公开(公告)号：US09854687B2

公开(公告)日：2017-12-26

申请号：US14923034

申请日：2015-10-26

Applicant: FINISAR CORPORATION

Inventor： Maziar Amirkiai ,  Yunpeng Song ,  Hongyu Deng

IPC: H05K3/46 ,  H05K3/30 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/4682 ,  H05K1/0242 ,  H05K1/113 ,  H05K3/303 ,  H05K3/4667 ,  H05K3/467 ,  H05K3/4688 ,  H05K2201/0391 ,  H05K2201/094 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10121

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a multi-layer substrate with a bottom layer, a top layer having top thin film signal lines, and one or more intermediate layers having thick film traces between the top layer and the bottom layer, the thick film traces electrically coupled to the top thin film signal lines; and optoelectronic components positioned over the multi-layer substrate and electrically coupled with the signal lines.

公开(公告)号：US09848498B2

公开(公告)日：2017-12-19

申请号：US14923037

申请日：2015-10-26

Applicant: FINISAR CORPORATION

Inventor： Maziar Amirkiai ,  Yunpeng Song ,  Peter Henry Mahowald ,  Hongyu Deng

IPC: H05K3/32 ,  H05K1/18 ,  G02B6/00 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/32 ,  G02B6/00 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10545 ,  Y02P70/611

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.

公开(公告)号：US20130163917A1

公开(公告)日：2013-06-27

申请号：US13720512

申请日：2012-12-19

Applicant: FINISAR CORPORATION

Inventor： Maziar Amirkiai ,  Yunpeng Song ,  Hongyu Deng

IPC: G02B6/42

CPC classification number: G02B6/4201 ,  G02B6/4263 ,  G02B6/4271 ,  G02B6/4279

Abstract: An optical subassembly (OSA) with an extended radio frequency (RF) pin. In one example embodiment, an OSA includes a header, a metallic ring, an RF insulator eyelet, and an RF pin. The header defines an insulator opening and includes an internal header surface. The metallic ring extends above the internal header surface and includes a metallic ring inner diameter substantially equivalent to a diameter of the insulator opening. The RF insulator eyelet is positioned partially in the insulator opening and partially in the metallic ring and defines an RF pin opening. The RF pin is positioned in the RF pin opening and extends through the insulator opening and the metallic ring.

Abstract translation: 具有扩展射频（RF）引脚的光学子组件（OSA）。 在一个示例性实施例中，OSA包括头部，金属环，RF绝缘体孔眼和RF针脚。 集管限定绝缘体开口并且包括内部集管表面。 金属环在内部集管表面上方延伸，并且包括基本上等于绝缘体开口直径的金属环内径。 RF绝缘体孔眼部分地位于绝缘体开口中并且部分地位于金属环中并且限定RF引脚开口。 RF引脚定位在RF引脚开口中并延伸穿过绝缘体开口和金属环。