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    Method of removing lead-free solder from slider pad and magnetic disk drive
    5.
    发明申请
    Method of removing lead-free solder from slider pad and magnetic disk drive 失效
    从滑块和磁盘驱动器中去除无铅焊料的方法

    公开(公告)号：US20060012918A1

    公开(公告)日：2006-01-19

    申请号：US11179219

    申请日：2005-07-11

    申请人： Nobuyuki Hashi ,  Yuhsuke Matsumoto ,  Takuya Satoh ,  Tatsushi Yoshida

    发明人： Nobuyuki Hashi ,  Yuhsuke Matsumoto ,  Takuya Satoh ,  Tatsushi Yoshida

    IPC分类号： G11B5/60

    CPC分类号： B23H7/02 ,  B23K1/018 ,  H05K3/3442 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/176 ,  Y02P70/613

    摘要： A method for removing a lead-free solder from a slider pad is provided to permit re-utilization of a head/slider used in a magnetic disk drive. In one embodiment, a slider pad formed on a head/slider and a lead pad are connected to each other through a lead-free solder fillet. A cutting tool is heated beforehand to a temperature near the melting point of the lead-free solder. The cutting tool is moved in parallel with a surface of the slider pad to cut the solder fillet while softening the solder fillet. The solder fillet is removed so as not to impose a stress on the slider pad and in a state in which the head/slider can be re-utilized.

    摘要翻译： 提供了一种用于从滑动板移除无铅焊料的方法，以允许对磁盘驱动器中使用的磁头/滑块的再利用。 在一个实施例中，形成在头部/滑块和引线焊盘上的滑动焊盘通过无铅焊接圆角彼此连接。 预先将切削工具加热至接近无铅焊料的熔点的温度。 切削工具与滑块的表面平行地移动，以在软化焊料圆角的同时切割焊锡圆角。 去除焊接圆角，以便不在滑块上施加应力，并且在头/滑块可以被重新利用的状态下。

    Method of removing lead-free solder from slider pad and magnetic disk drive
    6.
    发明授权
    Method of removing lead-free solder from slider pad and magnetic disk drive 失效
    从滑块和磁盘驱动器中去除无铅焊料的方法

    公开(公告)号：US07342749B2

    公开(公告)日：2008-03-11

    申请号：US11179219

    申请日：2005-07-11

    申请人： Nobuyuki Hashi ,  Yuhsuke Matsumoto ,  Takuya Satoh ,  Tatsushi Yoshida

    发明人： Nobuyuki Hashi ,  Yuhsuke Matsumoto ,  Takuya Satoh ,  Tatsushi Yoshida

    IPC分类号： G11B5/48

    CPC分类号： B23H7/02 ,  B23K1/018 ,  H05K3/3442 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/176 ,  Y02P70/613

    摘要： A method for removing a lead-free solder from a slider pad is provided to permit re-utilization of a head/slider used in a magnetic disk drive. In one embodiment, a slider pad formed on a head/slider and a lead pad are connected to each other through a lead-free solder fillet. A cutting tool is heated beforehand to a temperature near the melting point of the lead-free solder. The cutting tool is moved in parallel with a surface of the slider pad to cut the solder fillet while softening the solder fillet. The solder fillet is removed so as not to impose a stress on the slider pad and in a state in which the head/slider can be re-utilized.

    摘要翻译： 提供了一种用于从滑动板移除无铅焊料的方法，以允许对磁盘驱动器中使用的磁头/滑块的再利用。 在一个实施例中，形成在头部/滑块和引线焊盘上的滑动焊盘通过无铅焊接圆角彼此连接。 预先将切削工具加热至接近无铅焊料的熔点的温度。 切削工具与滑块的表面平行地移动，以在软化焊料圆角的同时切割焊锡圆角。 去除焊接圆角，以便不在滑块上施加应力，并且在头/滑块可以被重新利用的状态下。

    CONNECTING ELECTRICAL PARTS
    7.
    发明申请
    CONNECTING ELECTRICAL PARTS 审中-公开
    连接电气部件

    公开(公告)号：US20110132879A1

    公开(公告)日：2011-06-09

    申请号：US12961989

    申请日：2010-12-07

    申请人： Yuhsuke Matsumoto ,  Eiki Oosawa ,  Tatsumi Tsuchiya ,  Hideto Imai ,  Tatsushi Yoshida

    发明人： Yuhsuke Matsumoto ,  Eiki Oosawa ,  Tatsumi Tsuchiya ,  Hideto Imai ,  Tatsushi Yoshida

    IPC分类号： B23K9/04

    CPC分类号： B23K1/0016 ,  B23K1/0056 ,  B23K3/0623

    摘要： A method for connecting electrical parts The method includes retaining a piece of metal within a nozzle, supplying inert gas to the nozzle, and irradiating the retained piece of metal with a light source while the supplied inert gas flows from apertures in the nozzle. The metal is melted by the light source. The method also includes ejecting the melted metal from the nozzle by the supplied inert gas onto electrical parts.

    摘要翻译： 一种用于连接电气部件的方法该方法包括将一块金属保持在喷嘴内，向喷嘴供给惰性气体，并且在所供应的惰性气体从喷嘴中的孔流动的同时用光源照射保留的金属片。 金属被光源熔化。 该方法还包括通过所提供的惰性气体将熔融的金属从喷嘴喷射到电气部件上。

    HEAD-GIMBAL ASSEMBLY WITH A SUSPENSION-LEAD PAD HAVING A FORM THAT IS CONFIGURED TO INHIBIT FORMATION OF AN INTER-PAD SOLDER BRIDGE
    8.
    发明申请
    HEAD-GIMBAL ASSEMBLY WITH A SUSPENSION-LEAD PAD HAVING A FORM THAT IS CONFIGURED TO INHIBIT FORMATION OF AN INTER-PAD SOLDER BRIDGE 有权
    具有悬挂铅柱的头部组件具有被配置为禁止形成内部焊接桥的形式

    公开(公告)号：US20130063839A1

    公开(公告)日：2013-03-14

    申请号：US13229631

    申请日：2011-09-09

    申请人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Eiki Oosawa ,  Tatsushi Yoshida

    发明人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Eiki Oosawa ,  Tatsushi Yoshida

    IPC分类号： G11B5/60 ,  G11B17/02

    CPC分类号： G11B5/4826

    摘要： A head-gimbal assembly (HGA) with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge. The HGA includes a gimbal, a head-slider and a plurality of suspension-lead pads. The head-slider is coupled with the gimbal, and includes a plurality of head-slider pads. The plurality of suspension-lead pads is coupled with the plurality of head-slider pads by a plurality of solder bonds. A suspension-lead pad comprises a first lateral side, a second lateral side, a proximal side, disposed in proximity to a respective head-slider pad, and a distal side. A first width of the suspension-lead pad closer to the proximal side is substantially larger than a second width of the suspension-lead pad further from the proximal side than the first width. A disk drive including the HGA, and a head-slider with a head-slider pad having similar form to the suspension-lead pad are also provided.

    摘要翻译： 一种具有悬挂铅焊盘的头部万向节组件（HGA），其具有禁止形成垫间焊接桥的形式。 HGA包括万向节，头滑块和多个悬挂引线板。 头滑块与万向节连接，并且包括多个头滑块垫。 多个悬挂引线板通过多个焊接接合与多个头部 - 滑动器垫片连接。 悬挂引线垫包括设置在相应的头部 - 滑动器垫附近的第一侧面，第二侧面，近侧，以及远侧。 靠近近侧的悬挂引线焊盘的第一宽度比从第一宽度近的侧面的悬挂引线焊盘的第二宽度大得多。 还提供了包括HGA的磁盘驱动器和具有与悬挂引线板相似形式的磁头滑块的磁头滑块。

    Appearance inspecting jig for small parts and inspecting method employing the same jig
    9.
    发明授权
    Appearance inspecting jig for small parts and inspecting method employing the same jig 失效
    小零件外观检查夹具及采用相同夹具的检验方法

    公开(公告)号：US06628380B1

    公开(公告)日：2003-09-30

    申请号：US09897183

    申请日：2001-07-02

    申请人： Masashi Fujimori ,  Kenji Itoh ,  Toru Koike ,  Yuhsuke Matsumoto ,  Seiji Nakagawa ,  Tatsumi Tsuchiya ,  Tatsushi Yoshida

    发明人： Masashi Fujimori ,  Kenji Itoh ,  Toru Koike ,  Yuhsuke Matsumoto ,  Seiji Nakagawa ,  Tatsumi Tsuchiya ,  Tatsushi Yoshida

    IPC分类号： G01N2100

    CPC分类号： G01N21/8806 ,  G11B5/4806

    摘要： A jig for inspecting the appearance of small parts with an optical microscope, the jig is equipped with a base, having an upper flat surface which becomes a mounting stage of the optical microscope, and is also provided with a member for moving the upper flat surface at least in a direction approximately parallel to a direction of an optical axis of an objective lens of the optical microscope in order to focus the optical microscope on an inspection portion of the small parts mounted on the upper flat surface. The jig is also equipped with an inspection-object supporting portion, provided with a member for supporting the small parts at the predetermined portion on the base. Furthermore, the jig is equipped with reflecting mirrors which have a mirrorlike surface with an inclined angle of approximately 45 degrees to the upper flat surface of the base.

    摘要翻译： 一种用光学显微镜检查小部件的外观的夹具，该夹具具有基部，具有成为光学显微镜的安装台的上部平坦面，并且还设置有用于使上部平坦面 至少在与光学显微镜的物镜的光轴的方向大致平行的方向上，以将光学显微镜聚焦在安装在上平坦表面上的小部件的检查部分上。 该夹具还配备有检查对象支撑部，该检查对象支撑部设置有用于在基部上的预定部分处支撑小部件的部件。 此外，夹具配备有反射镜，反射镜具有与基座的上平坦表面大约45度的倾斜角的镜面。

    Head-gimbal assembly with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge
    10.
    发明授权
    Head-gimbal assembly with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge 有权
    具有悬挂铅焊盘的头部万向节组件具有禁止形成垫间焊接桥的形式

    公开(公告)号：US08477457B2

    公开(公告)日：2013-07-02

    申请号：US13229631

    申请日：2011-09-09

    申请人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Eiki Oosawa ,  Tatsushi Yoshida

    发明人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Eiki Oosawa ,  Tatsushi Yoshida

    IPC分类号： G11B5/54 ,  G11B5/60

    CPC分类号： G11B5/4826

    摘要： A head-gimbal assembly (HGA) with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge. The HGA includes a gimbal, a head-slider and a plurality of suspension-lead pads. The head-slider is coupled with the gimbal, and includes a plurality of head-slider pads. The plurality of suspension-lead pads is coupled with the plurality of head-slider pads by a plurality of solder bonds. A suspension-lead pad comprises a first lateral side, a second lateral side, a proximal side, disposed in proximity to a respective head-slider pad, and a distal side. A first width of the suspension-lead pad closer to the proximal side is substantially larger than a second width of the suspension-lead pad further from the proximal side than the first width. A disk drive including the HGA, and a head-slider with a head-slider pad having similar form to the suspension-lead pad are also provided.

    摘要翻译： 一种具有悬挂铅焊盘的头部万向节组件（HGA），其具有禁止形成垫间焊接桥的形式。 HGA包括万向节，头滑块和多个悬挂引线板。 头滑块与万向节连接，并且包括多个头滑块垫。 多个悬挂引线板通过多个焊接接合与多个头部 - 滑动器垫片连接。 悬挂引线垫包括设置在相应的头部 - 滑动器垫附近的第一侧面，第二侧面，近侧，以及远侧。 靠近近侧的悬挂引线焊盘的第一宽度比从第一宽度近的侧面的悬挂引线焊盘的第二宽度大得多。 还提供了包括HGA的磁盘驱动器和具有与悬挂引线板相似形式的磁头滑块的磁头滑块。