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22 条记录 (耗时 0.043 秒)

    Electronic device case, method and mold for manufacturing the same, and mobile communications terminal
    15.
    发明授权
    Electronic device case, method and mold for manufacturing the same, and mobile communications terminal 有权
    电子设备案例，制造方法和模具以及移动通信终端

    公开(公告)号：US08618989B2

    公开(公告)日：2013-12-31

    申请号：US12608818

    申请日：2009-10-29

    申请人： Jae Suk Sung ,  Sung Eun Cho ,  Ha Ryong Hong ,  Dae Kyu Lee ,  Dae Seong Jeon ,  Ki Won Chang ,  Tae Sung Kim ,  Dae Ki Lim ,  Hyun Do Park ,  Nam Il Seo

    发明人： Jae Suk Sung ,  Sung Eun Cho ,  Ha Ryong Hong ,  Dae Kyu Lee ,  Dae Seong Jeon ,  Ki Won Chang ,  Tae Sung Kim ,  Dae Ki Lim ,  Hyun Do Park ,  Nam Il Seo

    IPC分类号： H01Q1/24

    CPC分类号： B29D99/006 ,  B29C45/14065 ,  B29C45/14639 ,  B29L2031/3456 ,  H01Q1/243 ,  H01Q1/40 ,  H01Q1/42 ,  H01Q9/0421 ,  H04M1/026 ,  H04W88/02

    摘要： An electronic device case having an antenna pattern embedded therein according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion of the radiator is provided on one side of the radiator frame and the connection terminal portion is provided on the other side thereof; and a case frame covering the one side of the radiator frame on which the antenna pattern portion is provided so that the antenna pattern portion is embedded between the case frame and the radiator frame.

    摘要翻译： 根据本发明的一个方面的具有嵌入其中的天线方向图的电子设备壳体可以包括：具有发送和接收信号的天线图案部分的散热器和允许信号被发送到电路板并从电路板接收的连接端子部分 的电子设备; 连接部，其部分地形成所述散热器，并将所述天线图案部分和所述连接端子部分连接在不同的平面内; 散热器框架，其通过在散热器上注射成型而制造，使得散热器的天线图案部分设置在散热器框架的一侧，并且连接端子部分设置在其另一侧上; 以及壳体框架，其覆盖设置有天线图案部分的辐射体框架的一侧，使得天线图案部分嵌入在壳体框架和散热器框架之间。

    Chip antenna and mobile-communication terminal having the same
    18.
    发明授权
    Chip antenna and mobile-communication terminal having the same 失效
    芯片天线和具有相同功能的移动通信终端

    公开(公告)号：US08159400B2

    公开(公告)日：2012-04-17

    申请号：US12170999

    申请日：2008-07-10

    申请人： Chang Mok Han ,  Ki Won Chang ,  Duk Woo Lee ,  Dae Kyu Lee ,  Jeong Sik Seo ,  Hyun Do Park

    发明人： Chang Mok Han ,  Ki Won Chang ,  Duk Woo Lee ,  Dae Kyu Lee ,  Jeong Sik Seo ,  Hyun Do Park

    IPC分类号： H01Q1/24 ,  H01Q1/38

    CPC分类号： H01Q1/38 ,  H01Q9/0407

    摘要： There are provided a chip antenna and a mobile telecommunication terminal having the chip antenna. The chip antenna includes: a dielectric block having opposing top and bottom surfaces and a plurality of side surfaces connecting the top and bottom surfaces; a first conductive pattern formed on at least one of the surfaces of the dielectric block and connected to an external feeding part; a second conductive pattern formed on at least one of the surfaces of the dielectric block to connect to the first conductive pattern, and having one end connected to an external ground part; and a third conductive pattern formed on at least one of the surfaces of the dielectric block, and spaced apart from the first and second conductive patterns to be capacitively coupled to the first and second conductive patterns, respectively, the third conductive pattern having a lower end connected to the external ground part.

    摘要翻译： 提供了具有芯片天线的芯片天线和移动电信终端。 芯片天线包括：具有相对的顶表面和底表面的介质块和连接顶表面和底表面的多个侧表面; 形成在介质块的至少一个表面上并连接到外部馈电部分的第一导电图案; 形成在所述介电块的至少一个表面上以连接到所述第一导电图案并且具有连接到外部接地部分的一端的第二导电图案; 以及形成在所述介质块的至少一个表面上并且与所述第一和第二导电图案间隔开以分别电容耦合到所述第一和第二导电图案的第三导电图案，所述第三导电图案具有下端 连接到外部接地部分。

    CHIP ANTENNA AND MOBILE-COMMUNICATION TERMINAL HAVING THE SAME
    19.
    发明申请
    CHIP ANTENNA AND MOBILE-COMMUNICATION TERMINAL HAVING THE SAME 失效
    芯片天线和移动通信终端

    公开(公告)号：US20090015486A1

    公开(公告)日：2009-01-15

    申请号：US12170999

    申请日：2008-07-10

    申请人： Chang Mok Han ,  Ki Won Chang ,  Duk Woo Lee ,  Dae Kyu Lee ,  Jeong Sik Seo ,  Hyun Do Park

    发明人： Chang Mok Han ,  Ki Won Chang ,  Duk Woo Lee ,  Dae Kyu Lee ,  Jeong Sik Seo ,  Hyun Do Park

    IPC分类号： H01Q9/04

    CPC分类号： H01Q1/38 ,  H01Q9/0407

    摘要： There are provided a chip antenna and a mobile telecommunication terminal having the chip antenna. The chip antenna includes: a dielectric block having opposing top and bottom surfaces and a plurality of side surfaces connecting the top and bottom surfaces; a first conductive pattern formed on at least one of the surfaces of the dielectric block and connected to an external feeding part; a second conductive pattern formed on at least one of the surfaces of the dielectric block to connect to the first conductive pattern, and having one end connected to an external ground part; and a third conductive pattern formed on at least one of the surfaces of the dielectric block, and spaced apart from the first and second conductive patterns to be capacitively coupled to the first and second conductive patterns, respectively, the third conductive pattern having a lower end connected to the external ground part.

    摘要翻译： 提供了具有芯片天线的芯片天线和移动电信终端。 芯片天线包括：具有相对的顶表面和底表面的介质块和连接顶表面和底表面的多个侧表面; 形成在介质块的至少一个表面上并连接到外部馈电部分的第一导电图案; 形成在所述介电块的至少一个表面上以连接到所述第一导电图案并且具有连接到外部接地部分的一端的第二导电图案; 以及形成在所述介质块的至少一个表面上并且与所述第一和第二导电图案间隔开以分别电容耦合到所述第一和第二导电图案的第三导电图案，所述第三导电图案具有下端 连接到外部接地部分。