公开(公告)号：US09287034B2

公开(公告)日：2016-03-15

申请号：US13729106

申请日：2012-12-28

Applicant: IBIDEN CO., LTD.

Inventor： Yasuhiko Mano ,  Kazuhiro Yoshikawa ,  Takashi Kariya

IPC: H05K1/18 ,  H01F27/28 ,  H01F17/00 ,  H05K1/16 ,  H05K3/46

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F2017/002 ,  H01F2017/0066 ,  H05K1/162 ,  H05K1/165 ,  H05K1/18 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4682 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2203/0191 ,  H05K2203/1469

Abstract: A printed wiring board has a core base having an opening portion, an inductor component accommodated in the opening portion, and a filler resin filling gap between the component and a side wall of the opening portion. The component has a support layer, a first conductive pattern on the support, an interlayer insulation layer on the support and first pattern, a second conductive pattern on the insulation layer, and a via conductor in the insulation layer and connecting the first and second patterns, the insulation layer includes a magnetic layer and a resin layer covering the magnetic layer, the magnetic layer includes magnetic material and resin material and has a first hole, the insulation layer has a second hole penetrating through the resin layer such that the second hole passes through the first hole and extends to the first pattern, and the via conductor is formed in the second hole.

Abstract translation: 印刷电路板具有：具有开口部的芯基部，容纳在开口部的电感器部，以及所述部件与所述开口部的侧壁之间的填充树脂填充间隙。 所述部件具有支撑层，支撑体上的第一导电图案，支撑件上的层间绝缘层和第一图案，绝缘层上的第二导电图案，以及绝缘层中的通孔导体，并连接第一和第二图案 所述绝缘层包括磁性层和覆盖所述磁性层的树脂层，所述磁性层包括磁性材料和树脂材料，并且具有第一孔，所述绝缘层具有穿过所述树脂层的第二孔，使得所述第二孔通过 通过第一孔延伸到第一图案，并且通孔导体形成在第二孔中。

公开(公告)号：US20130342301A1

公开(公告)日：2013-12-26

申请号：US13927243

申请日：2013-06-26

Applicant: IBIDEN CO., LTD.

Inventor： Yasuhiko MANO ,  Kazuhiro Yoshikawa ,  Haruhiko Morita

IPC: H01F27/28

CPC classification number: H01F27/2804 ,  H01F27/24 ,  H01F41/041 ,  H01F2027/2809 ,  Y10T29/4902

Abstract: An inductor device for a printed wiring board has an insulation layer having a first penetrating hole penetrating through the insulation layer, a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer such that the magnetic core structure including a first magnetic body layer formed in the first penetrating hole is formed through the insulation layer, and a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding the circumference of the magnetic core structure.

Abstract translation: 一种用于印刷电路板的电感器件具有绝缘层，该绝缘层具有穿过绝缘层的第一穿透孔，磁芯结构包括通过绝缘层填充在第一穿透孔中的磁性材料，使得磁芯结构包括第一 形成在第一穿透孔中的磁性体层通过绝缘层形成，导体层形成在绝缘层上并具有电感图案，使得电感器图案围绕磁芯结构的圆周。

公开(公告)号：US09508483B2

公开(公告)日：2016-11-29

申请号：US13927243

申请日：2013-06-26

Applicant: IBIDEN Co., Ltd.

Inventor： Yasuhiko Mano ,  Kazuhiro Yoshikawa ,  Haruhiko Morita

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/24 ,  H05K1/03 ,  H05K1/11 ,  H01F41/04

CPC classification number: H01F27/2804 ,  H01F27/24 ,  H01F41/041 ,  H01F2027/2809 ,  Y10T29/4902

Abstract: An inductor device for a printed wiring board has an insulation layer having a first penetrating hole penetrating through the insulation layer, a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer such that the magnetic core structure including a first magnetic body layer formed in the first penetrating hole is formed through the insulation layer, and a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding the circumference of the magnetic core structure.

Abstract translation: 一种用于印刷电路板的电感器件具有绝缘层，该绝缘层具有穿过绝缘层的第一穿透孔，磁芯结构包括通过绝缘层填充在第一穿透孔中的磁性材料，使得磁芯结构包括第一 形成在第一穿透孔中的磁性体层通过绝缘层形成，导体层形成在绝缘层上并具有电感图案，使得电感器图案围绕磁芯结构的圆周。

公开(公告)号：US20150026975A1

公开(公告)日：2015-01-29

申请号：US14449322

申请日：2014-08-01

Applicant: Ibiden Co., Ltd.

Inventor： Takashi Kariya ,  Kazuhiro Yoshikawa ,  Daiki Komatsu ,  Ramesh Bhandari

IPC: H05K3/42 ,  H05K3/46

CPC classification number: H05K3/429 ,  H01L21/486 ,  H01L23/13 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/183 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/068 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A multilayer printed wiring board includes a core base material having a penetrating portion, a low-thermal-expansion substrate accommodated inside the penetrating portion of the core base material and having a first surface for mounting a semiconductor element and a second surface on the opposite side of the first surface, a first through-hole conductor provided inside the low-thermal-expansion substrate and provided for electrical connection between the first surface and the second surface of the low-thermal-expansion substrate, a filler filled in a gap between the low-thermal-expansion substrate and an inner wall of the core base material, and a wiring layer formed on at least one of the first surface and the second surface of the low-thermal-expansion substrate and having a resin insulation layer and a conductive layer. The wiring layer has a via conductor connecting the first through-hole conductor and the conductive layer.

Abstract translation: 多层印刷布线板包括具有穿透部分的芯基材，容纳在芯基材的穿透部分内的低热膨胀基板，并且具有用于安装半导体元件的第一表面和在相对侧上的第二表面 所述第一通孔导体设置在所述低热膨胀基板内部并且设置用于在所述低热膨胀基板的第一表面和所述第二表面之间的电连接，填充在所述低热膨胀基板之间的间隙中的填料 低热膨胀基板和芯基材的内壁，以及形成在低热膨胀基板的第一表面和第二表面中的至少一个上的布线层，并且具有树脂绝缘层和导电 层。 布线层具有连接第一通孔导体和导电层的通孔导体。