公开(公告)号：US20140134459A1

公开(公告)日：2014-05-15

申请号：US13855719

申请日：2013-04-03

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Kuo-Shu Kao ,  Tao-Chih Chang ,  Wen-Chih Chen

IPC: B23K35/24 ,  B32B15/01

CPC classification number: B23K35/24 ,  B23K35/282 ,  B23K35/3013 ,  B23K35/302 ,  B32B15/01 ,  B32B15/018 ,  H01L23/3735 ,  H01L23/49513 ,  H01L23/49582 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0345 ,  H01L2224/04026 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/2612 ,  H01L2224/27826 ,  H01L2224/291 ,  H01L2224/29118 ,  H01L2224/29561 ,  H01L2224/29565 ,  H01L2224/29582 ,  H01L2224/29583 ,  H01L2224/29639 ,  H01L2224/29644 ,  H01L2224/29647 ,  H01L2224/29663 ,  H01L2224/29664 ,  H01L2224/29669 ,  H01L2224/29673 ,  H01L2224/29676 ,  H01L2224/29678 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/83007 ,  H01L2224/8309 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83815 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/15787 ,  Y10T428/12792 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01076 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A solder and a solder joint structure formed by the solder are provided. The solder includes a zinc-based material, a copper film, and a noble metal film. The copper film completely covers the surface of the zinc-based material. The noble metal film completely covers the copper film. The solder joint structure includes a zinc-based material and an intermetallic layer. The intermetallic layer consists of zinc and noble metal and completely covers the surface of the zinc-based material.

Abstract translation: 提供由焊料形成的焊料和焊点结构。 焊料包括锌基材料，铜膜和贵金属膜。 铜膜完全覆盖锌基材料的表面。 贵金属膜完全覆盖铜膜。 焊接结构包括锌基材料和金属间化合物层。 金属间层由锌和贵金属组成，并完全覆盖锌基材料的表面。