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    Semiconductor device and optical device module having the same
    1.
    发明申请
    Semiconductor device and optical device module having the same 有权
    半导体器件和具有其的光学器件模块

    公开(公告)号：US20080296715A1

    公开(公告)日：2008-12-04

    申请号：US12156192

    申请日：2008-05-30

    申请人： Kiyoshi Kumata ,  Kazuya Fujita

    发明人： Kiyoshi Kumata ,  Kazuya Fujita

    IPC分类号： H01L31/00

    CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： In a solid-state imaging device 1 in which a hollow section 9 is formed between a solid-state imaging element 2 and a covering section 4 and an air path 7 extending from the hollow section 9 to the outside is formed in an adhesive section 5, a shielding section 11 for shielding the air path 7 is formed on the air path 7 so as to be positioned on a portion exposed from the covering section 4. This makes it possible to reduce noises occurring in a signal processing section of a semiconductor element while preventing condensation in the covering section for covering the semiconductor element.

    摘要翻译： 在固体成像装置1中，在固态成像元件2和覆盖部分4之间形成中空部分9，并且从中空部分9延伸到外部的空气通道7形成在粘合部分5中 在空气路径7上形成用于遮蔽空气通道7的屏蔽部分11，以便位于从覆盖部分4露出的部分上。这使得可以减少半导体元件的信号处理部分中产生的噪声 同时防止用于覆盖半导体元件的覆盖部分中的冷凝。

    Semiconductor device and optical device module having the same
    2.
    发明申请
    Semiconductor device and optical device module having the same 有权
    半导体器件和具有其的光学器件模块

    公开(公告)号：US20080296718A1

    公开(公告)日：2008-12-04

    申请号：US12155042

    申请日：2008-05-29

    申请人： Kiyoshi Kumata ,  Kazuya Fujita

    发明人： Kiyoshi Kumata ,  Kazuya Fujita

    IPC分类号： H01L33/00

    CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： A solid-state imaging device 1 is arranged so that a hollow section 9 is formed between a solid-state imaging element 2 and a covering section 4 and an air path 7 is formed in an adhesive section 5 so as to extend from the hollow section 9 to the outside, wherein the adhesive section 5 is formed so as not to be positioned on a signal processing section 8 for processing a signal of the solid-state imaging element 2. This makes it possible to reduce noises occurring in the signal processing section of the semiconductor element while preventing occurrence of condensation in the covering section for covering the semiconductor element.

    摘要翻译： 固态成像装置1被布置成使得在固态成像元件2和覆盖部分4之间形成中空部分9，并且空气通道7形成在粘合部分5中，以便从中空部分 如图9所示，粘合部5形成为不被定位在用于处理固态成像元件2的信号的信号处理部8上。这使得可以减少在信号处理部中发生的噪声 同时防止在用于覆盖半导体元件的覆盖部分中发生冷凝。

    Semiconductor device and optical device module having the same
    3.
    发明授权
    Semiconductor device and optical device module having the same 有权
    半导体器件和具有其的光学器件模块

    公开(公告)号：US07999284B2

    公开(公告)日：2011-08-16

    申请号：US12155042

    申请日：2008-05-29

    申请人： Kiyoshi Kumata ,  Kazuya Fujita

    发明人： Kiyoshi Kumata ,  Kazuya Fujita

    IPC分类号： H01L29/74

    CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： A solid-state imaging device 1 is arranged so that a hollow section 9 is formed between a solid-state imaging element 2 and a covering section 4 and an air path 7 is formed in an adhesive section 5 so as to extend from the hollow section 9 to the outside, wherein the adhesive section 5 is formed so as not to be positioned on a signal processing section 8 for processing a signal of the solid-state imaging element 2. This makes it possible to reduce noises occurring in the signal processing section of the semiconductor element while preventing occurrence of condensation in the covering section for covering the semiconductor element.

    摘要翻译： 固态成像装置1被布置成使得在固态成像元件2和覆盖部分4之间形成中空部分9，并且空气通道7形成在粘合部分5中，以便从中空部分 如图9所示，粘合部5形成为不被定位在用于处理固态成像元件2的信号的信号处理部8上。这使得可以减少在信号处理部中发生的噪声 同时防止在用于覆盖半导体元件的覆盖部分中发生冷凝。

    Semiconductor device with a shielding section to prevent condensation and optical device module having the semiconductor device
    4.
    发明授权
    Semiconductor device with a shielding section to prevent condensation and optical device module having the semiconductor device 有权
    具有防止冷凝的屏蔽部分和具有该半导体器件的光学器件模块的半导体器件

    公开(公告)号：US07863062B2

    公开(公告)日：2011-01-04

    申请号：US12156192

    申请日：2008-05-30

    申请人： Kiyoshi Kumata ,  Kazuya Fujita

    发明人： Kiyoshi Kumata ,  Kazuya Fujita

    IPC分类号： H01L21/00 ,  H01L33/00

    CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： In a solid-state imaging device 1 in which a hollow section 9 is formed between a solid-state imaging element 2 and a covering section 4 and an air path 7 extending from the hollow section 9 to the outside is formed in an adhesive section 5, a shielding section 11 for shielding the air path 7 is formed on the air path 7 so as to be positioned on a portion exposed from the covering section 4. This makes it possible to reduce noises occurring in a signal processing section of a semiconductor element while preventing condensation in the covering section for covering the semiconductor element.

    摘要翻译： 在固体成像装置1中，在固态成像元件2和覆盖部分4之间形成中空部分9，并且从中空部分9延伸到外部的空气通道7形成在粘合部分5中 在空气路径7上形成用于遮蔽空气通道7的屏蔽部分11，以便位于从覆盖部分4露出的部分上。这使得可以减少半导体元件的信号处理部分中产生的噪声 同时防止用于覆盖半导体元件的覆盖部分中的冷凝。

    Vehicle component and sealing member
    6.
    发明授权
    Vehicle component and sealing member 有权
    车辆部件和密封件

    公开(公告)号：US08720908B2

    公开(公告)日：2014-05-13

    申请号：US11727007

    申请日：2007-03-23

    申请人： Yoshikazu Machida ,  Masahiro Natsume ,  Katsumi Sakamoto ,  Kazuya Fujita

    发明人： Yoshikazu Machida ,  Masahiro Natsume ,  Katsumi Sakamoto ,  Kazuya Fujita

    IPC分类号： F16J15/02

    CPC分类号： B60Q1/0466 ,  B60Q1/2626 ,  B60Q1/2653 ,  B60R13/06 ,  F21V31/005

    摘要： A vehicle component includes a sealing member that is sandwiched between the vehicle component and a vehicle body to seal a gap between the vehicle component and the vehicle body. The sealing member includes an adhering/separating member that is adhereable to and separable from a wall of the vehicle body, and an elastic compressing member that is elastically compressible and stacked on the adhering/separating member. The adhering/separating member adheres to the wall of the vehicle body when the sealing member is present between the vehicle component and the vehicle body.

    摘要翻译： 车辆部件包括夹在车辆部件和车体之间的密封部件，以密封车辆部件与车身之间的间隙。 密封构件包括粘附/分离构件，其粘附到车体的壁上并可与其分离;以及弹性压缩构件，其弹性压缩并堆叠在粘合/分离构件上。 当密封构件存在于车辆部件和车身之间时，粘附/分离部件粘附到车体的壁上。

    Vehicle component and sealing member
    8.
    发明申请
    Vehicle component and sealing member 有权
    车辆部件和密封件

    公开(公告)号：US20070228758A1

    公开(公告)日：2007-10-04

    申请号：US11727007

    申请日：2007-03-23

    申请人： Yoshikazu Machida ,  Masahiro Natsume ,  Katsumi Sakamoto ,  Kazuya Fujita

    发明人： Yoshikazu Machida ,  Masahiro Natsume ,  Katsumi Sakamoto ,  Kazuya Fujita

    IPC分类号： B62D27/00

    CPC分类号： B60Q1/0466 ,  B60Q1/2626 ,  B60Q1/2653 ,  B60R13/06 ,  F21V31/005

    摘要： A vehicle component includes a sealing member that is sandwiched between the vehicle component and a vehicle body to seal a gap between the vehicle component and the vehicle body. The sealing member includes an adhering/separating member that is adhereable to and separable from a wall of the vehicle body, and an elastic compressing member that is elastically compressible and stacked on the adhering/separating member. The adhering/separating member adheres to the wall of the vehicle body when the sealing member is present between the vehicle component and the vehicle body.

    摘要翻译： 车辆部件包括夹在车辆部件和车体之间的密封部件，以密封车辆部件与车身之间的间隙。 密封构件包括粘附/分离构件，其粘附到车体的壁上并可与其分离;以及弹性压缩构件，其弹性压缩并堆叠在粘合/分离构件上。 当密封构件存在于车辆部件和车身之间时，粘附/分离部件粘附到车体的壁上。

    Semiconductor device, semiconductor module, and manufacturing method of semiconductor device
    9.
    发明申请
    Semiconductor device, semiconductor module, and manufacturing method of semiconductor device 审中-公开
    半导体器件，半导体模块和半导体器件的制造方法

    公开(公告)号：US20060043544A1

    公开(公告)日：2006-03-02

    申请号：US11217582

    申请日：2005-08-31

    申请人： Hiroaki Tsukamoto ,  Kazuya Fujita ,  Takashi Yasudome

    发明人： Hiroaki Tsukamoto ,  Kazuya Fujita ,  Takashi Yasudome

    IPC分类号： H01L23/495

    CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： An imaging device as a semiconductor device includes a semiconductor substrate on which an imaging element is mounted, a light-transmitting lid section (covering section) arranged to face a light receiving section provided on one surface of the imaging element, and an adhesive layer arranged in an area excluding the light receiving section on the one surface of the imaging element for bonding between the semiconductor substrate and the lid section. The adhesive layer ranges from 10 g/(m2·24 h) to 200 g/(m2·24 h) in the water vapor permeability.

    摘要翻译： 作为半导体器件的成像器件包括其上安装有成像元件的半导体衬底，布置成面对设置在成像元件的一个表面上的光接收部分的透光盖部分（覆盖部分）和布置成 在除了用于在半导体衬底和盖部之间接合的成像元件的一个表面上的光接收部分的区域中。 粘合剂层的水蒸汽渗透性为10g /（m 2·2H 2·24h）至200g /（m 2·2H 2·24h）。

    Dental articulator and its transform plate
    10.
    发明授权
    Dental articulator and its transform plate 失效
    牙科咬合器及其变形板

    公开(公告)号：US06386868B1

    公开(公告)日：2002-05-14

    申请号：US09762675

    申请日：2001-02-12

    申请人： Kazuya Fujita

    发明人： Kazuya Fujita

    IPC分类号： A61C1100

    CPC分类号： A61C11/08 ,  A61C11/06 ,  A61C11/082

    摘要： A dental articulator (5) capable of reproducing or analyzing a physiological occlusion status by implementing a pressure receiving function and a traction function capable of operating in all the motion directions equivalently provided by a jaw joint function of a living body with a teeth plaster model fitted between upper and lower jaw frames, comprising an occlusal plane table (8) having the same anteversion angle as the occlusal plane oblique angle of a living body; a bite analysis plate (9) on which average positions of a spew center (91) and a posterior motion axis (92) are set at a plurality of positions and they are sketched in pairs with the average positions of the spew center on one side and those of the posterior motion axis on the other side of the plate; an incisal guidance plate (56) in which an inverted conical slope for mapping front-and-rear, right-and-left inclinations of the cusp is cut to allow the tip of an incisal guide to slide; and a transform plate (1) which is fitted using a lower jaw frame (52) as a base, wherein the teeth plaster model (7) of a lower jaw is mounted on and fitted to the transform plate (1) to effect a shift operation, thereby reproducing physiological occlusion status in conjunction with an intercuspal position and a posterior occlusion position of a living body.

    摘要翻译： 一种牙科咬合器（5），其能够通过实施压力接收功能和牵引功能来再现或分析生理闭塞状态，所述牵引功能能够在所有运动方向上操作，所有运动方向等同地由活体的钳口关节功能提供，其具有安装的牙膏膏 包括具有与活体的咬合面倾斜角度相同的前倾角的咬合平台（8​​）; 一个咬合分析板（9），其中一个喷墨中心（91）和后运动轴（92）的平均位置被设置在多个位置，并且它们与一侧的喷墨中心的平均位置成对地勾画 并且在板的另一侧的后运动轴的那些; 切割引导板（56），其中切割用于映射尖端的前后左右倾斜的倒锥形斜面，以允许切眼引导件的尖端滑动; 和使用下颚框架（52）作为基座装配的变形板（1），其中下颚的齿膏模型（7）安装在变形板（1）上并安装到变换板（1）上以实现移位 从而与活体的间隙位置和后闭塞位置一起再生生理闭塞状态。