Abstract:
This disclosure provides systems, methods, and apparatus for mitigating the effects of interference signals on optical signals received at a direct-detection optical receivers. The optical receivers are capable of attenuating interference noise signals resulting from the interference between a transmitted optical signal transmitted from a transmitter to the optical receiver and one or more additional signals received at the optical receiver. The interference can be due to multi-path interference or due to in-band interference. The receivers include a tunable filter for filtering the received optical signal to remove the interference. A frequency offset module processes the received optical signal to determine a frequency offset indicative of the difference between the carrier frequencies of a modulated optical signal and an interference optical signal. The offset frequency and a bandwidth determined by the frequency offset module can be used to adjust the tunable filter to remove the interference signal from the received signal.
Abstract:
Systems and methods for achieving eye safety of an optical transceiver are provided. An optical module can be configured to output a first optical signal. A first photodetector can be configured to output a signal indicative of a presence or absence of a second optical signal. A controller can be coupled to the optical module and the first photodetector and can be configured to control the output of the optical module. In response to a determination that an output of the first photodetector indicates the second optical signal is absent, the controller can control the optical module to output the first signal at a decreased average optical power. In response to a determination that an output of the first photodetector indicates the second optical signal is present, the controller can control the optical module to output the first signal at an increased average optical power.
Abstract:
Systems and methods for increasing bandwidth in a computer network are provided. A computer network can include a first lower level switch having a first port and a second port. The computer network can include a second lower level switch having a first port and a second port. The computer network can include an upper level switch having respective ports directly coupled to ports of the first and second lower level switches. A third port of the upper level switch can couple to a first port of a passive optical splitter. The passive optical splitter can have second and third ports coupled to respective ports of the first and second lower level switches. The passive optical splitter can be configured to transmit signals received at its first port as output signals on both of its second and third ports.
Abstract:
The disclosure describes implementations of an apparatus including a plurality of racks, wherein each rack houses a plurality of networking devices and each networking device includes a communication port. An optical circuit switch can be coupled to each of the plurality of communication ports in one or more of the plurality of racks, and a plurality of top-of-rack (TOR) switches can be coupled to the optical circuit switch. Other implementations are disclosed and claimed.
Abstract:
Signal integrity in high-speed applications is dependent on both the underlying device performance and electronic packaging methods. The maturity of chip-on-board (COB) packaging technology using wire bonding makes it a cost beneficial option for the mass production of high-speed optical transceivers. However, wire bonding introduces parasitic inductance associated with the length of the bond wires that limits the scalability of the system for higher data throughput. A high-speed optical transceiver package according to a first proposed configuration minimizes packaging related parasitic inductance by vertically integrating components using flip-chip bonding. A high-speed optical transceiver package according to a second proposed configuration minimizes packaging related parasitic inductance with horizontal tiling of components using a chip carrier and flip-chip bonding.
Abstract:
This disclosure provides systems, methods, and apparatus for mitigating the effects of an optical link in a communication system on polarization angles of signals transmitted over the optical link. The communication system can include an optical transmitter transmitting polarization-division multiplexed (PDM) optical signals over the optical link and a direct-detection receiver for receiving the PDM optical signals. The transmitter can include a polarization compensation unit for receiving estimated values of link polarization parameters from the receiver. The receiver uses the estimated values to pre-distort modulator drive and bias signals and to adjust the relative phase between modulated optical signals. The transmitter can also transmit training optical signals to the receiver over the optical link. The receiver uses the training optical signals to estimate the values of link polarization parameters. The receiver also can include a crosstalk mitigation unit for mitigating effects of crosstalk between the PDM optical signals.
Abstract:
This disclosure provides systems, methods, and apparatus for a photonic chip. The photonic chip includes one or more electronic components in addition to one or more optical components. Grating couplers can be utilized for coupling light incident from an optical fibers or lasers with the optical components on the photonic chip. The grating couplers can be designed to have a wide bandwidth to support applications such as wave division multiplexing (WDM). The wide bandwidth can be achieved by reducing a mode field diameter (MFD) of the light beams incident on the grating couplers, and selecting a beam size of the optical couplers to be substantially equal to MFD. The bandwidth can be further improved by using thin silicon layer for fabricating the ridges of the grating coupler. Grating couplers with relatively large beam sizes can be utilized for coupling light output by lasers with the optical components on the chip.
Abstract:
Systems and methods for reducing temperature of an optical signal source co-packaged with a driver are provided. An optical transmitter can include a housing. The optical transmitter can include an optical signal source positioned within the housing. The optical transmitter can include a signal source driver positioned within the housing and configured to control an output of the optical signal source. The optical transmitter can include a substrate mounted on an interior surface of the housing and having a microwave waveguide coupled to it. The microwave waveguide can be configured to direct electrical signals originating outside the housing to the signal source driver. The substrate is can also be configured to limit heat transfer from the signal source driver to the optical signal source.
Abstract:
Systems and methods for increasing bandwidth in a computer network are provided. A computer network can include a first lower level switch having a first port and a second port. The computer network can include a second lower level switch having a first port and a second port. The computer network can include an upper level switch having respective ports directly coupled to ports of the first and second lower level switches. A third port of the upper level switch can couple to a first port of a passive optical splitter. The passive optical splitter can have second and third ports coupled to respective ports of the first and second lower level switches. The passive optical splitter can be configured to transmit signals received at its first port as output signals on both of its second and third ports.
Abstract:
The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver coupled to an area of a printed circuit board that includes a plurality of thermal microvias. The thermal microvias are coupled to a heat sink or other heat dissipater and provide a path from the components of the optical transceiver to the heat dissipater for heat to travel.