公开(公告)号：US20210271162A1

公开(公告)日：2021-09-02

申请号：US17314321

申请日：2021-05-07

Applicant: FUJIFILM Corporation

Inventor： Keiyu OU ,  Naohiro Tango ,  Hidenori Takahashi ,  Akiyoshi Goto ,  Takeshi Kawabata ,  Tsutomu Yoshimura

IPC: G03F7/004 ,  G03F7/038 ,  G03F7/039 ,  C08F220/28 ,  C08F220/18

Abstract: An object of the present invention is to provide an actinic ray-sensitive or radiation-sensitive resin composition, in which the cross-sectional shape of a pattern thus formed has excellent rectangularity and a dimensional variation of the line width of the pattern thus formed hardly occurs even over time after preparation. Furthermore, another object of the present invention is to provide a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.
The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention includes a resin having a polarity that increases through decomposition by an action of an acid, a compound that generates an acid upon irradiation with actinic rays or radiation, and a halogen-based solvent, in which a content of the halogen-based solvent is from 1 ppb by mass to 50 ppm by mass with respect to a total mass of the composition.

公开(公告)号：US20180120706A1

公开(公告)日：2018-05-03

申请号：US15851703

申请日：2017-12-21

Applicant: FUJIFILM Corporation

Inventor： Michihiro SHIRAKAWA ,  Keiyu OU ,  Naoya HATAKEYAMA ,  Akiyoshi GOTO ,  Keita KATO ,  Takashi YAKUSHIJI ,  Tadashi OMATSU

IPC: G03F7/36 ,  G03F7/038 ,  G03F7/039 ,  G03F7/075 ,  G03F7/20 ,  B32B27/18 ,  C08F212/04 ,  C08F220/06

CPC classification number: G03F7/36 ,  B32B27/18 ,  C08F12/24 ,  C08F212/04 ,  C08F212/14 ,  C08F220/06 ,  C09D125/18 ,  G03F7/038 ,  G03F7/039 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/0752 ,  G03F7/0757 ,  G03F7/0758 ,  G03F7/091 ,  G03F7/094 ,  G03F7/11 ,  G03F7/20 ,  G03F7/325 ,  C08F212/32

Abstract: Provided are a pattern forming method including (1) a step of forming a resist underlayer film on a substrate to be processed, (2) a step of forming a resist film on the resist underlayer film, using a resist composition containing (A) a resin having a repeating unit containing a Si atom, and (B) a compound which generates an acid upon irradiation with actinic rays or radiation, (3) a step of exposing the resist film, (4) a step of developing the exposed resist film using a developer including an organic solvent, thereby forming a negative tone resist pattern, and (5) a step of processing the resist underlayer film and the substrate to be processed, using the resist pattern as a mask, thereby forming a pattern, in which the content of the resin (A) is 20% by mass or more with respect to the total solid content of the resist composition.

公开(公告)号：US20170192355A1

公开(公告)日：2017-07-06

申请号：US15467357

申请日：2017-03-23

Applicant: FUJIFILM Corporation

Inventor： Masafumi KOJIMA ,  Akiyoshi GOTO ,  Akinori SHIBUYA ,  Keita KATO ,  Keiyu OU

IPC: G03F7/038 ,  G03F7/20 ,  G03F7/38 ,  G03F7/004 ,  G03F7/40 ,  H01L21/027 ,  C08F220/18 ,  G03F7/09 ,  G03F7/16 ,  G03F7/32

CPC classification number: G03F7/038 ,  C08F220/18 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0397 ,  G03F7/091 ,  G03F7/11 ,  G03F7/16 ,  G03F7/168 ,  G03F7/2041 ,  G03F7/325 ,  G03F7/327 ,  G03F7/38 ,  G03F7/40 ,  H01L21/027

Abstract: The present invention has an object to provide a method for forming a negative tone pattern in which shrinkage of a film in post exposure bake is suppressed; a method for manufacturing an electronic device including the pattern forming method; and an active-light-sensitive or radiation-sensitive resin composition. The method for forming a negative tone pattern of the present invention includes: a film formation step of forming an active-light-sensitive or radiation-sensitive resin composition film on a substrate, using a resist composition; an exposing step of irradiating the film with active light or radiation; a heating treatment step of performing a heating treatment on the film irradiated with active light or radiation; and a developing step of developing the heating-treated film using a developer including an organic solvent, in which the resist composition includes a resin A having a repeating unit A with a group represented by a specific formula, a resin B having a repeating unit B with a group represented by a specific formula, and a compound that generates an acid upon irradiation with active light or radiation.

公开(公告)号：US20170168394A1

公开(公告)日：2017-06-15

申请号：US15444471

申请日：2017-02-28

Applicant: FUJIFILM Corporation

Inventor： Akiyoshi GOTO ,  Masafumi KOJIMA ,  Keita KATO ,  Keiyu OU ,  Michihiro SHIRAKAWA

IPC: G03F7/038 ,  G03F7/16 ,  G03F7/38 ,  C08F220/36 ,  G03F7/40 ,  G03F7/20 ,  C08F220/28 ,  C08F220/18 ,  G03F7/004 ,  G03F7/32

CPC classification number: G03F7/038 ,  C08F220/18 ,  C08F220/24 ,  C08F220/26 ,  C08F220/28 ,  C08F220/36 ,  C08F228/06 ,  C08F230/08 ,  C08F2220/282 ,  C08F2220/283 ,  C08F2220/365 ,  G03F7/004 ,  G03F7/0045 ,  G03F7/0397 ,  G03F7/16 ,  G03F7/168 ,  G03F7/2041 ,  G03F7/32 ,  G03F7/325 ,  G03F7/327 ,  G03F7/38 ,  G03F7/40 ,  H01L21/0274 ,  C08F2220/1858 ,  C08F2220/1866 ,  C08F2220/185 ,  C08F2220/1825 ,  C08F2220/1875 ,  C08F2230/085 ,  C08F220/22

Abstract: The present invention has an object to provide an active-light-sensitive or radiation-sensitive resin composition having high DOF and low LWR; a pattern forming method using the composition; and a method for manufacturing an electronic device. The active-light-sensitive or radiation-sensitive resin composition of the present invention includes a resin P and a compound that generates an acid upon irradiation with active light or radiation, in which the resin P has a repeating unit p1 and a repeating unit p2 represented by specific formulae, and the repeating unit p2 does not have a group in which a hydroxy group of a hydroxyadamantyl group is protected with a group that decomposes by the action of an acid to leave.

公开(公告)号：US20170097565A1

公开(公告)日：2017-04-06

申请号：US15384521

申请日：2016-12-20

Applicant: FUJIFILM Corporation

Inventor： Shohei KATAOKA ,  Akinori SHIBUYA ,  Keiyu OU

IPC: G03F7/004 ,  G03F7/09 ,  G03F7/40 ,  G03F7/20 ,  G03F7/38 ,  G03F7/32 ,  G03F7/038 ,  G03F7/16

CPC classification number: G03F7/0045 ,  G03F7/0046 ,  G03F7/038 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/091 ,  G03F7/16 ,  G03F7/168 ,  G03F7/2041 ,  G03F7/325 ,  G03F7/38 ,  G03F7/40

Abstract: An active-light-sensitive or radiation-sensitive resin composition includes a basic compound (A) corresponding to at least one of the following basic compound (A1) or (A2): (A1) a nonionic compound having an alicyclic structure (a1) and a basic site (b2) at a site different from the alicyclic structure within one molecule, or (A2) a nonionic compound having a heterocyclic structure (a2) having no basicity and a basic site (b2) at a site different from the heterocyclic structure within one molecule.