公开(公告)号：US20170317473A1

公开(公告)日：2017-11-02

申请号：US15140588

申请日：2016-04-28

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Di Liang ,  Geza Kurczveil ,  Raymond G. Beausoleil ,  Marco Fiorentino

IPC: H01S5/343 ,  H01S5/32 ,  H01S3/23 ,  H01S5/347 ,  H01S3/063

CPC classification number: H01S5/343 ,  H01S3/0637 ,  H01S3/2375 ,  H01S5/021 ,  H01S5/0216 ,  H01S5/0261 ,  H01S5/0424 ,  H01S5/1032 ,  H01S5/3211 ,  H01S5/3412 ,  H01S5/347

Abstract: An example method of manufacturing a semiconductor device. A first wafer may be provided that includes a first layer that contains quantum dots. A second wafer may be provided that includes a buried dielectric layer and a second layer on the buried dielectric layer. An interface layer may be formed on at least one of the first layer and the second layer, where the interface layer may be an insulator, a transparent electrical conductor, or a polymer. The first wafer may be bonded to the second wafer by way of the interface layer.

公开(公告)号：US10677990B2

公开(公告)日：2020-06-09

申请号：US15781531

申请日：2015-12-11

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Joaquin Matres ,  Wayne Victor Sorin ,  Sagi Mathai ,  Lars Helge Thylen ,  Michael Renne Ty Tan ,  Marco Fiorentino

IPC: G02B6/293 ,  H04B10/60

Abstract: In the examples provided herein, a system includes a loop waveguide; and a grating coupler formed on the loop waveguide to couple light impinging on the grating coupler having a first polarization into the loop waveguide in a first direction, and to couple light having a second polarization, orthogonal to the first polarization, into the loop waveguide in a second direction. The system also includes a ring resonator positioned near the loop waveguide tuned to have a resonant wavelength at a first wavelength to couple light at the first wavelength out of the loop waveguide into the ring resonator. An output waveguide positioned near the ring resonator couples light out of the ring resonator into the output waveguide; and a photodetector detects light propagating out of a first end and a second end of the output waveguide.

公开(公告)号：US20200088947A1

公开(公告)日：2020-03-19

申请号：US16694592

申请日：2019-11-25

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Kevin B. Leigh ,  Paul Kessler Rosenberg ,  Sagi Mathai ,  Mir Ashkan Seyedi ,  Michael Renne Ty Tan ,  Wayne Victor Sorin ,  Marco Fiorentino

IPC: G02B6/30

Abstract: In example implementations, an optical connector is provided. The optical connector includes a jumper holder, a base bracket, and an optical ferrule. The jumper holder holds a plurality of ribbon fibers. The base bracket is coupled to an electrical substrate to mate with the jumper holder. The optical ferrule is coupled to an end of each one of the plurality of ribbon fibers. The optical ferrule is laterally inserted into a corresponding orthogonal socket that is coupled to a silicon interposer on the electrical substrate to optically mate the optical ferrule to the orthogonal socket.

公开(公告)号：US10551577B2

公开(公告)日：2020-02-04

申请号：US16023596

申请日：2018-06-29

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Ashkan Seyedi ,  Marco Fiorentino ,  Geza Kurczveil ,  Raymond G. Beausoleil

IPC: G02B6/34 ,  G02B6/42 ,  G02B6/32 ,  G02B6/30 ,  G02B6/124 ,  G02B6/12 ,  H01S5/0683

Abstract: Processes and apparatuses described herein reduce the manufacturing time, the cost of parts, and the cost of assembly per laser for photonic interconnects incorporated into computing systems. An output side of a laser assembly is placed against an input side of a silicon interposer (SiP) such that each pad in a plurality of pads positioned on the output side of the laser assembly is in contact with a respective solder bump that is also in contact with a corresponding pad positioned on the input side of the SiP. The laser assembly is configured to emit laser light from the output side into an input grating of the SiP. The solder bumps are heated to a liquid phase. Capillary forces of the solder bumps realign the laser assembly and the SiP while the solder bumps are in the liquid phase. The solder bumps are then allowed to cool.

公开(公告)号：US20190020416A1

公开(公告)日：2019-01-17

申请号：US16068713

申请日：2016-01-15

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tsung-Ching Huang ,  Ashkan Seyedi ,  Chin-Hui Chen ,  Cheng Li ,  Marco Fiorentino ,  Raymond G. Beausoleil

IPC: H04B10/516 ,  H04J14/02

Abstract: An example system includes an optical modulator and a multiplexing controller. The modulator includes a data bus for receiving at least one data signal, a plurality of multiplexers and a plurality of modulating segments. Each multiplexer is coupled to the data bus to receive at least one data signal and to output a multiplexed signal. Each modulating segment may receive the multiplexed signal from one of the plurality of multiplexers and modulate the multiplexed signal using an optical input. The multiplexing controller may be in communication with the plurality of multiplexers and may configure each of the plurality of multiplexers in accordance with a selected modulation type.

公开(公告)号：US20180314080A1

公开(公告)日：2018-11-01

申请号：US15768901

申请日：2015-10-28

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Nan Qi ,  Cheng Li ,  Marco Fiorentino

IPC: G02F1/01 ,  H04B10/588 ,  G02F1/21

CPC classification number: H04B10/588 ,  G02F1/0327 ,  G02F1/225 ,  G02F2201/126

Abstract: One example of a system includes an optical modulator, a push-pull driver, and a compensation circuit. The optical modulator has a nonlinear capacitance. The push-pull driver is electrically coupled across the optical modulator. The push-pull driver charges the capacitance in response to a logic ‘1’ of a level-shifted differential signal and discharges the capacitance in response to a logic ‘0’ of the level-shifted differential signal. The compensation circuit increases the speed of the discharge of the capacitance in response to the level-shifted differential signal transitioning from a logic ‘1’ to a logic ‘0’.

公开(公告)号：US20170317865A1

公开(公告)日：2017-11-02

申请号：US15139779

申请日：2016-04-27

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Kunzhi Yu ,  Cheng Li ,  Marco Fiorentino ,  Raymond G. Beausoleil

IPC: H04L27/22 ,  H04L27/233

CPC classification number: H04L27/223 ,  H04L7/033 ,  H04L25/066 ,  H04L25/069 ,  H04L27/2338

Abstract: In one example, an apparatus includes an offset tunable edge slicer having an input to receive a pulse amplitude modulation signal. The offset tunable edge slicer also has a plurality of possible offset settings corresponding to a plurality of different reference voltages of the offset tunable edge slicer. A multiplexer has an output coupled to the input of the offset tunable edge slicer and an input to receive a control signal that selects one of the plurality of possible offset settings for the offset tunable edge slicer. A phase detector has an input coupled to an output of the offset tunable edge slicer.

公开(公告)号：US20250021809A1

公开(公告)日：2025-01-16

申请号：US18487452

申请日：2023-10-16

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： YIWEI PENG ,  Xian Xiao ,  Yuan Yuan ,  Stanley Cheung ,  Sean Hooten ,  Thomas Van Vaerenbergh ,  Marco Fiorentino ,  Zhihong Huang

IPC: G06N3/067

Abstract: Systems and methods are provided for devices and methods for implementing an optical neural network (ONN) by leveraging resonator structures, such on micro-ring resonators (MRRs). Examples include unit cells configured to perform a linear transformation on optical signals. Each unit cell comprises a plurality of signal mixing components optically coupled to between adjacent waveguides, where each signal mixing component corresponds to a distinct wavelength and is configured to mix optical signals on the adjacent waveguides at the distinct wavelength. Each unit cell also includes a plurality of phase tuning components each corresponding to a distinct wavelength and configured to adjust a phase of a mixed optical signal at the distinct wavelength.

公开(公告)号：US20240296320A1

公开(公告)日：2024-09-05

申请号：US18178094

申请日：2023-03-03

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Yiwei Peng ,  Yuan Yuan ,  Stanley Cheung ,  Wayne Victor Sorin ,  Marco Fiorentino

IPC: G06N3/067 ,  G02F1/21 ,  G02F1/225

CPC classification number: G06N3/067 ,  G02F1/212 ,  G02F1/225

Abstract: An example microring resonator (MRR) based optical device having improved linearity is presented. The optical device includes a first MRR and a first bus waveguide optically coupled to the first MRR. Further, the optical device includes a second MRR optically coupled to the first MRR, and a second bus waveguide optically coupled to the second MRR. The first MRR and the second MRR are formed between the first bus waveguide and the second bus waveguide. The optical coupling between the first MRR and the second MRR increases the linearity in the optical output of the optical device.

公开(公告)号：US20230170991A1

公开(公告)日：2023-06-01

申请号：US17539275

申请日：2021-12-01

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Hyunmin Jeong ,  Sai Rahul Chalamalasetti ,  Marco Fiorentino ,  Peter Jin Rhim

IPC: H04B10/079

CPC classification number: H04B10/07955

Abstract: Examples described herein relate to a method for synchronizing a wavelength of light in an optical device. In some examples, a heater voltage may be predicted for a heater disposed adjacent to the optical device in a photonic chip. The predicted heater voltage may be applied to the heater to cause a change in the wavelength of the light inside the optical device. In response to applying the heater voltage, an optical power inside the optical device may be measured. Further, a check may be performed to determine whether the measured optical power is a peak optical power. If it is determined that measured optical power is the peak optical power, the application of the predicted heater voltage to the heater may be continued.