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32 条记录 (耗时 0.029 秒)

    CONNECTING ELECTRICAL PARTS
    19.
    发明申请
    CONNECTING ELECTRICAL PARTS 审中-公开
    连接电气部件

    公开(公告)号：US20110132879A1

    公开(公告)日：2011-06-09

    申请号：US12961989

    申请日：2010-12-07

    申请人： Yuhsuke Matsumoto ,  Eiki Oosawa ,  Tatsumi Tsuchiya ,  Hideto Imai ,  Tatsushi Yoshida

    发明人： Yuhsuke Matsumoto ,  Eiki Oosawa ,  Tatsumi Tsuchiya ,  Hideto Imai ,  Tatsushi Yoshida

    IPC分类号： B23K9/04

    CPC分类号： B23K1/0016 ,  B23K1/0056 ,  B23K3/0623

    摘要： A method for connecting electrical parts The method includes retaining a piece of metal within a nozzle, supplying inert gas to the nozzle, and irradiating the retained piece of metal with a light source while the supplied inert gas flows from apertures in the nozzle. The metal is melted by the light source. The method also includes ejecting the melted metal from the nozzle by the supplied inert gas onto electrical parts.

    摘要翻译： 一种用于连接电气部件的方法该方法包括将一块金属保持在喷嘴内，向喷嘴供给惰性气体，并且在所供应的惰性气体从喷嘴中的孔流动的同时用光源照射保留的金属片。 金属被光源熔化。 该方法还包括通过所提供的惰性气体将熔融的金属从喷嘴喷射到电气部件上。

    HEAD-GIMBAL ASSEMBLY WITH A SUSPENSION-LEAD PAD HAVING A FORM THAT IS CONFIGURED TO INHIBIT FORMATION OF AN INTER-PAD SOLDER BRIDGE
    20.
    发明申请
    HEAD-GIMBAL ASSEMBLY WITH A SUSPENSION-LEAD PAD HAVING A FORM THAT IS CONFIGURED TO INHIBIT FORMATION OF AN INTER-PAD SOLDER BRIDGE 有权
    具有悬挂铅柱的头部组件具有被配置为禁止形成内部焊接桥的形式

    公开(公告)号：US20130063839A1

    公开(公告)日：2013-03-14

    申请号：US13229631

    申请日：2011-09-09

    申请人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Eiki Oosawa ,  Tatsushi Yoshida

    发明人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Eiki Oosawa ,  Tatsushi Yoshida

    IPC分类号： G11B5/60 ,  G11B17/02

    CPC分类号： G11B5/4826

    摘要： A head-gimbal assembly (HGA) with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge. The HGA includes a gimbal, a head-slider and a plurality of suspension-lead pads. The head-slider is coupled with the gimbal, and includes a plurality of head-slider pads. The plurality of suspension-lead pads is coupled with the plurality of head-slider pads by a plurality of solder bonds. A suspension-lead pad comprises a first lateral side, a second lateral side, a proximal side, disposed in proximity to a respective head-slider pad, and a distal side. A first width of the suspension-lead pad closer to the proximal side is substantially larger than a second width of the suspension-lead pad further from the proximal side than the first width. A disk drive including the HGA, and a head-slider with a head-slider pad having similar form to the suspension-lead pad are also provided.

    摘要翻译： 一种具有悬挂铅焊盘的头部万向节组件（HGA），其具有禁止形成垫间焊接桥的形式。 HGA包括万向节，头滑块和多个悬挂引线板。 头滑块与万向节连接，并且包括多个头滑块垫。 多个悬挂引线板通过多个焊接接合与多个头部 - 滑动器垫片连接。 悬挂引线垫包括设置在相应的头部 - 滑动器垫附近的第一侧面，第二侧面，近侧，以及远侧。 靠近近侧的悬挂引线焊盘的第一宽度比从第一宽度近的侧面的悬挂引线焊盘的第二宽度大得多。 还提供了包括HGA的磁盘驱动器和具有与悬挂引线板相似形式的磁头滑块的磁头滑块。