公开(公告)号：US20210087067A1

公开(公告)日：2021-03-25

申请号：US17022876

申请日：2020-09-16

Applicant: FUJIMI INCORPORATED

Inventor： Keiji ASHITAKA ,  Yusuke KAWASAKI ,  Masaaki ITO ,  Jun SHINODA ,  Shogo TSUBOTA

IPC: C01B33/145

Abstract: There is provided a method for producing a silica sol including: a first step of adding an organic acid to at least one of liquid (A) containing an alkaline catalyst, water, and a first organic solvent and liquid (C) containing water; and a second step of mixing the liquid (A) with liquid (B) containing an alkoxysilane or its condensate and a second organic solvent, and the liquid (C) to make a reaction liquid after the first step.

公开(公告)号：US20200216677A1

公开(公告)日：2020-07-09

申请号：US16465790

申请日：2018-09-28

Applicant: FUJIMI INCORPORATED

Inventor： Shogo TSUBOTA ,  Souma TAGUCHI ,  Keiji ASHITAKA ,  Naoya MIWA

IPC: C09C1/30 ,  C01B32/956

Abstract: According to the present invention, there is provided a means for producing an aluminum hydroxide-coated SiC particle powder having a coating layer containing aluminum hydroxide on a surface of SiC particles. The present invention relates to a method for producing an aluminum hydroxide-coated SiC particle powder, which includes a coating step of maintaining a pH of a dispersion containing SiC particles, sodium aluminate, and water in a range of from 9 to 12 and forming coated particles having a coating layer containing aluminum hydroxide on a surface of the SiC particles.

公开(公告)号：US20190309191A1

公开(公告)日：2019-10-10

申请号：US16449011

申请日：2019-06-21

Applicant: FUJIMI INCORPORATED

Inventor： Keiji ASHITAKA ,  Shogo TSUBOTA

IPC: C09G1/02 ,  C01B33/148 ,  C01B33/146 ,  C09K3/14 ,  H01L21/304 ,  C07F7/02 ,  H01L21/3105 ,  B24B37/04 ,  B24B37/00 ,  C01B33/149

Abstract: To provide modified colloidal silica capable of improving the stability of the polishing speed with time when used as abrasive grains in a polishing composition for polishing a polishing object that contains a material to which charged modified colloidal silica easily adheres, such as a SiN wafer, and to provide a method for producing the modified colloidal silica.Modified colloidal silica, being obtained by modifying raw colloidal silica, whereinthe raw colloidal silica has a number distribution ratio of 10% or less of microparticles having a particle size of 40% or less relative to a volume average particle size based on Heywood diameter (equivalent circle diameter) as determined by image analysis using a scanning electron microscope.

公开(公告)号：US20170362465A1

公开(公告)日：2017-12-21

申请号：US15544389

申请日：2016-01-19

Applicant: FUJIMI INCORPORATED

Inventor： Keiji ASHITAKA ,  Shogo TSUBOTA

IPC: C09G1/02 ,  C01B33/149 ,  C07F7/02 ,  B24B37/04 ,  H01L21/3105 ,  C01B33/148 ,  C09K3/14 ,  H01L21/768

CPC classification number: C09G1/02 ,  B24B37/00 ,  B24B37/044 ,  C01B33/146 ,  C01B33/148 ,  C01B33/149 ,  C01P2004/03 ,  C01P2004/51 ,  C01P2004/61 ,  C07F7/025 ,  C09K3/14 ,  C09K3/1436 ,  H01L21/304 ,  H01L21/31053 ,  H01L21/76819

Abstract: To provide modified colloidal silica capable of improving the stability of the polishing speed with time when used as abrasive grains in a polishing composition for polishing a polishing object that contains a material to which charged modified colloidal silica easily adheres, such as a SiN wafer, and to provide a method for producing the modified colloidal silica.Modified colloidal silica, being obtained by modifying raw colloidal silica, whereinthe raw colloidal silica has a number distribution ratio of 10% or less of microparticles having a particle size of 40% or less relative to a volume average particle size based on Heywood diameter (equivalent circle diameter) as determined by image analysis using a scanning electron microscope.