公开(公告)号：US20080296715A1

公开(公告)日：2008-12-04

申请号：US12156192

申请日：2008-05-30

申请人： Kiyoshi Kumata ,  Kazuya Fujita

发明人： Kiyoshi Kumata ,  Kazuya Fujita

IPC分类号： H01L31/00

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2924/00014

摘要： In a solid-state imaging device 1 in which a hollow section 9 is formed between a solid-state imaging element 2 and a covering section 4 and an air path 7 extending from the hollow section 9 to the outside is formed in an adhesive section 5, a shielding section 11 for shielding the air path 7 is formed on the air path 7 so as to be positioned on a portion exposed from the covering section 4. This makes it possible to reduce noises occurring in a signal processing section of a semiconductor element while preventing condensation in the covering section for covering the semiconductor element.

摘要翻译： 在固体成像装置1中，在固态成像元件2和覆盖部分4之间形成中空部分9，并且从中空部分9延伸到外部的空气通道7形成在粘合部分5中 在空气路径7上形成用于遮蔽空气通道7的屏蔽部分11，以便位于从覆盖部分4露出的部分上。这使得可以减少半导体元件的信号处理部分中产生的噪声 同时防止用于覆盖半导体元件的覆盖部分中的冷凝。

公开(公告)号：US20070228758A1

公开(公告)日：2007-10-04

申请号：US11727007

申请日：2007-03-23

申请人： Yoshikazu Machida ,  Masahiro Natsume ,  Katsumi Sakamoto ,  Kazuya Fujita

发明人： Yoshikazu Machida ,  Masahiro Natsume ,  Katsumi Sakamoto ,  Kazuya Fujita

IPC分类号： B62D27/00

CPC分类号： B60Q1/0466 ,  B60Q1/2626 ,  B60Q1/2653 ,  B60R13/06 ,  F21V31/005

摘要： A vehicle component includes a sealing member that is sandwiched between the vehicle component and a vehicle body to seal a gap between the vehicle component and the vehicle body. The sealing member includes an adhering/separating member that is adhereable to and separable from a wall of the vehicle body, and an elastic compressing member that is elastically compressible and stacked on the adhering/separating member. The adhering/separating member adheres to the wall of the vehicle body when the sealing member is present between the vehicle component and the vehicle body.

摘要翻译： 车辆部件包括夹在车辆部件和车体之间的密封部件，以密封车辆部件与车身之间的间隙。 密封构件包括粘附/分离构件，其粘附到车体的壁上并可与其分离;以及弹性压缩构件，其弹性压缩并堆叠在粘合/分离构件上。 当密封构件存在于车辆部件和车身之间时，粘附/分离部件粘附到车体的壁上。

公开(公告)号：US20060043544A1

公开(公告)日：2006-03-02

申请号：US11217582

申请日：2005-08-31

申请人： Hiroaki Tsukamoto ,  Kazuya Fujita ,  Takashi Yasudome

发明人： Hiroaki Tsukamoto ,  Kazuya Fujita ,  Takashi Yasudome

IPC分类号： H01L23/495

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： An imaging device as a semiconductor device includes a semiconductor substrate on which an imaging element is mounted, a light-transmitting lid section (covering section) arranged to face a light receiving section provided on one surface of the imaging element, and an adhesive layer arranged in an area excluding the light receiving section on the one surface of the imaging element for bonding between the semiconductor substrate and the lid section. The adhesive layer ranges from 10 g/(m2·24 h) to 200 g/(m2·24 h) in the water vapor permeability.

摘要翻译： 作为半导体器件的成像器件包括其上安装有成像元件的半导体衬底，布置成面对设置在成像元件的一个表面上的光接收部分的透光盖部分（覆盖部分）和布置成 在除了用于在半导体衬底和盖部之间接合的成像元件的一个表面上的光接收部分的区域中。 粘合剂层的水蒸汽渗透性为10g /（m 2·2H 2·24h）至200g /（m 2·2H 2·24h）。

公开(公告)号：US06386868B1

公开(公告)日：2002-05-14

申请号：US09762675

申请日：2001-02-12

申请人： Kazuya Fujita

发明人： Kazuya Fujita

IPC分类号： A61C1100

CPC分类号： A61C11/08 ,  A61C11/06 ,  A61C11/082

摘要： A dental articulator (5) capable of reproducing or analyzing a physiological occlusion status by implementing a pressure receiving function and a traction function capable of operating in all the motion directions equivalently provided by a jaw joint function of a living body with a teeth plaster model fitted between upper and lower jaw frames, comprising an occlusal plane table (8) having the same anteversion angle as the occlusal plane oblique angle of a living body; a bite analysis plate (9) on which average positions of a spew center (91) and a posterior motion axis (92) are set at a plurality of positions and they are sketched in pairs with the average positions of the spew center on one side and those of the posterior motion axis on the other side of the plate; an incisal guidance plate (56) in which an inverted conical slope for mapping front-and-rear, right-and-left inclinations of the cusp is cut to allow the tip of an incisal guide to slide; and a transform plate (1) which is fitted using a lower jaw frame (52) as a base, wherein the teeth plaster model (7) of a lower jaw is mounted on and fitted to the transform plate (1) to effect a shift operation, thereby reproducing physiological occlusion status in conjunction with an intercuspal position and a posterior occlusion position of a living body.

摘要翻译： 一种牙科咬合器（5），其能够通过实施压力接收功能和牵引功能来再现或分析生理闭塞状态，所述牵引功能能够在所有运动方向上操作，所有运动方向等同地由活体的钳口关节功能提供，其具有安装的牙膏膏 包括具有与活体的咬合面倾斜角度相同的前倾角的咬合平台（8​​）; 一个咬合分析板（9），其中一个喷墨中心（91）和后运动轴（92）的平均位置被设置在多个位置，并且它们与一侧的喷墨中心的平均位置成对地勾画 并且在板的另一侧的后运动轴的那些; 切割引导板（56），其中切割用于映射尖端的前后左右倾斜的倒锥形斜面，以允许切眼引导件的尖端滑动; 和使用下颚框架（52）作为基座装配的变形板（1），其中下颚的齿膏模型（7）安装在变形板（1）上并安装到变换板（1）上以实现移位 从而与活体的间隙位置和后闭塞位置一起再生生理闭塞状态。

公开(公告)号：US20130041452A1

公开(公告)日：2013-02-14

申请号：US13643202

申请日：2011-04-27

申请人： Kazuya Fujita ,  Tomoyuki Horiguchi ,  Ryo Matsuo ,  Kazuhiro Tanahashi ,  Asanori Shimada

发明人： Kazuya Fujita ,  Tomoyuki Horiguchi ,  Ryo Matsuo ,  Kazuhiro Tanahashi ,  Asanori Shimada

IPC分类号： D03D15/00 ,  A61F2/06

CPC分类号： D04B21/16 ,  A61F2/07 ,  D03D1/00 ,  D03D13/008 ,  D03D15/0061 ,  D10B2321/021 ,  D10B2321/042 ,  D10B2331/02 ,  D10B2331/04 ,  D10B2331/10 ,  D10B2509/06 ,  Y10T442/3065 ,  Y10T442/3089

摘要： A base fabric for a stent graft is a woven fabric constituted by a fiber having a total fineness of 1 to 40 decitex and a single yarn fineness of 0.1 to 2.0 decitex and has a yarn density of 150 strands/2.54 cm or more in both longitudinal direction and lateral direction, a thickness of 1 to 90 μm, and a tensile strength of 50.0 N/cm or more in both longitudinal direction and lateral direction. According to the present invention, the base fabric for a stent graft having thinness, high strength, low permeability, durability, and flexibility can be obtained.

摘要翻译： 用于支架移植物的基底织物是由总细度为1至40分特，单丝细度为0.1至2.0分特的纤维构成的机织织物，并且在两纵向上具有150根/ 2.54厘米或更大的纱线密度 方向和横向，厚度为1至90μm，并且在纵向和横向方向上的拉伸强度为50.0N / cm以上。 根据本发明，可以获得具有薄度，高强度，低渗透性，耐久性和柔性的支架移植物用基底织物。

公开(公告)号：US20090256229A1

公开(公告)日：2009-10-15

申请号：US12085152

申请日：2006-11-01

申请人： Kazuhiro Ishikawa ,  Katsuitsu Nishida ,  Kazuya Fujita ,  Takahiro Nakahashi

发明人： Kazuhiro Ishikawa ,  Katsuitsu Nishida ,  Kazuya Fujita ,  Takahiro Nakahashi

IPC分类号： H01L31/04 ,  H01L23/02 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L24/97 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00

摘要： In a camera module (1) of the present invention, a lens member (20) is attached to a semiconductor package (10). The semiconductor package (10) includes: an image sensor (11) mounted on a wiring board (13); and a wire 15 through which the wiring board (13) is electrically connected to the image sensor (11). The image sensor (11) and the wire 15 are sealed with mold resin (14). A step (18) is formed around the perimeter of the surface of the mold resin (14), and the semiconductor package (10) and the lens member (20) are joined by fitting the step (18) and a projection (23) of a lens holder (22). With this arrangement, it is possible to realize a small semiconductor module that allows for highly precise alignment between the semiconductor package and a mounting component to which the semiconductor package is joined.

摘要翻译： 在本发明的摄像机模块（1）中，透镜构件（20）附接到半导体封装（10）。 半导体封装（10）包括：安装在布线板（13）上的图像传感器（11）; 以及配线基板（13）与图像传感器11电连接的布线15。 图像传感器（11）和线15用模制树脂（14）密封。 在模具树脂（14）的表面的周边周围形成有台阶（18），半导体封装（10）和透镜部件（20）通过嵌合台阶（18）和突起（23）而接合， 的透镜架（22）。 利用这种布置，可以实现允许半导体封装与半导体封装被连接的安装部件之间的高精度对准的小型半导体模块。

公开(公告)号：US20080296718A1

公开(公告)日：2008-12-04

申请号：US12155042

申请日：2008-05-29

申请人： Kiyoshi Kumata ,  Kazuya Fujita

发明人： Kiyoshi Kumata ,  Kazuya Fujita

IPC分类号： H01L33/00

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A solid-state imaging device 1 is arranged so that a hollow section 9 is formed between a solid-state imaging element 2 and a covering section 4 and an air path 7 is formed in an adhesive section 5 so as to extend from the hollow section 9 to the outside, wherein the adhesive section 5 is formed so as not to be positioned on a signal processing section 8 for processing a signal of the solid-state imaging element 2. This makes it possible to reduce noises occurring in the signal processing section of the semiconductor element while preventing occurrence of condensation in the covering section for covering the semiconductor element.

摘要翻译： 固态成像装置1被布置成使得在固态成像元件2和覆盖部分4之间形成中空部分9，并且空气通道7形成在粘合部分5中，以便从中空部分 如图9所示，粘合部5形成为不被定位在用于处理固态成像元件2的信号的信号处理部8上。这使得可以减少在信号处理部中发生的噪声 同时防止在用于覆盖半导体元件的覆盖部分中发生冷凝。

公开(公告)号：US20070267712A1

公开(公告)日：2007-11-22

申请号：US11799258

申请日：2007-04-30

申请人： Kazuya Fujita ,  Hiroaki Tsukamoto ,  Takashi Yasudome

发明人： Kazuya Fujita ,  Hiroaki Tsukamoto ,  Takashi Yasudome

IPC分类号： H01L31/09

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/16151 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： With the reduced size of a solid state imaging device, the invention provides: a solid state imaging device of a chip size and having good environmental durability; a semiconductor wafer used for fabricating a solid state imaging device; an optical device module incorporating a solid state imaging device; a method of solid state imaging device fabrication; and a method of optical device module fabrication. The solid state imaging device comprises: a solid state image pickup device formed on a semiconductor substrate; a light-transparent cover arranged opposite to an effective pixel region, so as to protect (the surface of) the effective pixel region formed in one surface of the solid state image pickup device against external environment; and an adhering section formed outside the effective pixel region in the one surface of the solid state image pickup device, so as to adhere the light-transparent cover and the solid state image pickup device.

摘要翻译： 随着固态成像装置的尺寸减小，本发明提供了一种芯片尺寸并具有良好的环境耐久性的固态成像装置; 用于制造固态成像装置的半导体晶片; 包括固态成像装置的光学装置模块; 一种固态成像器件制造方法; 以及光学器件模块制造的方法。 固态成像装置包括：形成在半导体衬底上的固态图像拾取器件; 与有效像素区域相对布置的光透明盖，以防止形成在固态图像拾取装置的一个表面中的有效像素区域（表面）抵抗外部环境; 以及形成在固态图像拾取装置的一个表面中的有效像素区域外侧的粘附部分，以便粘附透光盖和固态图像拾取装置。

公开(公告)号：US07233735B2

公开(公告)日：2007-06-19

申请号：US09994917

申请日：2001-11-28

申请人： Shinichi Kikuchi ,  Hideo Kataoka ,  Kazuya Fujita

发明人： Shinichi Kikuchi ,  Hideo Kataoka ,  Kazuya Fujita

IPC分类号： H04N5/781

CPC分类号： H04N5/76 ,  G11B20/00688 ,  G11B20/10 ,  G11B2020/10972 ,  H04N5/781 ,  H04N5/85 ,  H04N9/8042 ,  H04N2005/91321

摘要： There is disclosed a method in which a recording section configured to record an external input signal, and a display signal output section configured to output a display signal based on at least one of the external input signal and a reproduction signal from the recording section are used. Here, when the display signal output section outputs the external input signal as the display signal, and a predetermined temporary interruption state is set at this time, the external input signal is recorded in the recording section.

摘要翻译： 公开了一种方法，其中记录部分被配置为记录外部输入信号，并且显示信号输出部分被配置为基于来自记录部分的外部输入信号和再现信号中的至少一个来输出显示信号 。 这里，当显示信号输出部输出外部输入信号作为显示信号，并且此时设定了预定的暂时中断状态时，外部输入信号被记录在记录部中。

公开(公告)号：US07112864B2

公开(公告)日：2006-09-26

申请号：US10804666

申请日：2004-03-18

申请人： Hiroaki Tsukamoto ,  Kazuya Fujita ,  Takashi Yasudome

发明人： Hiroaki Tsukamoto ,  Kazuya Fujita ,  Takashi Yasudome

IPC分类号： H01L31/0203 ,  H01L31/062

CPC分类号： G02B7/02 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/3025 ,  H04N5/2253 ,  H01L2924/00014 ,  H01L2924/00

摘要： A module for an optical device being provided with a wiring substrate having a conductive wiring patterned thereon, a solid-state image sensor, a DSP for controlling the operation of the solid-state image sensor and processing a signal outputted from the same, and a lens holder being placed opposite to the solid-state image sensor and having a function of an optical path demarcating unit for demarcating the optical path to the solid-state image sensor, wherein a transparent cover bonded to the surface of the solid-state image sensor is joined to the lens holder at a joint portion. It is unnecessary to provide a focus adjuster for matching the optical distance between the lens and the solid-state image sensor with the focal length of the lens.

摘要翻译： 一种用于光学装置的模块，其具有布置有图案化的导电布线的布线基板，固态图像传感器，用于控制固态图像传感器的操作的DSP以及处理从其输出的信号的DSP 透镜架放置在与固态图像传感器相对的位置，并且具有用于将光路划定到固态图像传感器的光路划分单元的功能，其中粘合到固态图像传感器的表面的透明盖 在接合部分处连接到透镜保持器。 不需要提供用于将透镜和固态图像传感器之间的光学距离与透镜的焦距进行匹配的焦点调节器。