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公开(公告)号：US10695015B2
公开(公告)日：2020-06-30
申请号：US16323527
申请日：2017-08-09
摘要： The present embodiment relates to a radiation imaging system and the like provided with a solid-state imaging device having a structure enabling reduction of linear noise appearing in an integrated image. The solid-state imaging device comprises: L pieces of imaging pixel region arranged along a direction crossing a moving direction of a relative position of the solid-state imaging device; and L pieces of A/D converter provided corresponding to the L pieces of imaging pixel region. Each imaging pixel region includes pixels arranged two-dimensionally to form an M-row by N-column matrix. Any one of the L pieces of A/D converter executes a dummy A/D conversion once or more times after an A/D conversion of an electric signal from a pixel of an m-th row, before an A/D conversion of an electric signal from a pixel of an (m+1)-th row.
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公开(公告)号：US10090341B2
公开(公告)日：2018-10-02
申请号：US14897144
申请日：2014-05-29
发明人： Kazuki Fujita , Ryuji Kyushima , Harumichi Mori
IPC分类号： H01L27/00 , H01L27/146 , H04N5/32 , H04N5/359
摘要： A solid-state imaging device comprises a photodetecting section, an unnecessary carrier capture section, and a vertical shift register. The unnecessary carrier capture section has carrier capture regions arranged in a region between the photodetecting section and the vertical shift register for respective rows. Each of the carrier capture regions includes a transistor and a photodiode. The transistor has one terminal connected to the photodiode and the other terminal connected to a charge elimination line. The charge elimination line is short-circuited to a reference potential line.
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公开(公告)号：US09909921B2
公开(公告)日：2018-03-06
申请号：US15101087
申请日：2014-11-18
发明人： Minoru Ichikawa , Kazuki Fujita , Harumichi Mori
CPC分类号： G01J1/4228 , G01T1/16 , G01T1/2928 , H04N5/32 , H04N5/347 , H04N5/37455
摘要： An adding unit adds an input signal generated in a signal generating unit connected to a specific pixel electrode portion out of pixel electrode portions arranged around a certain pixel electrode portion to an input signal generated in a signal generating unit connected to the certain pixel electrode portion. A discriminating unit discriminates whether a carrier input pattern coincides with any one of a plurality of discrimination patterns, and the carrier input pattern indicates, per the pixel electrode portion, presence of any carrier received in the certain pixel electrode portion and the pixel electrode portions arranged around the certain pixel electrode portion. The counting unit increments the number of photons in the case where the discriminating unit discriminates that the carrier input pattern coincides with any one of the discrimination patterns and further the input signal output from the adding unit after addition has a value exceeding a predetermined threshold.
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公开(公告)号：US09761631B2
公开(公告)日：2017-09-12
申请号：US15102376
申请日：2014-11-28
发明人： Kazuki Fujita , Minoru Ichikawa , Harumichi Mori
IPC分类号： H01L27/148 , H01L27/146
CPC分类号： H01L27/148 , H01L27/14634 , H01L27/14636
摘要： A radiation image sensor includes a charge generation section and, a circuit board accumulating and transferring charge generated in the charge generation section. The circuit board includes a semiconductor substrate, a capacitive section accumulating the charge generated in the charge generation section, and a MOS transistor in the semiconductor substrate. The MOS transistor includes one end connected to the capacitive section and another end connected to a wire transferring the charge. The capacitive section includes a partial region of the semiconductor substrate, a conductor layer disposed on the partial region and electrically connected to the charge generation section, and an insulating layer interposed between the partial region and the conductor layer.
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公开(公告)号：US09571766B2
公开(公告)日：2017-02-14
申请号：US14896023
申请日：2014-05-29
发明人： Kazuki Fujita , Ryuji Kyushima , Harumichi Mori
IPC分类号： H04N3/14 , H04N5/335 , H04N5/369 , H04N5/32 , H04N5/367 , H01L27/146 , H04N5/374 , H04N5/378
CPC分类号： H04N5/3698 , H01L27/14603 , H01L27/14609 , H01L27/14618 , H01L27/14632 , H01L27/14658 , H01L27/14661 , H01L27/14663 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/49175 , H04N5/32 , H04N5/367 , H04N5/369 , H04N5/374 , H04N5/378 , H01L2924/00014 , H01L2924/00
摘要： A solid-state imaging device includes a sensor panel section and a readout circuit section. The sensor panel section is disposed on a glass substrate and has a photodetecting section including pixels arrayed in M rows and N columns, row selection lines, and readout lines. The readout circuit section is disposed on a substrate and has N integration circuits. Rectifier circuits are connected between nodes, between N panel-side connection points and the integration circuits, and a constant potential line. Circuit elements having resistance components are connected between the nodes and readout lines.
摘要翻译： 固态成像装置包括传感器面板部分和读出电路部分。 传感器面板部设置在玻璃基板上，具有由M行，N列，行选择线，读出线排列的像素的受光部。 读出电路部分设置在基板上并具有N个积分电路。 整流电路连接在节点之间，N个面板侧连接点和集成电路之间，以及恒定电位线。 具有电阻分量的电路元件连接在节点和读出线之间。
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公开(公告)号：US09478683B2
公开(公告)日：2016-10-25
申请号：US14362643
申请日：2012-12-04
IPC分类号： G01T1/00 , H01L31/024 , H04N5/32 , H01L27/146 , H04N5/378 , H04N5/225
CPC分类号： H01L31/024 , G01T1/00 , H01L27/14618 , H01L27/14623 , H01L27/14632 , H01L27/14663 , H01L2224/48091 , H01L2224/48137 , H04N5/2257 , H04N5/32 , H04N5/378 , H01L2924/00014
摘要： A sensor unit includes a metallic base member, a solid-state imaging element, and amplifier chips. The base member has a first placement surface and a second placement surface. The solid-state imaging element has a photodetecting surface, and is disposed on the first placement surface such that a rear surface and the first placement surface face each other. The amplifier chips are mounted on a substrate disposed on the second placement surface. The base member further has side wall portions facing side surfaces of the solid-state imaging element. The chips and the solid-state imaging element are electrically connected to one another via a bonding wire. The chips are thermally coupled to the base member via a thermal via of the substrate.
摘要翻译： 传感器单元包括金属基底构件，固态成像元件和放大器芯片。 基座部件具有第一放置面和第二放置面。 固体摄像元件具有受光面，并且配置在第一放置面上，使得背面和第一配置面相对。 放大器芯片安装在设置在第二放置表面上的基板上。 基部构件还具有面向固态成像元件的侧表面的侧壁部分。 芯片和固态成像元件通过接合线彼此电连接。 芯片通过衬底的热通孔热耦合到基底构件。
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17.发明授权Solid imaging device and X-ray CT device including the solid imaging device 有权固体成像装置和X射线CT装置，包括固体成像装置公开(公告)号：US09097812B2
公开(公告)日：2015-08-04
申请号：US13919245
申请日：2013-06-17
发明人： Kazuki Fujita , Harumichi Mori , Ryuji Kyushima , Masahiko Honda
摘要： The present invention relates to a solid-state imaging device, etc. having a structure for capturing a high-resolution image even when any row selecting wiring is disconnected. The solid-state imaging device (1) comprises a photodetecting section (10), a signal reading-out section (20), a row selecting section (30), a column selecting section (40), an overflow preventing section (50), and a controlling section (60). The photodetecting section (10) has M×N pixel portions P1,1 to PM,N two-dimensionally arranged in a matrix of M rows and N columns, and each of the pixel portions P1,1 to PM,N includes a photodiode that generates charge of an amount according to an incident light intensity and a reading-out switch connected to the photodiode. Each of the N pixel portions Pm,1 to Pm,N belonging to an m-th row is connected to the row selecting section (30) and the overflow preventing section (50) by an m-th row selecting wiring LV,m.
摘要翻译： 本发明涉及即使在任何行选择布线断开时也具有用于拍摄高分辨率图像的结构的固态成像装置等。 固态成像装置（1）包括受光部（10），信号读出部（20），行选择部（30），列选择部（40），溢流防止部（50） ，以及控制部（60）。 光检测部分（10）具有以M行和N列为矩阵二维排列的M×N个像素部分P1,1至PM，并且每个像素部分P1,1至PM，N包括光电二极管 根据入射光强度和连接到光电二极管的读出开关产生量的电荷。 属于第m行的N个像素部分Pm，1至Pm，N中的每一个通过第m行选择布线LV，m连接到行选择部分（30）和溢出防止部分（50）。
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公开(公告)号：US08953745B2
公开(公告)日：2015-02-10
申请号：US14048710
申请日：2013-10-08
发明人： Harumichi Mori , Ryuji Kyushima , Kazuki Fujita
CPC分类号： G01N23/04 , A61B6/032 , H04N5/32 , H04N5/3454 , H04N5/347 , H04N5/353 , H04N5/37457
摘要： A solid-state image pickup apparatus 1A includes a photodetecting section 10A and a signal readout section 20 etc. In the photodetecting section 10A, M×N pixel units P1,1 to PM,N are arrayed in M rows and N columns. When in a first imaging mode, a voltage value according to an amount of charges generated in a photodiode of each of the M×N pixel units in the photodetecting section 10A is output from the signal readout section 20. When in a second imaging mode, a voltage value according to an amount of charges generated in the photodiode of each pixel unit included in consecutive M1 rows in the photodetecting section 10A is output from the signal readout section 20. When in the second imaging mode than when in the first imaging mode, the readout pixel pitch in frame data is smaller, the frame rate is higher, and the gain being a ratio of an output voltage value to an input charge amount in the signal readout section 20 is greater.
摘要翻译： 固体摄像装置1A包括受光部分10A和信号读出部分20等。在受光部分10A中，将M×N个像素单元P1,1至PM，N排列成M行和N列。 当处于第一成像模式时，从信号读出部20输出根据受光部10A中的每个M×N像素单位的光电二极管中产生的电荷量的电压值。当处于第二成像模式时， 从信号读出部20输出根据在受光部10A中连续的M1行包含的各像素单位的光电二极管中产生的电荷量的电压值。当处于第二摄像模式时，与第一摄像模式相比， 帧数据中的读出像素间距较小，帧速率较高，并且作为信号读出部20中的输出电压值与输入电荷量的比的增益较大。
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公开(公告)号：US08704146B2
公开(公告)日：2014-04-22
申请号：US13799349
申请日：2013-03-13
发明人： Harumichi Mori , Ryuji Kyushima , Kazuki Fujita
IPC分类号： H01L27/146
CPC分类号： H04N5/378 , A61B6/00 , A61B6/14 , A61B6/4233 , H01L27/14607 , H01L27/14643 , H01L27/14658 , H01L27/14806 , H04N5/32 , H04N5/3742
摘要： A solid-state imaging device of one embodiment includes a light receiving section including of a plurality of pixels 11 having respective photodiodes, the pixels being two-dimensionally arrayed in M rows and N columns; N readout lines disposed for the respective columns and connected with the photodiodes PD included in the pixels of a respective columns via readout switches; a signal output section for outputting a voltage value according to an amount of charge input through each of the readout lines; and a vertical shift register for controlling an opening and closing operation of the readout switch for each of the rows. A contour between one side along a row direction of the light receiving section and a pair of sides along a column direction has a stepped shape. A dummy photodiode region is formed along the stepped contour of the light receiving section.
摘要翻译： 一个实施例的固态成像装置包括光接收部分，其包括具有各自的光电二极管的多个像素11，所述像素被二维排列成M行N列; N个读出线被设置用于各列，并且经由读取开关与包括在各列的像素中的光电二极管PD连接; 信号输出部分，用于根据通过每条读出线输入的电荷量输出电压值; 以及垂直移位寄存器，用于控制每行的读出开关的打开和关闭操作。 沿着光接收部分的行方向的一侧和沿着列方向的一对侧面之间的轮廓具有台阶形状。 沿着光接收部分的台阶轮廓形成虚拟光电二极管区域。
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