Systems and methods for monitoring junction temperature of a semiconductor switch

    公开(公告)号:US10955297B2

    公开(公告)日:2021-03-23

    申请号:US16002769

    申请日:2018-06-07

    Abstract: A system for monitoring a junction temperature of a semiconductor device includes a sensing resistor electrically coupled to a source terminal of the semiconductor device in a gate loop of the semiconductor device. The system includes a detection circuit electrically coupled to the gate loop of the semiconductor device and configured to measure a voltage difference across the sensing resistor. The system also includes an electronic control unit electrically coupled to the gate loop and the detection circuit. The electronic control unit is configured to determine a first gate current peak during a switching process of the semiconductor device, wherein the first gate current peak is determined based on the voltage detected by the detection circuit. The electronic control unit is configured to determine the junction temperature based on the first gate current peak.

    SYSTEMS AND METHODS FOR ACTIVE DAMPING OF A MOTOR

    公开(公告)号:US20180375456A1

    公开(公告)日:2018-12-27

    申请号:US15634723

    申请日:2017-06-27

    Abstract: A method includes controlling a first power output to an electric machine during a transient event. Controlling the first power output includes measuring values of the first power output provided to the electric machine during the transient event, receiving an estimated speed input of the electric machine, determining adjustment commands to compensate the first power output for the transient event of the electric machine, generating switch commands for gate drives of a variable frequency drive (VFD) based at least in part on the adjustment commands, and modifying the first power output during the transient event based on the switch commands.

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