公开(公告)号：US20160043239A1

公开(公告)日：2016-02-11

申请号：US14919744

申请日：2015-10-22

Applicant: Industrial Technology Research Institute

Inventor： Hsiang-Hung Chang ,  Wen-Chih Chen ,  Chia-Wei Jui ,  Zhi-Cheng Hsiao ,  Cheng-Ta Ko ,  Rong-Shen Lee ,  Sheng-Shu Yang

IPC: H01L31/02 ,  H01L31/0203

CPC classification number: H01L31/02002 ,  H01L23/481 ,  H01L24/09 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469 ,  H01L31/0203 ,  H01L2224/05009

Abstract: Conductive plug structures suitable for stacked semiconductor device package is provided, wherein large contact region between the conductive plug structures and the corresponding pads of devices can be achieved, to reduce electrical impedance. Therefore, package structures such as photosensitive device packages using the conductive plug structures have superior electrical performance and reliability.

Abstract translation: 提供适用于层叠半导体器件封装的导电插塞结构，其中可以实现导电插塞结构和相应的器件焊盘之间的大的接触区域，以减少电阻抗。 因此，使用导电插塞结构的诸如光敏器件封装的封装结构具有优异的电性能和可靠性。

公开(公告)号：US11776867B2

公开(公告)日：2023-10-03

申请号：US17839500

申请日：2022-06-14

Applicant: Industrial Technology Research Institute

Inventor： Kuo-Shu Kao ,  Tao-Chih Chang ,  Wen-Chih Chen ,  Tai-Jyun Yu ,  Po-Kai Chiu ,  Yen-Ting Lin ,  Wei-Kuo Han

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/495 ,  H01L23/373 ,  H01L23/433

CPC classification number: H01L23/367 ,  H01L23/3157 ,  H01L23/3731 ,  H01L23/4334 ,  H01L23/4951 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49586 ,  H01L23/3121 ,  H01L2224/26175 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A chip package including a heat-dissipating device, a first thermal interface material layer disposed on the heat-dissipating device, a patterned circuit layer disposed on the first thermal interface material layer, a chip disposed on the patterned circuit layer and electrically connected to the patterned circuit layer, and an insulating encapsulant covering the chip, the patterned circuit layer, and the first thermal interface material layer is provided. The first thermal interface material layer has a thickness between 100 μm and 300 μm. The first thermal interface material layer is located between the patterned circuit layer and the heat-dissipating device.

公开(公告)号：US20170052103A1

公开(公告)日：2017-02-23

申请号：US15245199

申请日：2016-08-24

Applicant: Industrial Technology Research Institute

Inventor： Chia-Wen Chiang ,  Cheng-Ta Ko ,  I-Hsing Lin ,  Hsiang-Hung Chang ,  Wen-Chih Chen

IPC: G01N15/06

Abstract: A miniaturized particulate matter detector that includes a filter and a concentration detector is provided. The filter has a plurality of holes, and the concentration detector is correspondingly disposed under the filter. The concentration detector has a detected area used to detect a concentration of at least one miniaturized particulate matter. A manufacturing method of the filter is also provided.

Abstract translation: 提供一种包括过滤器和浓度检测器的微型颗粒物检测器。 过滤器具有多个孔，并且浓度检测器相应地设置在过滤器下方。 浓度检测器具有用于检测至少一种小型化颗粒物质的浓度的检测区域。 还提供了一种过滤器的制造方法。

公开(公告)号：US09308603B2

公开(公告)日：2016-04-12

申请号：US13855719

申请日：2013-04-03

Applicant: Industrial Technology Research Institute

Inventor： Kuo-Shu Kao ,  Tao-Chih Chang ,  Wen-Chih Chen

IPC: B32B15/20 ,  B23K35/24 ,  B32B15/01 ,  B23K35/28 ,  B23K35/30 ,  H01L23/495 ,  H01L23/00 ,  H01L23/373 ,  H01L25/065

CPC classification number: B23K35/24 ,  B23K35/282 ,  B23K35/3013 ,  B23K35/302 ,  B32B15/01 ,  B32B15/018 ,  H01L23/3735 ,  H01L23/49513 ,  H01L23/49582 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0345 ,  H01L2224/04026 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/2612 ,  H01L2224/27826 ,  H01L2224/291 ,  H01L2224/29118 ,  H01L2224/29561 ,  H01L2224/29565 ,  H01L2224/29582 ,  H01L2224/29583 ,  H01L2224/29639 ,  H01L2224/29644 ,  H01L2224/29647 ,  H01L2224/29663 ,  H01L2224/29664 ,  H01L2224/29669 ,  H01L2224/29673 ,  H01L2224/29676 ,  H01L2224/29678 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/83007 ,  H01L2224/8309 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83815 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/15787 ,  Y10T428/12792 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01076 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A solder and a solder joint structure formed by the solder are provided. The solder includes a zinc-based material, a copper film, and a noble metal film. The copper film completely covers the surface of the zinc-based material. The noble metal film completely covers the copper film. The solder joint structure includes a zinc-based material and an intermetallic layer. The intermetallic layer consists of zinc and noble metal and completely covers the surface of the zinc-based material.

Abstract translation: 提供由焊料形成的焊料和焊点结构。 焊料包括锌基材料，铜膜和贵金属膜。 铜膜完全覆盖锌基材料的表面。 贵金属膜完全覆盖铜膜。 焊接结构包括锌基材料和金属间化合物层。 金属间层由锌和贵金属组成，并完全覆盖锌基材料的表面。

公开(公告)号：US09143243B2

公开(公告)日：2015-09-22

申请号：US14018434

申请日：2013-09-05

Applicant: Industrial Technology Research Institute

Inventor： Shin-Yi Huang ,  Wen-Chih Chen ,  Tao-Chih Chang

IPC: H04B10/80 ,  H01L23/00

CPC classification number: H04B10/802 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A power module for high/low voltage insulation is provided. The power module includes a first substrate, a second substrate and an insulating substrate. The first substrate includes a first control circuit and a light source, wherein the first control circuit controls the light source to emit light. The second substrate includes a light-sensing part, a second control circuit and a power device. The light-sensing part receives the light of the light source of the first substrate to send a sensing information. The second control circuit correspondingly drives the power device in accordance with the sensing information. The insulating substrate is disposed between the first substrate and second substrate.

Abstract translation: 提供高/低压绝缘电源模块。 功率模块包括第一衬底，第二衬底和绝缘衬底。 第一基板包括第一控制电路和光源，其中第一控制电路控制光源发光。 第二基板包括光感测部件，第二控制电路和功率器件。 光检测部分接收第一基板的光源的光以发送感测信息。 第二控制电路根据感测信息相应地驱动功率器件。 绝缘基板设置在第一基板和第二基板之间。

公开(公告)号：US20220310473A1

公开(公告)日：2022-09-29

申请号：US17839500

申请日：2022-06-14

Applicant: Industrial Technology Research Institute

Inventor： Kuo-Shu Kao ,  Tao-Chih Chang ,  Wen-Chih Chen ,  Tai-Jyun Yu ,  Po-Kai Chiu ,  Yen-Ting Lin ,  Wei-Kuo Han

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/495 ,  H01L23/373 ,  H01L23/433

Abstract: A chip package including a heat-dissipating device, a first thermal interface material layer disposed on the heat-dissipating device, a patterned circuit layer disposed on the first thermal interface material layer, a chip disposed on the patterned circuit layer and electrically connected to the patterned circuit layer, and an insulating encapsulant covering the chip, the patterned circuit layer, and the first thermal interface material layer is provided. The first thermal interface material layer has a thickness between 100 μm and 300 μm. The first thermal interface material layer is located between the patterned circuit layer and the heat-dissipating device.

公开(公告)号：US11387159B2

公开(公告)日：2022-07-12

申请号：US16808369

申请日：2020-03-04

Applicant: Industrial Technology Research Institute

Inventor： Kuo-Shu Kao ,  Tao-Chih Chang ,  Wen-Chih Chen ,  Tai-Jyun Yu ,  Po-Kai Chiu ,  Yen-Ting Lin ,  Wei-Kuo Han

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/495 ,  H01L23/31 ,  H01L23/433

Abstract: A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip pad having a first surface and a second surface opposite to the first surface and a lead connected to the chip pad. The first chip is disposed on the first surface of the chip pad and electrically connected to the lead of the lead frame and to the outside of the insulating encapsulant via the lead. The head dissipation structure is disposed on the second surface of the chip pad and includes a thermal interface material layer attached to the second surface. The insulating encapsulant encapsulates the first chip, the heat dissipation structure, and a portion of the lead frame.

公开(公告)号：US20190109064A1

公开(公告)日：2019-04-11

申请号：US15976886

申请日：2018-05-11

Applicant: Industrial Technology Research Institute

Inventor： Kuo-Shu Kao ,  Tao-Chih Chang ,  Wen-Chih Chen ,  Tai-Jyun Yu ,  Po-Kai Chiu ,  Yen-Ting Lin ,  Wei-Kuo Han

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/373 ,  H01L23/495

Abstract: A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip pad having a first surface and a second surface opposite to the first surface and a lead connected to the chip pad. The first chip is disposed on the first surface of the chip pad and electrically connected to the lead of the lead frame and to the outside of the insulating encapsulant via the lead. The head dissipation structure is disposed on the second surface of the chip pad and includes a thermal interface material layer attached to the second surface. The insulating encapsulant encapsulates the first chip, the heat dissipation structure, and a portion of the lead frame.

公开(公告)号：US10458893B2

公开(公告)日：2019-10-29

申请号：US15245199

申请日：2016-08-24

Applicant: Industrial Technology Research Institute

Inventor： Chia-Wen Chiang ,  Cheng-Ta Ko ,  I-Hsing Lin ,  Hsiang-Hung Chang ,  Wen-Chih Chen

IPC: G01N15/06 ,  G01N15/00

Abstract: A miniaturized particulate matter detector that includes a filter and a concentration detector is provided. The filter has a plurality of holes, and the concentration detector is correspondingly disposed under the filter. The concentration detector has a detected area used to detect a concentration of at least one miniaturized particulate matter. A manufacturing method of the filter is also provided.

公开(公告)号：US20140374629A1

公开(公告)日：2014-12-25

申请号：US14018434

申请日：2013-09-05

Applicant: Industrial Technology Research Institute

Inventor： Shin-Yi Huang ,  Wen-Chih Chen ,  Tao-Chih Chang

IPC: H04B10/80

CPC classification number: H04B10/802 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A power module for high/low voltage insulation is provided. The power module includes a first substrate, a second substrate and an insulating substrate. The first substrate includes a first control circuit and a light source, wherein the first control circuit controls the light source to emit light. The second substrate includes a light-sensing part, a second control circuit and a power device. The light-sensing part receives the light of the light source of the first substrate to send a sensing information. The second control circuit correspondingly drives the power device in accordance with the sensing information. The insulating substrate is disposed between the first substrate and second substrate.

Abstract translation: 提供高/低压绝缘电源模块。 功率模块包括第一衬底，第二衬底和绝缘衬底。 第一基板包括第一控制电路和光源，其中第一控制电路控制光源发光。 第二基板包括光感测部件，第二控制电路和功率器件。 光检测部分接收第一基板的光源的光以发送感测信息。 第二控制电路根据感测信息相应地驱动功率器件。 绝缘基板设置在第一基板和第二基板之间。