公开(公告)号：US20130248235A1

公开(公告)日：2013-09-26

申请号：US13896436

申请日：2013-05-17

Applicant: Industrial Technology Research Institute

Inventor： Chien-Min Hsu ,  Min-Lin Lee ,  Cheng-Liang Cheng ,  Li-Duan Tsai

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H01G4/33 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/642 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/0231 ,  H05K1/162 ,  H05K3/4608 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/09309 ,  H05K2203/0315

Abstract: An embedded capacitor module includes an electrode lead-out portion and at least one solid electrolytic capacitor portion adjacently disposed with the electrode lead-out portion. The electrode lead-out portion comprises a first substrate, a second substrate, a first insulating material disposed between the first substrate and the second substrate, a first porous layer formed on at least one surface of the first substrate, and a first oxide layer disposed on the first porous layer. The solid electrolytic capacitor portion comprises the first substrate, the second substrate, the first porous layer, the first oxide layer, all of which are extended from the electrode lead-out portion, a first conductive polymer layer disposed on the first oxide layer, a first carbon layer disposed on the first conductive polymer layer, and a first conductive adhesive layer disposed on the first carbon layer.

Abstract translation: 嵌入式电容器模块包括电极引出部分和与电极引出部分相邻设置的至少一个固体电解电容器部分。 电极引出部包括第一基板，第二基板，设置在第一基板和第二基板之间的第一绝缘材料，形成在第一基板的至少一个表面上的第一多孔层和设置在第一基板 在第一多孔层上。 固体电解电容器部分包括第一衬底，第二衬底，第一多孔层，第一氧化物层，它们全部从电极引出部分延伸出来，第一导电聚合物层设置在第一氧化物层上， 设置在第一导电聚合物层上的第一碳层和设置在第一碳层上的第一导电粘合剂层。

公开(公告)号：US12185456B2

公开(公告)日：2024-12-31

申请号：US17564225

申请日：2021-12-29

Applicant: First Hi-tec Enterprise Co., Ltd. ,  NEXCOM International Co., Ltd. ,  Industrial Technology Research Institute

Inventor： Min-Lin Lee ,  Sheng-Che Hung ,  Ching-Shan Chang ,  Ying-Tsuen Liou

IPC: H05K1/02 ,  H01R12/73 ,  H01R13/6461 ,  H05K3/42 ,  H01R12/77 ,  H01R12/78 ,  H01R12/81 ,  H01R13/26 ,  H01R13/6471 ,  H01R13/648 ,  H01R13/658 ,  H01R13/6581 ,  H01R13/6585 ,  H05K3/46

Abstract: A circuit board and an electronic package using the same are provided. The circuit board includes a rigid board body, at least one bendable extension portion, connecting members, and shielding members. The rigid board body includes conductive layers and dielectric layers therebetween. The extension portion is connected to a side of the rigid board body and formed by layers of the conductive layers and at least one layer of the dielectric layers extending outside the rigid board body. The connecting members are arranged on a connecting end of the extension portion and electrically connected to a signal layer of the conductive layers. The shielding members are arranged around the corresponding connecting members and electrically connected to a ground layer of the conductive layers. The connecting members and the shielding members protrude from the connecting end. A height of the shielding members is lower than a height of the connecting members.

公开(公告)号：US20140048908A1

公开(公告)日：2014-02-20

申请号：US13797366

申请日：2013-03-12

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Peng-Shu Chen ,  Min-Lin Lee ,  Shih-Hsien Wu ,  Shur-Fen Liu

IPC: H01L23/48

CPC classification number: H01L23/48 ,  H01L21/02107 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/5223 ,  H01L23/5228 ,  H01L23/64 ,  H01L23/66 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/06181 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81192 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor substrate assembly is proposed. The semiconductor interposer comprises a substrate having a first surface and a second surface opposite to the first surface, a first conductive pad, a second conductive pad and a conductive pillar. The first conductive pad is formed at a predetermined location of the first surface of the substrate. The second conductive pad is formed at a predetermined location of the second surface of the substrate as compared with the position of the first conductive pad. The conductive pillar is formed in the substrate and contacts with one of the first conductive pad and the second conductive pad.

Abstract translation: 提出了一种半导体衬底组件。 半导体插入器包括具有第一表面和与第一表面相对的第二表面的衬底，第一导电焊盘，第二导电焊盘和导电柱。 第一导电焊盘形成在基板的第一表面的预定位置处。 与第一导电焊盘的位置相比，第二导电焊盘形成在基板的第二表面的预定位置处。 导电柱形成在基板中并与第一导电焊盘和第二导电焊盘之一接触。

公开(公告)号：US20230189435A1

公开(公告)日：2023-06-15

申请号：US17564225

申请日：2021-12-29

Applicant: First Hi-tec Enterprise Co.,Ltd. ,  NEXCOM International Co., Ltd. ,  Industrial Technology Research Institute

Inventor： Min-Lin Lee ,  Sheng-Che Hung ,  Ching-Shan Chang ,  Ying-Tsuen Liou

IPC: H05K1/02 ,  H01R13/6461 ,  H01R12/73 ,  H01R13/26

CPC classification number: H05K1/0278 ,  H01R13/6461 ,  H01R12/73 ,  H01R13/26

Abstract: A circuit board and an electronic package using the same are provided. The circuit board includes a rigid board body, at least one bendable extension portion, connecting members, and shielding members. The rigid board body includes conductive layers and dielectric layers therebetween. The extension portion is connected to a side of the rigid board body and formed by layers of the conductive layers and at least one layer of the dielectric layers extending outside the rigid board body. The connecting members are arranged on a connecting end of the extension portion and electrically connected to a signal layer of the conductive layers. The shielding members are arranged around the corresponding connecting members and electrically connected to a ground layer of the conductive layers. The connecting members and the shielding members protrude from the connecting end. A height of the shielding members is lower than a height of the connecting members.