摘要:
A water-retaining support for plants comprising a hydrogel-forming polymer (A) having a calcium ion absorption of 0-100 mg per 1 g of the dry weight thereof, having a chlorine ion content of 0.07-7 mmol per 1 g of the dry weight thereof and having a water absorption magnification in ion-exchanger water at 25° C. of 1.0×101 to 1.0×102; or a plant body-growing water-retaining material comprising a molded product of a mixture of such a polymer (A) and a plant body-growing support (B). The water-retaining support for plants and the plant body-growing water-retaining material are those which have an excellent water-retaining property and they substantially do not cause inhibition of root generation or inhibition of root elongation.
摘要:
An ion complex which comprises a water-insoluble polyion (P) and a water-soluble polyion (A); and is insoluble in water and soluble in an aqueous organic solvent. Such an ion complex becomes a coating material which can preferably be used for coating of various ionic substances (e.g., substance having biological activity such as an anticoagulant property or an antibacterial property).
摘要:
An electrophoretic matrix comprised of at least one water-insolubilized, temperature-responsive polymeric compound having an LCST is disclosed. The electro-phoretic matrix can change its hydrophilic/hydrophobic property by changing temperature. A method of using the electrophoretic matrix involves charging a sample onto the matrix and carrying out electrophoresis at a temperature above or below the LCST of the polymeric compound.
摘要:
Prior art technology has a problem in that when a plant is cultivated for a long period of time on a PVA film having its lower surface positioned in contact with a nutrient fluid, plant roots that have formed penetrate through the film. A plant cultivation system wherein the PVA film has an equilibrium degree of swelling in the range of from 125 to 250% as measured in water at 30° C. and has a loss tangent (tan δ) in the range of from 0.005 to 0.2 as measured in an equilibrium swollen state in water at 30° C., and a method for cultivating a plant by using this plant cultivation system. Plant cultivation can be performed for a long period of time while avoiding infection by bacteria and the like causative of plant diseases. Therefore, the present invention is useful in, e.g., agriculture and the manufacture of pharmaceuticals.
摘要:
Prior art technology has a problem in that when a plant is cultivated for a long period of time on a PVA film having its lower surface positioned in contact with a nutrient fluid, plant roots that have formed penetrate through the film. A plant cultivation system wherein the PVA film has an equilibrium degree of swelling in the range of from 125 to 250% as measured in water at 30° C. and has a loss tangent (tan δ) in the range of from 0.005 to 0.2 as measured in an equilibrium swollen state in water at 30° C., and a method for cultivating a plant by using this plant cultivation system. Plant cultivation can be performed for a long period of time while avoiding infection by bacteria and the like causative of plant diseases. Therefore, the present invention is useful in, e.g., agriculture and the manufacture of pharmaceuticals.
摘要:
A semiconductor film manufacturing method includes: forming a metal layer above the substrate; forming a gate electrode in each of pixels by patterning a metal layer; forming a gate insulating firm on the gate electrode; forming an amorphous semiconductor film on the gate insulating film; and crystallizing the amorphous semiconductor film by irradiating the amorphous semiconductor film with a laser beam, and a laser irradiation width of the laser beam corresponds to n times a width of each pixel (n is an integer of 2 or above), a laser energy intensity is higher in one end portion of the laser irradiation width than in the other end portion, and in the crystallizing, the laser energy intensity of the laser beam is inverted in increments of n pixels, alternately between one of the end portions of the laser irradiation width of the laser beam and the other end portion.
摘要:
An electronic component package has a first sealing member main surface with mounted electronic element, and a second sealing member. An outer circumference portion of a second sealing member is molded into a tapered shape, providing a tapered area in at least part of the outer circumference. A flat area adjacent to the tapered area is provided in at least part of a flat portion inward of the outer circumference portion of the surface of the second sealing member. A first area corresponding to the tapered area and a second area corresponding to the flat area are provided adjacent to each other on a first main surface of the first sealing member with mounted electronic component element. A width W2 of the second area is 0.66 to 1.2 times a width W4 of the flat area. First and second bonding layers are formed and bonded with each other by heating.
摘要:
A solid-state imaging device includes a first substrate including a light-sensing portion configured to perform photoelectric conversion of incident light and a wiring portion provided on a light-incident side; an optically transparent second substrate provided on a wiring portion side of the first substrate at a certain distance; a through-hole provided in the first substrate; a through-via provided in the through-hole; a front-surface-side electrode connected to the through-via and provided on a front surface of the first substrate; a back-surface-side electrode connected to the through-via and provided on a back surface of the first substrate; and a stopper electrode provided on the front-surface-side electrode and filling a space between the front-surface-side electrode and the second substrate.
摘要:
A solid-state imaging device includes a first substrate including a light-sensing portion configured to perform photoelectric conversion of incident light and a wiring portion provided on a light-incident side; an optically transparent second substrate provided on a wiring portion side of the first substrate at a certain distance; a through-hole provided in the first substrate; a through-via provided in the through-hole; a front-surface-side electrode connected to the through-via and provided on a front surface of the first substrate; a back-surface-side electrode connected to the through-via and provided on a back surface of the first substrate; and a stopper electrode provided on the front-surface-side electrode and filling a space between the front-surface-side electrode and the second substrate.
摘要:
A process for forming a resist pattern according to the invention is a process for forming a resist pattern in which a photoresist is coated on a first substrate, the coated photoresist is exposed to light of a predetermined pattern, and afterwards developing is performed, wherein in at least one of the processes of coating, exposing, and developing, whenever lots to which the first substrate belongs change, the atmosphere residing in the lot is changed.