Abstract:
A curable and hygroscopic resin composition for sealing electronic devices, comprising: a radically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a photo-radical polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition. wherein in Formula (1), R designates (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group having at least one selected from the group consisting of —O—, —S—, —CO—, and —NH—, between a carbon-carbon bond of the above-described hydrocarbon group; M designates a boron or aluminum atom; n is an integer of 2 to 20; and *1 and *2 each designate a binding site to a terminal group or are bonded to each other.
Abstract:
A filler material for an organic electroluminescent element, formed of a resin composition being liquid at 25° C., and containing a hydrocarbon polymer having a number average molecular weight of 300 or more and less than 32,000 and an organometallic compound represented by M-Ln (wherein, M represents a metal atom; L represents an organic group having 9 or more carbon atoms and 1 or more oxygen atoms, and all of L represent the same organic group; and n represents the valence of a metal atom M), wherein a contact angle to silicon nitride is 10 to 40 degrees, and an amount of outgassing other than moisture upon heating at 85° C. for 1 hour is 500 ppm or less in terms of a toluene equivalent, and a method of sealing an organic electroluminescent element using the same.
Abstract:
A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y
Abstract:
Provided is a power cable and a method for manufacturing a power cable that reduces occurrence of uneven thickness of an insulating layer and voids and peeling due to shrinkage and has good dielectric breakdown strength. The power cable includes the insulating layer containing 15 mass % or more of a propylene-based resin having a melting point of 110° C. or higher with respect to a whole. The power cable further includes a relationship between a cooling rate X [° C./min] at the time of manufacturing an interface portion in the insulating layer with the inner semiconductive layer and a cooling rate Y [° C./min] at the time of manufacturing a central portion of the insulating layer and is expressed by the relationship (Z), wherein X≥Y×0.8 . . . (Z).
Abstract:
An insulating tape, for coating a connection portion of a power cable, includes a resin material which includes polyethylene at least partially modified by a molecule imparting hydrophilicity, an antioxidant, and a crosslinking agent. The antioxidant has a molecular weight in a range of 190 or more and less than 1050. The antioxidant has a content in a range of 0.05 parts by mass or more and 0.8 parts by mass or less, with respect to 100 parts by mass of the polyethylene. The insulating tape has a thickness in a range of 50 μm or more and 250 μm or less.
Abstract:
An electronic-device-sealing resin composition and an organic EL element, having, as a crosslinkable organometallic desiccant, a metal complex compound having crosslinkable alkoxide represented by formula (1) as a ligand: M(ORx)n Formula (1) wherein, in formula (1), M designates Al, B, Ti or Zr; Rx in the ligand designates an alkyl group, an alkenyl group, an aryl group, a cycloalkyl group, a heterocyclic group, an acyl group, or a group represented by formula (a); at least one of Rx's has a crosslinkable group; and n designates a valence of M. wherein, in formula (a), O* designates O of ORx in formula (1); R1 designates an alkyl group, an alkenyl group or an acyl group; R2 designates a hydrogen atom or an alkyl group; and R3 designates an alkyl group or an alkoxy group.
Abstract:
A resin composition for sealing an organic electroluminescent device, containing: a drying agent, and a curable component, wherein a surface roughness Ra of the shear failure surface after curing the resin composition is 0.5 μm or more; a production method thereof; an adhesive film and a gas-barrier formed of the resin composition; an organic electroluminescent device and an organic electroluminescent panel using the same.
Abstract:
A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y
Abstract translation:提供了一种用于密封有机EL元件的透明树脂组合物和具有足够的阻止水分和优异柔性的效果的其它物质。 作为必需成分,含有以下化学式表示的热塑性树脂,增粘树脂和有机金属化合物,其透光率为85%以上,并且具有AM / Y <162的关系,A:除 有机金属化合物M:有机金属化合物的重均分子量Y:有机金属化合物相对于100重量份树脂成分的重量比,其中热塑性树脂含有苯乙烯基ABA型三嵌段的氢化物,其中R1 R 4表示碳原子数为1以上8以下的烷基,芳基,烷氧基,环烷基,酰基等有机基团,M表示3价的金属原子。