaped and sized to correspond to an observed region of higher sputtering of the sputtering plate relative to an adjacent area of the sputtering plate. An insert (50) is placed in the groove(s). The backing plate comprises a first material, the sputtering plate comprises a second material, and an insert comprises a third material. In yet another aspect of the sputter target, a method of controlling the electromagnetic properties of a sputter target is provided.

    摘要翻译： 在本发明的一个方面，提供一种溅射靶，其包括一个包括前表面和后表面的背板（40） 以及安装在所述背板上的溅射板，所述溅射板包括溅射表面和背面。 溅射板的后表面，背板的前表面或背板的后表面中的至少一个具有至少一个凹槽（30），其形状和尺寸被设计成对应于较高溅射的观察区域 的溅射板相对于溅射板的相邻区域。 插入件（50）放置在凹槽中。 背板包括第一材料，溅射板包括第二材料，并且插入件包括第三材料。 在溅射靶的另一方面，提供了一种控制溅射靶的电磁特性的方法。