公开(公告)号：US07002529B2

公开(公告)日：2006-02-21

申请号：US10474426

申请日：2002-03-11

申请人： Hideki Sasaki ,  Masaharu Imazato ,  Yuji Muramatsu ,  Toshio Kaku ,  Hidenori Muramatsu ,  Toshihide Kuriyama ,  Takashi Yoshinaga

发明人： Hideki Sasaki ,  Masaharu Imazato ,  Yuji Muramatsu ,  Toshio Kaku ,  Hidenori Muramatsu ,  Toshihide Kuriyama ,  Takashi Yoshinaga

IPC分类号： H01Q1/48

CPC分类号： H01Q1/2275 ,  H01Q1/22 ,  H01Q1/2258 ,  H01Q9/0421 ,  H04B1/38 ,  H04B15/00 ,  H05K1/141 ,  H05K1/16

摘要： Second ground plane (18), substantially rectangular in shape, is connected to first ground plane (17) mounted with a data processing circuit, and radio communication circuit (12) makes radio communications at communication wavelength λ. A portion of second ground plane (18) from ground connecting means (14) to ground connecting means (33) along continuous edges of second ground plane (18) acts as an antenna. However, since the longest distance a between a plurality of ground connecting means (14, 33) along the continuous edges of second ground plane (18) satisfies “a

摘要翻译： 连接到安装有数据处理电路的第一接地平面（17）上的基本上矩形的第二接地平面（18），无线电通信电路（12）进行通信波长λ的无线电通信。 从地面连接装置（14）到第二接地平面（18）的连续边缘的接地连接装置（33）的第二接地平面（18）的一部分用作天线。 然而，由于沿着第二接地平面（18）的连续边缘的多个接地连接装置（14,33）之间的最长距离a满足“a <λ/ 2alpha”（其中α是等于或大于“ 1“），其谐振频率足够高于无线电通信电路的通信频率。

公开(公告)号：US20100096174A1

公开(公告)日：2010-04-22

申请号：US12450690

申请日：2008-04-09

申请人： Takashi Nakano ,  Masaharu Imazato ,  Yoji Nishio

发明人： Takashi Nakano ,  Masaharu Imazato ,  Yoji Nishio

IPC分类号： H05K1/18 ,  H05K1/11

CPC分类号： H01P1/20336 ,  H01P1/20363 ,  H05K1/0216 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09618 ,  H05K2201/09627

摘要： A plurality of vias is disposed side by side on a multilayer board. A first via which is one of the vias disposed at one outer portion is electrically connected to a first outgoing line provided on the multilayer board. A second via at the other outer portion is electrically connected to a second outgoing line provided on the multilayer board. A plurality of the vias is connected to a first fixed potential layer (a ground layer, for example) of the multilayer board. At least one second fixed potential layer is provided, with a plurality of the vias through a clearance and having the same potential as that of the first fixed potential layer, as an inner layer of the multilayer board between the first and second outgoing lines and the fixed potential layer. Therefore, a BPF whose rate of occupied area is low is formed on the multilayer board without additional production processes.

摘要翻译： 多个通孔并排设置在多层板上。 设置在一个外部部分的通孔之一的第一通孔电连接到设置在多层板上的第一输出线。 在另一个外部部分的第二通道电连接到设置在多层板上的第二出线。 多个通孔连接到多层板的第一固定电位层（例如，接地层）。 提供至少一个第二固定电位层，其中多个通孔具有与第一固定电位层相同的间隙并具有相同的电位，作为第一和第二出射线之间的多层板的内层和 固定电位层。 因此，在多层板上形成占用面积小的BPF，而无需附加的制造工序。

公开(公告)号：US20050270758A1

公开(公告)日：2005-12-08

申请号：US11134132

申请日：2005-05-20

申请人： Masaharu Imazato ,  Atsushi Nakamura ,  Takayuki Watanabe ,  Kensuke Tsuneda ,  Mitsuaki Katagiri ,  Hiroya Shimizu ,  Tatsuya Nagata

发明人： Masaharu Imazato ,  Atsushi Nakamura ,  Takayuki Watanabe ,  Kensuke Tsuneda ,  Mitsuaki Katagiri ,  Hiroya Shimizu ,  Tatsuya Nagata

IPC分类号： H05K9/00 ,  G11C5/00 ,  H01L23/00 ,  H05K1/02

CPC分类号： G11C5/04 ,  H05K1/0218 ,  H05K9/0064

摘要： In a memory module, reference potential connecting patterns are disposed on high frequency signal lines and/or on the extension lines extending from the terminal ends of the signal lines as well as a shield cover for covering semiconductor memory chips is disposed on the substrate, and the reference potential connecting patterns are connected to the shield cover through metal cover contact parts.

摘要翻译： 在存储器模块中，参考电位连接图案设置在高频信号线上和/或从信号线的末端延伸的延长线上，并且用于覆盖半导体存储器芯片的屏蔽盖设置在基板上，以及 参考电位连接图案通过金属盖接触部分连接到屏蔽罩。

公开(公告)号：US08847697B2

公开(公告)日：2014-09-30

申请号：US13390045

申请日：2010-06-25

申请人： Masaharu Imazato

发明人： Masaharu Imazato

IPC分类号： H04B3/28 ,  H04B10/00 ,  H04B5/00

CPC分类号： H04B10/00 ,  H04B5/0037

摘要： A communication system of the present invention includes: a communication coupler that transmits a signal; and a signal transmitting apparatus that communicates by propagating, as an electromagnetic field, the signal transmitted from the communication coupler, the communication coupler includes a coupler case disposed on the signal transmitting apparatus, a noise suppressing section is provided on a lower end surface of the coupler case, the lower end surface faces the signal transmitting apparatus, and the noise suppressing section suppresses noise by creating a high impedance.

摘要翻译： 本发明的通信系统包括：发送信号的通信耦合器; 以及信号发送装置，其通过从通信耦合器传输的信号作为电磁场传播，所述通信耦合器包括设置在所述信号发送装置上的耦合器壳体，噪声抑制部分设置在所述信号发送装置的下端面上 耦合器壳体，下端面面向信号发送装置，噪声抑制部通过产生高阻抗来抑制噪声。

公开(公告)号：US20100091462A1

公开(公告)日：2010-04-15

申请号：US12527320

申请日：2008-02-13

申请人： Masaharu Imazato ,  Masayasu Ono ,  Naoto Yamazaki

发明人： Masaharu Imazato ,  Masayasu Ono ,  Naoto Yamazaki

IPC分类号： H05K7/20

CPC分类号： H05K1/0216 ,  H05K1/0203 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/162 ,  H05K2201/10204 ,  H05K2201/1056

摘要： A noise electric current flowing through a heat sink is efficiently discharged to the ground of a printed circuit board to reduce levels of clock signal harmonic noises generated from the heat sink. An electronic device-installed apparatus is provided with a printed circuit board (1), one or more of electronic devices (2, 3) that are mounted on the printed circuit board (1) and that operate in accordance with a clock signal, and a heat sink means set to hold the electronic devices (2, 3) together with the printed circuit board (1). The heat sink means (5) is connected with the ground of the printed circuit board (1) through a connecting unit (6) and a plurality of dielectric components (12), which are independent of the electronic devices (2, 3), are provided between portions of the printed circuit board except those on which the electronic devices (2, 3) are mounted and the heat sink means (5).

摘要翻译： 流过散热器的噪声电流被有效地放电到印刷电路板的地面，以减少从散热器产生的时钟信号谐波噪声的水平。 电子装置安装装置设置有印刷电路板（1），一个或多个安装在印刷电路板（1）上并根据时钟信号操作的电子设备（2,3），以及 设置用于将电子设备（2,3）与印刷电路板（1）一起保持的散热装置。 散热装置（5）通过连接单元（6）和独立于电子设备（2,3）的多个电介质部件（12）与印刷电路板（1）的接地连接， 设置在除了安装有电子设备（2,3）的那些部分之外的印刷电路板的部分和散热装置（5）之间。

公开(公告)号：US20100061072A1

公开(公告)日：2010-03-11

申请号：US12374602

申请日：2007-07-11

申请人： Masaharu Imazato ,  Takao Ono

发明人： Masaharu Imazato ,  Takao Ono

IPC分类号： H05K1/11

CPC分类号： H05K1/0218 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/09181 ,  H05K2201/09354 ,  H05K2201/09618

摘要： Ground via provided in an end portion of a multi-layer printed circuit board so as to suppress a leakage of magnetic field from the end portion of the board causes a problem that a digital circuit of high density cannot be mounted on the board due to necessity of area for locating the ground via. Further, a case of using solder plating for the end portion of the board causes a problem that manufacturing process is added and that numbers of days and costs for manufacturing the multi-layer printed circuit board are increased.In a multi-layer printed circuit board has a plurality of ground layers and at least one signal layer, the signal layer in which a signal pattern is wired at an end portion of the multi-layer printed circuit board is sandwiched between upper adjacent and lower adjacent ground layers, and the upper adjacent and lower adjacent ground layers are connected to each other by recessed conductors at the end portion thereof. In addition, an interval between the recessed conductors is not larger than λ/8 of a higher harmonic frequency as an operable frequency.

摘要翻译： 通过设置在多层印刷电路板的端部的接地通路，以抑制来自电路板端部的磁场的泄漏，导致高密度的数字电路由于必要而无法安装在电路板上的问题 用于定位地面通孔。 此外，使用焊料电镀用于电路板端部的情况引起了加工制造工艺的问题，并且增加了用于制造多层印刷电路板的天数和成本。 在多层印刷电路板中具有多个接地层和至少一个信号层，其中在多层印刷电路板的端部布置有信号图案的信号层被夹在上邻近和下层之间 相邻的接地层，并且上邻近和下相邻的接地层在其端部处由凹入的导体彼此连接。 此外，凹入导体之间的间隔不大于作为可操作频率的高次谐波频率的λ/ 8。

公开(公告)号：US20090279265A1

公开(公告)日：2009-11-12

申请号：US12441829

申请日：2007-08-27

申请人： Masaharu Imazato

发明人： Masaharu Imazato

IPC分类号： H05K7/20

CPC分类号： H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink plate is mounted on an electronic device for heat radiation of the electronic device. When the fundamental wave or a harmonic wave of the clock signal of the electronic device is coincide with the size of the heat sink plate, the heat sink plate resonates and large clock signal harmonic wave noise is radiated. For suppressing the noise, a dielectric strip is mounted on an edge portion of the heat sink plate. By this dielectric strip, the resonance frequency of the heat sink plate varies so that the resonance can be suppressed.

摘要翻译： 散热板安装在电子设备上用于电子设备的散热。 当电子设备的时钟信号的基波或谐波与散热板的尺寸一致时，散热板谐振并且大的时钟信号谐波噪声被辐射。 为了抑制噪声，将介质条安装在散热板的边缘部分上。 通过该介质条，散热板的谐振频率发生变化，从而可以抑制谐振。

公开(公告)号：US07345892B2

公开(公告)日：2008-03-18

申请号：US11134132

申请日：2005-05-20

申请人： Masaharu Imazato ,  Atsushi Nakamura ,  Takayuki Watanabe ,  Kensuke Tsuneda ,  Mitsuaki Katagiri ,  Hiroya Shimizu ,  Tatsuya Nagata

发明人： Masaharu Imazato ,  Atsushi Nakamura ,  Takayuki Watanabe ,  Kensuke Tsuneda ,  Mitsuaki Katagiri ,  Hiroya Shimizu ,  Tatsuya Nagata

IPC分类号： H09K9/00

CPC分类号： G11C5/04 ,  H05K1/0218 ,  H05K9/0064

摘要： In a memory module, reference potential connecting patterns are disposed on high frequency signal lines and/or on the extension lines extending from the terminal ends of the signal lines as well as a shield cover for covering semiconductor memory chips is disposed on the substrate, and the reference potential connecting patterns are connected to the shield cover through metal cover contact parts.

摘要翻译： 在存储器模块中，参考电位连接图案设置在高频信号线上和/或从信号线的末端延伸的延长线上，并且用于覆盖半导体存储器芯片的屏蔽盖设置在基板上，以及 参考电位连接图案通过金属盖接触部分连接到屏蔽罩。