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公开(公告)号：US20110132879A1
公开(公告)日：2011-06-09
申请号：US12961989
申请日：2010-12-07
IPC分类号： B23K9/04
CPC分类号： B23K1/0016 , B23K1/0056 , B23K3/0623
摘要： A method for connecting electrical parts The method includes retaining a piece of metal within a nozzle, supplying inert gas to the nozzle, and irradiating the retained piece of metal with a light source while the supplied inert gas flows from apertures in the nozzle. The metal is melted by the light source. The method also includes ejecting the melted metal from the nozzle by the supplied inert gas onto electrical parts.
摘要翻译： 一种用于连接电气部件的方法该方法包括将一块金属保持在喷嘴内，向喷嘴供给惰性气体，并且在所供应的惰性气体从喷嘴中的孔流动的同时用光源照射保留的金属片。 金属被光源熔化。 该方法还包括通过所提供的惰性气体将熔融的金属从喷嘴喷射到电气部件上。
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2.发明授权Head-gimbal assembly with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge 有权具有悬挂铅焊盘的头部万向节组件具有禁止形成垫间焊接桥的形式公开(公告)号：US08477457B2
公开(公告)日：2013-07-02
申请号：US13229631
申请日：2011-09-09
CPC分类号： G11B5/4826
摘要： A head-gimbal assembly (HGA) with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge. The HGA includes a gimbal, a head-slider and a plurality of suspension-lead pads. The head-slider is coupled with the gimbal, and includes a plurality of head-slider pads. The plurality of suspension-lead pads is coupled with the plurality of head-slider pads by a plurality of solder bonds. A suspension-lead pad comprises a first lateral side, a second lateral side, a proximal side, disposed in proximity to a respective head-slider pad, and a distal side. A first width of the suspension-lead pad closer to the proximal side is substantially larger than a second width of the suspension-lead pad further from the proximal side than the first width. A disk drive including the HGA, and a head-slider with a head-slider pad having similar form to the suspension-lead pad are also provided.
摘要翻译： 一种具有悬挂铅焊盘的头部万向节组件（HGA），其具有禁止形成垫间焊接桥的形式。 HGA包括万向节，头滑块和多个悬挂引线板。 头滑块与万向节连接，并且包括多个头滑块垫。 多个悬挂引线板通过多个焊接接合与多个头部 - 滑动器垫片连接。 悬挂引线垫包括设置在相应的头部 - 滑动器垫附近的第一侧面，第二侧面，近侧，以及远侧。 靠近近侧的悬挂引线焊盘的第一宽度比从第一宽度近的侧面的悬挂引线焊盘的第二宽度大得多。 还提供了包括HGA的磁盘驱动器和具有与悬挂引线板相似形式的磁头滑块的磁头滑块。
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3.发明申请HEAD-GIMBAL ASSEMBLY WITH A SUSPENSION-LEAD PAD HAVING A FORM THAT IS CONFIGURED TO INHIBIT FORMATION OF AN INTER-PAD SOLDER BRIDGE 有权具有悬挂铅柱的头部组件具有被配置为禁止形成内部焊接桥的形式公开(公告)号：US20130063839A1
公开(公告)日：2013-03-14
申请号：US13229631
申请日：2011-09-09
CPC分类号： G11B5/4826
摘要： A head-gimbal assembly (HGA) with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge. The HGA includes a gimbal, a head-slider and a plurality of suspension-lead pads. The head-slider is coupled with the gimbal, and includes a plurality of head-slider pads. The plurality of suspension-lead pads is coupled with the plurality of head-slider pads by a plurality of solder bonds. A suspension-lead pad comprises a first lateral side, a second lateral side, a proximal side, disposed in proximity to a respective head-slider pad, and a distal side. A first width of the suspension-lead pad closer to the proximal side is substantially larger than a second width of the suspension-lead pad further from the proximal side than the first width. A disk drive including the HGA, and a head-slider with a head-slider pad having similar form to the suspension-lead pad are also provided.
摘要翻译： 一种具有悬挂铅焊盘的头部万向节组件（HGA），其具有禁止形成垫间焊接桥的形式。 HGA包括万向节，头滑块和多个悬挂引线板。 头滑块与万向节连接，并且包括多个头滑块垫。 多个悬挂引线板通过多个焊接接合与多个头部 - 滑动器垫片连接。 悬挂引线垫包括设置在相应的头部 - 滑动器垫附近的第一侧面，第二侧面，近侧，以及远侧。 靠近近侧的悬挂引线焊盘的第一宽度比从第一宽度近的侧面的悬挂引线焊盘的第二宽度大得多。 还提供了包括HGA的磁盘驱动器和具有与悬挂引线板相似形式的磁头滑块的磁头滑块。
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4.发明授权Apparatus for interconnecting connection pads of a head-gimbal assembly and manufacturing method for the head-gimbal assembly 有权用于互连头万向节组件的连接垫的装置和用于头部万向节组件的制造方法公开(公告)号：US08881967B2
公开(公告)日：2014-11-11
申请号：US12576715
申请日：2009-10-09
CPC分类号： B23K1/0016 , B23K1/0056 , B23K3/0623 , B23K26/03 , B23K26/1476 , B23K2101/42 , H05K3/3442 , H05K3/3478 , H05K3/3494 , H05K2201/10727 , H05K2203/0195 , H05K2203/041 , H05K2203/107
摘要： An apparatus for interconnecting two connection pads in a head-gimbal assembly. The apparatus includes a conveyer for conveying a metallic slug, and a nozzle for ejecting the metallic slug toward the two connection pads. The nozzle includes a receiving portion for receiving the metallic slug from the conveyer, and a straight guide disposed downstream of the receiving portion. The straight guide has a maximum inner diameter that is smaller than a minimum inner diameter of the receiving portion. The apparatus also includes a laser for applying a laser beam from an inlet side of the nozzle to the metallic slug as the metallic slug passes along a path that includes a first portion through said straight guide and a second portion between the straight guide and the two connection pads. The laser is configured to melt the metallic slug for attaching the metallic slug to the two connection pads.
摘要翻译： 一种用于互连头万向节组件中的两个连接焊盘的装置。 该装置包括用于输送金属块的输送机和用于朝向两个连接垫排出金属块的喷嘴。 喷嘴包括用于从传送器接收金属块的接收部分和设置在接收部分下游的直的引导件。 该直引导件的最大内径小于接收部分的最小内径。 该装置还包括一激光器，用于当金属芯块沿着包括通过所述直引导件的第一部分的路径和直引导件与两者之间的第二部分的路径通过时，将激光束从喷嘴的入口侧施加到金属块 连接垫 激光器被配置为熔化用于将金属块塞附接到两个连接焊盘的金属块。
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5.发明授权公开(公告)号：US07583475B2
公开(公告)日：2009-09-01
申请号：US11066949
申请日：2005-02-25
申请人： Yuhsuke Matsumoto , Tatsumi Tsuchiya , Takaaki Murokawa , Yoshio Uematsu , Tatsushi Yoshida , Nobuyuki Hashi , Hiroyasu Tsuchida , Takuma Muraki
发明人： Yuhsuke Matsumoto , Tatsumi Tsuchiya , Takaaki Murokawa , Yoshio Uematsu , Tatsushi Yoshida , Nobuyuki Hashi , Hiroyasu Tsuchida , Takuma Muraki
IPC分类号： G11B5/48
CPC分类号： H05K3/3442 , G11B5/4853 , H05K1/111 , H05K2201/0397 , H05K2201/09663 , H05K2201/0969 , H05K2201/09745 , H05K2201/10727 , H05K2203/041 , Y02P70/611 , Y02P70/613
摘要： Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.
摘要翻译： 本发明的实施例提供了当使用焊球连接接合焊盘和引线接线焊盘时防止焊料球偏离中心线并发生焊接问题的技术。 在一个实施例中，头悬挂组件包括设置在为弯曲提供的引线布线垫和为滑块设置的接合焊盘之间的焊球。 然后将焊球熔化以在引线接线焊盘和焊盘之间形成焊接接头。 在引线配线衬垫的前表面上的中心线附近的位置处设有通槽。 焊球通过重力从引线接线板的前表面落入通槽。 因此，与滑块接触的接触区域被固定在滑块的一侧。
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6.发明申请公开(公告)号：US20050199680A1
公开(公告)日：2005-09-15
申请号：US11066949
申请日：2005-02-25
申请人： Yuhsuke Matsumoto , Tatsumi Tsuchiya , Takaaki Murokawa , Yoshio Uematsu , Tatsushi Yoshida , Nobuyuki Hashi , Hiroyasu Tsuchida , Takuma Muraki
发明人： Yuhsuke Matsumoto , Tatsumi Tsuchiya , Takaaki Murokawa , Yoshio Uematsu , Tatsushi Yoshida , Nobuyuki Hashi , Hiroyasu Tsuchida , Takuma Muraki
CPC分类号： H05K3/3442 , G11B5/4853 , H05K1/111 , H05K2201/0397 , H05K2201/09663 , H05K2201/0969 , H05K2201/09745 , H05K2201/10727 , H05K2203/041 , Y02P70/611 , Y02P70/613
摘要： Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.
摘要翻译： 本发明的实施例提供了当使用焊球连接接合焊盘和引线接线焊盘时防止焊料球偏离中心线并发生焊接问题的技术。 在一个实施例中，头悬挂组件包括设置在为弯曲提供的引线布线垫和为滑块设置的接合焊盘之间的焊球。 然后将焊球熔化以在引线接线焊盘和焊盘之间形成焊接接头。 在引线配线衬垫的前表面上的中心线附近的位置处设有通槽。 焊球通过重力从引线接线板的前表面落入通槽。 因此，与滑块接触的接触区域被固定在滑块的一侧。
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7.发明申请公开(公告)号：US20060238921A1
公开(公告)日：2006-10-26
申请号：US11112719
申请日：2005-04-21
申请人： Yuhsuke Matsumoto , Tatsushi Yoshida , Takaaki Murokawa , Tatsumi Tsuchiya , Yoshio Uematsu , Nobuyuki Hashi
发明人： Yuhsuke Matsumoto , Tatsushi Yoshida , Takaaki Murokawa , Tatsumi Tsuchiya , Yoshio Uematsu , Nobuyuki Hashi
CPC分类号： G11B5/4826 , H01L2224/742 , H01L2924/01322 , H05K3/3442 , H05K2201/0397 , H05K2201/10727 , H05K2203/041 , H05K2203/0465 , Y02P70/613
摘要： Embodiments of the invention provide a head gimbal assembly (HGA) capable of effecting solder ball connection with use of low energy. In one embodiment, the HGA includes a head/slider. In the head/slider, slider pads and lead wire pads are connected to each other by reflow of solder balls under the radiation of a laser beam. Lead layers are connected to a magnetic head and electrode studs are connected to the lead layers, respectively, and are also connected to the slider pads. The diameter R (m) of a solder ball and a sectional area S (m2) of an electrode stud are in a relation of R2≧4S.
摘要翻译： 本发明的实施例提供一种能够使用低能量实现焊球连接的头万向架组件（HGA）。 在一个实施例中，HGA包括头/滑块。 在头/滑块中，通过在激光束的辐射下回流焊球，滑块和引线焊盘彼此连接。 引线层连接到磁头，电极柱分别连接到引线层，并且还连接到滑块。 焊球的直径R（m）和电极柱的截面积S（m 2）之间的关系为R 2 2 / S 2 = 4S。
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公开(公告)号：US07984545B2
公开(公告)日：2011-07-26
申请号：US12220746
申请日：2008-07-25
CPC分类号： B23K20/007 , H05K3/3442 , H05K3/3478 , H05K3/3494 , H05K2201/10727 , H05K2203/041 , H05K2203/086 , H05K2203/107 , Y02P70/613 , Y10T29/49021 , Y10T29/49025 , Y10T29/49027 , Y10T29/4903 , Y10T29/49032 , Y10T29/49169 , Y10T29/5313
摘要： Approaches for helping to decrease the amount of inactive gas necessary for reflow to interconnect connection terminals of a head slider and a suspension. Inactive gas is blown from a nozzle of a reflow apparatus toward interconnection joints of a head slider and a suspension. The head slider is bonded onto a gimbal tongue. The nozzle comprises a duct through which the inactive gas passes and a porous member fitted in an ejection outlet of the tube. Placing the porous member close to the head slider achieves effective reduction of oxygen concentration around solder balls.
摘要翻译： 有助于减少回流焊接头部滑块和悬架的连接端子所需的非活性气体量的方法。 非活性气体从回流装置的喷嘴吹向磁头滑块和悬架的互连接头。 磁头滑块被粘合到万向节舌头上。 喷嘴包括惰性气体通过的管道和装配在管的喷射出口中的多孔构件。 将多孔构件放置在头部滑块附近实现有效地减少焊球周围的氧浓度。
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公开(公告)号：US20090025205A1
公开(公告)日：2009-01-29
申请号：US12220746
申请日：2008-07-25
IPC分类号： G11B5/127
CPC分类号： B23K20/007 , H05K3/3442 , H05K3/3478 , H05K3/3494 , H05K2201/10727 , H05K2203/041 , H05K2203/086 , H05K2203/107 , Y02P70/613 , Y10T29/49021 , Y10T29/49025 , Y10T29/49027 , Y10T29/4903 , Y10T29/49032 , Y10T29/49169 , Y10T29/5313
摘要： Embodiments of the present invention help to decrease the amount of inactive gas necessary for reflow to interconnect connection terminals of a head slider and a suspension. In an embodiment of the present invention, inactive gas is blown from a nozzle of a reflow apparatus toward interconnection joints of a head slider and a suspension. The head slider is bonded onto a gimbal tongue. The nozzle comprises a duct through which the inactive gas passes and a porous member fitted in an ejection outlet of the tube. Placing the porous member close to the head slider achieves effective reduction of oxygen concentration around solder balls.
摘要翻译： 本发明的实施例有助于减少回流到磁头滑块和悬架的互连连接端子所需的非活性气体的量。 在本发明的一个实施方案中，惰性气体从回流装置的喷嘴吹向磁头滑块和悬架的互连接头。 磁头滑块被粘合到万向节舌头上。 喷嘴包括惰性气体通过的管道和装配在管的喷射出口中的多孔构件。 将多孔构件放置在头部滑块附近实现有效地减少焊球周围的氧浓度。
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10.发明授权Head gimbal assembly and magnetic disk drive with specific solder ball or slider pad and electrode stud dimensioning to produce reliable solder ball connection using laser energy 失效头万向架组件和磁盘驱动器，具有特定的焊球或滑块和电极柱尺寸，可以使用激光能量产生可靠的焊球连接公开(公告)号：US07400470B2
公开(公告)日：2008-07-15
申请号：US11112719
申请日：2005-04-21
申请人： Yuhsuke Matsumoto , Tatsushi Yoshida , Takaaki Murokawa , Tatsumi Tsuchiya , Yoshio Uematsu , Nobuyuki Hashi
发明人： Yuhsuke Matsumoto , Tatsushi Yoshida , Takaaki Murokawa , Tatsumi Tsuchiya , Yoshio Uematsu , Nobuyuki Hashi
IPC分类号： G11B5/60
CPC分类号： G11B5/4826 , H01L2224/742 , H01L2924/01322 , H05K3/3442 , H05K2201/0397 , H05K2201/10727 , H05K2203/041 , H05K2203/0465 , Y02P70/613
摘要： Embodiments of the invention provide a head gimbal assembly (HGA) capable of effecting solder ball connection with use of low energy. In one embodiment, the HGA includes a head/slider. In the head/slider, slider pads and lead wire pads are connected to each other by reflow of solder balls under the radiation of a laser beam. Lead layers are connected to a magnetic head and electrode studs are connected to the lead layers, respectively, and are also connected to the slider pads. The diameter R (m) of a solder ball and a sectional area S (m2) of an electrode stud are in a relation of R2≧4S.
摘要翻译： 本发明的实施例提供一种能够使用低能量实现焊球连接的头万向架组件（HGA）。 在一个实施例中，HGA包括头/滑块。 在头/滑块中，通过在激光束的辐射下回流焊球，滑块和引线焊盘彼此连接。 引线层连接到磁头，电极柱分别连接到引线层，并且还连接到滑块。 焊球的直径R（m）和电极柱的截面积S（m 2）之间的关系为R 2 2 / S 2 = 4S。
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