公开(公告)号：US5039421A

公开(公告)日：1991-08-13

申请号：US415156

申请日：1989-10-02

申请人： Charles Linder ,  Mordechai Perry ,  Mara Nemas ,  Reuven Katraro

发明人： Charles Linder ,  Mordechai Perry ,  Mara Nemas ,  Reuven Katraro

IPC分类号： B01D67/00 ,  B01D69/12 ,  B01D71/42

CPC分类号： B01D67/0093 ,  B01D69/125 ,  B01D71/42 ,  B01D71/76 ,  B01D2323/30

摘要： A composite membrane for separating at least one dissolved or suspended component from a liquid phase, and characterized by solvent stability, comprises:(A) a substrate microfiltration, ultrafiltration or reverse osmosis membrane which has been initially formed from at least one member selected from non-crosslinked acrylonitrile homopolymers and copolymers, and non-crosslinked substituted acrylonitrile homopolymers and copolymers, and which has been subjected to at least one in situ crosslinking reaction; and(B) superimposed upon the substrate membrane, at least one coating including at least one component selected from hydrophilic monomers containing reactive functions, hydrophilic oligomers containing reactive functions and hydrophilic polymers containing reactive functions, such reactive functions having been subjected to a post-coating crosslinking reaction.

摘要翻译： 一种用于从液相中分离至少一种溶解或悬浮组分的复合膜，其特征在于溶剂稳定性，包括：（A）基材微量过滤，超滤或反渗透膜，其最初由至少一种选自非 - 交联的丙烯腈均聚物和共聚物，以及非交联的取代的丙烯腈均聚物和共聚物，并且已经进行了至少一个原位交联反应; 和（B）叠加在基材膜上的至少一种包含至少一种选自包含反应性官能团的亲水性单体的成分，含有反应性官能团的亲水性低聚物和含有反应性官能团的亲水性聚合物的涂层， 交联反应。

公开(公告)号：US09306056B2

公开(公告)日：2016-04-05

申请号：US12610148

申请日：2009-10-30

申请人： Deva Pattanayak ,  King Owyang ,  Mohammed Kasem ,  Kyle Terrill ,  Reuven Katraro ,  Kuo-In Chen ,  Calvin Choi ,  Qufei Chen ,  Ronald Wong ,  Kam Hong Lui ,  Robert Xu

发明人： Deva Pattanayak ,  King Owyang ,  Mohammed Kasem ,  Kyle Terrill ,  Reuven Katraro ,  Kuo-In Chen ,  Calvin Choi ,  Qufei Chen ,  Ronald Wong ,  Kam Hong Lui ,  Robert Xu

IPC分类号： H01L23/48 ,  H01L29/78 ,  H01L23/00 ,  H01L29/417 ,  H01L29/66 ,  H01L29/45

CPC分类号： H01L29/7809 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L29/408 ,  H01L29/41766 ,  H01L29/45 ,  H01L29/456 ,  H01L29/66734 ,  H01L29/7813 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/06051 ,  H01L2224/13007 ,  H01L2224/13014 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device (e.g., a flip chip) includes a substrate layer that is separated from a drain contact by an intervening layer. Trench-like feed-through elements that pass through the intervening layer are used to electrically connect the drain contact and the substrate layer when the device is operated.

摘要翻译： 半导体器件（例如，倒装芯片）包括通过中间层与漏极接触分离的衬底层。 通过中间层的沟槽状馈通元件用于在器件工作时电连接漏极接触和衬底层。

公开(公告)号：US20110101525A1

公开(公告)日：2011-05-05

申请号：US12610148

申请日：2009-10-30

申请人： Deva Pattanayak ,  King Owyang ,  Mohammed Kasem ,  Kyle Terrill ,  Reuven Katraro ,  Kuo-In Chen ,  Calvin Choi ,  Qufei Chen ,  Ronald Wong ,  Kam Hong Lui ,  Robert Xu

发明人： Deva Pattanayak ,  King Owyang ,  Mohammed Kasem ,  Kyle Terrill ,  Reuven Katraro ,  Kuo-In Chen ,  Calvin Choi ,  Qufei Chen ,  Ronald Wong ,  Kam Hong Lui ,  Robert Xu

IPC分类号： H01L23/48 ,  H01L23/488 ,  H01L21/768

CPC分类号： H01L29/7809 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L29/408 ,  H01L29/41766 ,  H01L29/45 ,  H01L29/456 ,  H01L29/66734 ,  H01L29/7813 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/06051 ,  H01L2224/13007 ,  H01L2224/13014 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device (e.g., a flip chip) includes a substrate layer that is separated from a drain contact by an intervening layer. Trench-like feed-through elements that pass through the intervening layer are used to electrically connect the drain contact and the substrate layer when the device is operated.

摘要翻译： 半导体器件（例如，倒装芯片）包括通过中间层与漏极接触分离的衬底层。 通过中间层的沟槽状馈通元件用于在器件工作时电连接漏极接触和衬底层。

公开(公告)号：US07907090B2

公开(公告)日：2011-03-15

申请号：US11759523

申请日：2007-06-07

申请人： Eli Bershadsky ,  Marina Kravchik ,  Reuven Katraro ,  David Ben-Bassat ,  Dani Alon

发明人： Eli Bershadsky ,  Marina Kravchik ,  Reuven Katraro ,  David Ben-Bassat ,  Dani Alon

IPC分类号： H01Q1/24

CPC分类号： C04B35/47 ,  C04B2235/3208 ,  C04B2235/3215 ,  C04B2235/3229 ,  C04B2235/3236 ,  C04B2235/3244 ,  C04B2235/3248 ,  C04B2235/3262 ,  C04B2235/3284 ,  C04B2235/3298 ,  C04B2235/349 ,  C04B2235/36 ,  C04B2235/656 ,  C04B2235/72

摘要： A dielectric ceramic composition has a dielectric constant, K, of at least 200 and a dielectric loss, DF, of 0.0006 or less at 1 MHz. The dielectric ceramic composition may be formed by sintering by firing in air without a controlled atmosphere. The dielectric ceramic composition may have a major component of 92.49 to 97.5 wt. % containing 60.15 to 68.2 wt. % strontium titanate, 11.02 to 23.59 wt. % calcium titanate and 7.11 to 21.32 wt. % barium titanate; and a minor component of 2.50 to 7.51 wt. % containing 1.18 to 3.55 wt. % calcium zirconate, 0.50 to 1.54 wt. % bismuth trioxide, 0.2 to 0.59 wt. % zirconia, 0.02 to 0.07 wt. % manganese dioxide, 0.12 to 0.35 wt. % zinc oxide, 0.12 to 0.35 wt. % lead-free glass frit, 0.24 to 0.71 wt. % kaolin clay and 0.12 to 0.35 wt. % cerium oxide. UHF antennas and monolithic ceramic components may use the dielectric ceramic composition.

摘要翻译： 介电陶瓷组合物的介电常数K至少为200，介电损耗DF在1MHz时为0.0006以下。 电介质陶瓷组合物可以通过在没有受控气氛的空气中烧制而烧结而形成。 介电陶瓷组合物可以具有92.49至97.5重量％的主要组分。 ％含有60.15〜68.2重量％ ％钛酸锶，11.02〜23.59重量％ 钛酸钙和7.11〜21.32重量％ ％钛酸钡; 和2.50〜7.51重量％的次要组分。 ％含有1.18〜3.55重量％ 锆酸钙，0.50〜1.54重量％ 三氧化二铋，0.2〜0.59重量％ ％氧化锆，0.02〜0.07重量％ ％二氧化锰，0.12〜0.35wt。 ％氧化锌，0.12〜0.35重量％ ％无铅玻璃料，0.24至0.71wt。 ％的高岭土和0.12〜0.35wt。 ％的氧化铈。 UHF天线和单片陶瓷组件可以使用介电陶瓷组合物。

公开(公告)号：US20070127189A1

公开(公告)日：2007-06-07

申请号：US11293673

申请日：2005-12-02

申请人： Reuven Katraro ,  Lilia Kushnarev ,  Nissim Cohen ,  Haim Goldberger

发明人： Reuven Katraro ,  Lilia Kushnarev ,  Nissim Cohen ,  Haim Goldberger

IPC分类号： H01G4/06

CPC分类号： H01G9/012 ,  H01G2/065 ,  H01G9/042 ,  H01G9/0425 ,  H01G9/08 ,  Y10T29/41 ,  Y10T29/417

摘要： A surface mount chip capacitor includes a metal substrate, a conductive powder element comprising a valve metal and partially surrounding the metal substrate with the metal substrate extending outwardly from the conductive powder towards the anode end of the surface mount chip capacitor, a silver body cathode at least partially surrounding the conductive powder element, a coating formed by vapor-phase deposition surrounding the silver body cathode, an insulative material formed about a portion of the substrate extending outwardly from the conductive powder, a conductive coating formed around the metal substrate at the anode end of the surface mount chip capacitor, an end termination anode electrically connected to the conductive coating at the anode end of the surface mount chip capacitor, and an end termination cathode electrically connected to the silver body cathode at the cathode end of the surface mount chip capacitor.

摘要翻译： 表面安装片式电容器包括金属基板，包括阀金属的导电粉末元件，并且部分地围绕金属基板，金属基板从导电粉末朝向表面安装片式电容器的阳极端向外延伸，银体阴极 至少部分地围绕导电粉末元件，通过围绕银体阴极的气相沉积形成的涂层，围绕从导电粉末向外延伸的部分基板形成的绝缘材料，在阳极处形成在金属基板周围的导电涂层 表面安装片式电容器的端部，与表面贴装电容器的阳极端处的导电涂层电连接的端接端子阳极，以及电连接到表面安装芯片的阴极端处的银体阴极的端部端子阴极 电容器。

公开(公告)号：US5265734A

公开(公告)日：1993-11-30

申请号：US986753

申请日：1992-12-08

申请人： Charles Linder ,  Mara Nemas ,  Mordechai Perry ,  Reuven Katraro

发明人： Charles Linder ,  Mara Nemas ,  Mordechai Perry ,  Reuven Katraro

IPC分类号： B01D69/02 ,  B01D69/12 ,  B01D71/42 ,  B01D71/70 ,  B01D61/02 ,  B01D61/14

CPC分类号： B01D69/02 ,  B01D69/125 ,  B01D71/42 ,  B01D71/70

摘要： A composite membrane comprises a substrate made from a polymer selected from copolymers and homopolymers of ethylenically unsaturated nitriles, which substrate has preferably first been treated with a pore protector in absence of curing agents and catalysts therefor, prior to applying as the final coating a silicone layer, which is crosslinked. The pore protector, which may be, for example, a hydroxy-terminated polysiloxane, particularly a silanol-terminated polysiloxane, serves the dual purpose of preventing the pores from collapsing, when the support is dried during the curing of the silicone layer, and of preventing passage of the coating material deeply into the pores and thus also preventing an undue reduction of the flux of the finished coated membrane. Such composite membranes include solvent stable membranes which swell to an extent of no more than about 10% when immersed in various organic solvents, and their mixtures with each other and/or water.

摘要翻译： 复合膜包括由选自共聚物和烯键式不饱和腈的均聚物的聚合物制成的基材，该基材优选首先在没有固化剂和催化剂的情况下首先用孔保护剂处理，然后在作为最终涂层施加硅树脂层 ，其是交联的。 孔保护剂可以是例如羟基封端的聚硅氧烷，特别是硅烷醇封端的聚硅氧烷，其用途是防止当硅氧烷层固化期间载体干燥时孔隙塌陷的双重目的，以及 防止涂层材料深深地渗透到孔中，从而也防止成品涂布膜的焊剂过度减少。 这种复合膜包括当浸入各种有机溶剂中时其膨胀至不超过约10％程度的溶剂稳定的膜，以及它们彼此的混合物和/或水。

公开(公告)号：US20070253143A1

公开(公告)日：2007-11-01

申请号：US11415039

申请日：2006-05-01

申请人： Haim Goldberger ,  Reuven Katraro ,  Doron Gozaly

发明人： Haim Goldberger ,  Reuven Katraro ,  Doron Gozaly

IPC分类号： H01G4/228

CPC分类号： H01G4/228 ,  H01G4/33 ,  H01L2224/11

摘要： An electronic component such as a capacitor includes a substrate having first and second principal surfaces, a dielectric layer overlaying the first principal surface of the substrate, a first electrode, and a second electrode. There is a passivation layer overlaying the first and second electrodes, a first opening being formed in the passivation layer over the first electrode and a second opening being formed in the passivation layer over the second electrode. A first bottom electrode termination is positioned in the first opening and a second bottom electrode termination is positioned in the second opening. The first bottom electrode termination is electrically connected to the first electrode and the second bottom electrode termination is electrically connected to the second electrode. A standoff is positioned between the first bottom electrode termination and the second bottom electrode termination and attached to the passivation layer to thereby provide support for the electronic component when mounted. The standoff provides resistance to tilting.

摘要翻译： 诸如电容器的电子部件包括具有第一和第二主表面的基板，覆盖基板的第一主表面的电介质层，第一电极和第二电极。 存在覆盖第一和第二电极的钝化层，第一开口形成在第一电极上的钝化层中，第二开口形成在第二电极上的钝化层中。 第一底部电极终端位于第一开口中，而第二底部电极终端位于第二开口中。 第一底部电极端子电连接到第一电极，第二底部电极端子电连接到第二电极。 间隔件位于第一底部电极端子和第二底部电极端子之间并且附接到钝化层，从而在安装时为电子部件提供支撑。 对立提供了对倾斜的抵抗力。

公开(公告)号：US07283350B2

公开(公告)日：2007-10-16

申请号：US11293673

申请日：2005-12-02

申请人： Reuven Katraro ,  Lilia Kushnarev ,  Nissim Cohen ,  Haim Goldberger

发明人： Reuven Katraro ,  Lilia Kushnarev ,  Nissim Cohen ,  Haim Goldberger

IPC分类号： H01G9/00

CPC分类号： H01G9/012 ,  H01G2/065 ,  H01G9/042 ,  H01G9/0425 ,  H01G9/08 ,  Y10T29/41 ,  Y10T29/417

摘要： A surface mount chip capacitor includes a metal substrate, a conductive powder element including a valve metal and partially surrounding the metal substrate with the metal substrate extending outwardly from the conductive powder towards the anode end of the surface mount chip capacitor, a silver body cathode at least partially surrounding the conductive powder element, a coating formed by vapor-phase deposition surrounding the silver body cathode, an insulative material formed about a portion of the substrate extending outwardly from the conductive powder, a conductive coating formed around the metal substrate at the anode end of the surface mount chip capacitor, an end termination anode electrically connected to the conductive coating at the anode end of the surface mount chip capacitor, and an end termination cathode electrically connected to the silver body cathode at the cathode end of the surface mount chip capacitor.

摘要翻译： 表面安装片式电容器包括金属基板，包括阀金属的导电粉末元件，并部分地围绕金属基板，金属基板从导电粉末朝向表面安装片式电容器的阳极端向外延伸，银体阴极 至少部分地围绕导电粉末元件，通过围绕银体阴极的气相沉积形成的涂层，围绕从导电粉末向外延伸的部分基板形成的绝缘材料，在阳极处形成在金属基板周围的导电涂层 表面安装片式电容器的端部，与表面贴装电容器的阳极端处的导电涂层电连接的端接端子阳极，以及电连接到表面安装芯片的阴极端处的银体阴极的端部端子阴极 电容器。

公开(公告)号：US5057197A

公开(公告)日：1991-10-15

申请号：US348802

申请日：1989-05-08

申请人： Mordechai Perry ,  Reuven Katraro ,  Charles Linder

发明人： Mordechai Perry ,  Reuven Katraro ,  Charles Linder

IPC分类号： A23F5/16 ,  A23F5/18 ,  A23L2/74 ,  B01D61/52 ,  B01D61/58 ,  C07C51/42

CPC分类号： A23F5/16 ,  A23F5/18 ,  A23L2/74 ,  B01D61/52 ,  B01D61/58 ,  C07C51/42 ,  B01D61/025 ,  B01D61/145 ,  B01D61/147 ,  B01D61/422

摘要： An efficient process and system for the removal of at least one organic acid from aqueous feed streams.

摘要翻译： 用于从含水进料流中除去至少一种有机酸的有效方法和系统。

公开(公告)号：US09070512B2

公开(公告)日：2015-06-30

申请号：US12052251

申请日：2008-03-20

申请人： Steve Breithaupt ,  Nissim Cohen ,  Alex Eidelman ,  Reuven Katraro

发明人： Steve Breithaupt ,  Nissim Cohen ,  Alex Eidelman ,  Reuven Katraro

IPC分类号： H01G9/00 ,  H01G9/042

CPC分类号： H01G9/0425 ,  Y10T29/417

摘要： An electrolytic capacitor includes a metal case, a porous pellet anode disposed within the metal case, an electrolyte disposed within the metal case, and a cathode element formed of an electrophoretically deposited metal or metal oxide powder of a uniform thickness disposed within the metal case and surrounding the anode. A method of manufacturing an electrolytic capacitor includes providing a metal case, electrophoretically depositing on the metal can a refractory metal oxide to form a cathode element, and placing a porous pellet anode and an electrolyte within the can such that the cathode element and the anode element being separated by the electrolyte.

摘要翻译： 电解电容器包括金属壳体，设置在金属壳体内的多孔质颗粒阳极，设置在金属壳体内的电解质和由金属壳体内布置的均匀厚度的电泳沉积金属或金属氧化物粉末形成的阴极元件， 围绕阳极。 一种制造电解电容器的方法包括提供金属壳体，在金属罐上电泳沉积耐火金属氧化物以形成阴极元件，并将多孔颗粒阳极和电解质放置在罐内，使得阴极元件和阳极元件 被电解质分离。