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    CHANNELIZATION FOR DISPERSION LIMITED WAVEGUIDE COMMUNICATION CHANNELS
    11.
    发明申请
    CHANNELIZATION FOR DISPERSION LIMITED WAVEGUIDE COMMUNICATION CHANNELS 审中-公开

    公开(公告)号：US20180316434A1

    公开(公告)日：2018-11-01

    申请号：US15965637

    申请日：2018-04-27

    Applicant: Intel Corporation

    Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Emanuel Cohen

    IPC: H04B10/2575

    CPC classification number: H04B10/2575 ,  H04B10/2513

    Abstract: Embodiments of the present disclosure may relate to a transmitter to transmit a radio frequency (RF) signal to a receiver via a dielectric waveguide where the transmitter includes a plurality of mixers to generate modulated RF signals and a combiner to combine the modulated RF signals. Embodiments may also include a receiver to receive, from a dielectric waveguide, a RF signal where the receiver includes a splitter to split the RF signal into a plurality of signal paths, a plurality of filters, and a plurality of demodulators. Embodiments may also include a dielectric waveguide communication apparatus that may include the transmitter and the receiver. Other embodiments may be described and/or claimed.

    Substrate integrated inductors using high throughput additive deposition of hybrid magnetic materials
    16.
    发明授权
    Substrate integrated inductors using high throughput additive deposition of hybrid magnetic materials 有权

    公开(公告)号：US11282800B2

    公开(公告)日：2022-03-22

    申请号：US16651939

    申请日：2017-09-30

    Applicant: Intel Corporation

    Inventor： Henning Braunisch ,  Feras Eid ,  Georgios C. Dogiamis

    IPC: H01L23/64 ,  H01L23/367 ,  H01L23/498 ,  H01L21/48 ,  H01L49/02

    Abstract: An inductor in a device package and a method of forming the inductor in the device package are described. The inductor includes a first conductive layer disposed on a substrate. The inductor also has one or more hybrid magnetic additively manufactured (HMAM) layers disposed over and around the first conductive layer to form one or more via openings over the first conductive layer. The inductor further includes one or more vias disposed into the one or more via openings, wherein the one or more vias are only disposed on the portions of the exposed first conductive layer. The inductor has a dielectric layer disposed over and around the one or more vias, the HMAM layers, and the substrate. The inductor also has a second conductive layer disposed over the one or more vias and the dielectric layer.

    Switched closed loop read-out methods and systems for resonant sensing platforms
    17.
    发明授权
    Switched closed loop read-out methods and systems for resonant sensing platforms 有权

    公开(公告)号：US11221354B2

    公开(公告)日：2022-01-11

    申请号：US15201144

    申请日：2016-07-01

    Applicant: Intel Corporation

    Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Feras Eid ,  Ian A. Young

    IPC: G01R23/02 ,  G01D5/00 ,  H01L23/00 ,  G01D18/00 ,  G01P15/097

    Abstract: Embodiments of the invention include a resonant sensing system comprising driving circuitry to generate a drive signal during excitation time periods, a first switch coupled to the driving circuitry, and a sensing device coupled to the driving circuitry via the first switch during the excitation time periods. The sensing device includes beams to receive the drive signal during a first excitation time period that causes the beams to mechanically oscillate and generate a first induced electromotive force (emf) in response to the drive signal. The first switch decouples the sensing device and the driving circuitry during measurement time periods for measurement of the induced emf.

    Substrate dielectric waveguides in semiconductor packages
    19.
    发明授权
    Substrate dielectric waveguides in semiconductor packages 有权

    公开(公告)号：US11037892B2

    公开(公告)日：2021-06-15

    申请号：US16465545

    申请日：2016-12-30

    Applicant: Intel Corporation

    Inventor： Vijay K. Nair ,  Sasha N. Oster ,  Johanna M. Swan ,  Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Adel A. Elsherbini

    IPC: H01L23/66 ,  H01L23/538 ,  H01P3/16

    Abstract: Waveguides disposed in either an interposer layer or directly in the semiconductor package substrate may be used to transfer signals between semiconductor dies coupled to the semiconductor package. For example, inter-semiconductor die communications using mm-wave carrier signals launched into waveguides specifically tuned to optimize transmission parameters of such signals. The use of such high frequencies beneficially provides for reliable transmission of modulated high data rate signals with lower losses than conductive traces and less cross-talk. The use of mm-wave waveguides provides higher data transfer rates per bump for bump-limited dies as well as beneficially providing improved signal integrity even at such higher data transfer rates. Such mm-wave waveguides may be built directly into semiconductor package layers or may be incorporated into one or more interposed layers that are physically and communicably coupled between the semiconductor dies and the semiconductor package substrate.

    Systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems
    20.
    发明授权
    Systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems 有权

    公开(公告)号：US10976822B2

    公开(公告)日：2021-04-13

    申请号：US16326902

    申请日：2016-10-01

    Applicant: Intel Corporation

    Inventor： Georgios C. Dogiamis ,  Aleksandar Aleksov ,  Johanna M. Swan

    IPC: G06F3/01 ,  G06F1/16

    Abstract: In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems. For instance, there is disclosed in accordance with one embodiment there is wearable device, having therein: a wearable device case; a plurality of actuators within the wearable device case, each of which to vibrate independently or in combination; in which one surface of each of the plurality of actuators is exposed at a surface of the wearable device case; an elastomer surrounding the sides of each of the plurality of actuators within the wearable device case to hold the actuators in position within the wearable device case; and electrical interconnects from each of the plurality of actuators to internal semiconductor components of the wearable device. Other related embodiments are disclosed.

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