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    CAMERA TO CAPTURE MULTIPLE SUB-IMAGES FOR GENERATION OF AN IMAGE
    11.
    发明申请
    CAMERA TO CAPTURE MULTIPLE SUB-IMAGES FOR GENERATION OF AN IMAGE 有权
    摄像机捕获多个子图像以生成图像

    公开(公告)号：US20160044251A1

    公开(公告)日：2016-02-11

    申请号：US14417551

    申请日：2014-03-27

    Applicant: Intel Corporation

    Inventor： Hong W. Wong ,  Wah Yiu Kwong ,  Jiancheng Tao ,  Xiaoguo Liang ,  Andy Keates

    IPC: H04N5/272 ,  H04N5/225 ,  G02B13/00 ,  H04N5/232

    CPC classification number: H04N5/272 ,  G02B13/002 ,  H04N5/2254 ,  H04N5/2256 ,  H04N5/2258 ,  H04N5/2259 ,  H04N5/23238 ,  H04N5/23248 ,  H04N5/23296

    Abstract: Embodiments are generally directed to a camera to capture multiple sub-images for the generation of an image. An embodiment of a camera assembly includes one or more lenses to transmit light from a scene, and an image sensor to simultaneously capture a plurality of sub-images of the scene via the one or more lenses, the plurality of sub-images including a first sub-image and a second sub-image. A processing element is to process the sub-images sensed by the image sensor, the processing of the sub-images includes combining at least the first sub-image and the second sub-image to generate a combined image of the scene.

    Abstract translation: 实施例通常涉及摄像机来捕获用于生成图像的多个子图像。 相机组件的一个实施例包括一个或多个透镜，用于透过来自场景的光，以及图像传感器，用于经由所述一个或多个透镜同时捕捉场景的多个子图像，所述多个子图像包括第一 子图像和第二子图像。 处理元件是处理由图像传感器感测到的子图像，子图像的处理包括至少组合第一子图像和第二子图像以生成场景的组合图像。

    Augmenting mobile computing device audio output via vibration elements
    16.
    发明授权
    Augmenting mobile computing device audio output via vibration elements 有权
    通过振动元件增强移动计算设备的音频输出

    公开(公告)号：US09594428B2

    公开(公告)日：2017-03-14

    申请号：US14126796

    申请日：2013-09-27

    Applicant: Intel Corporation

    Inventor： Jiancheng Tao ,  Hong W. Wong

    IPC: G06F3/01 ,  H04R3/14 ,  G06F3/041 ,  G06F3/16 ,  H04R3/12

    CPC classification number: G06F3/016 ,  G06F3/041 ,  G06F3/162 ,  G06F3/167 ,  H04R3/12 ,  H04R3/14 ,  H04R2499/11

    Abstract: Embodiments of the invention utilize one or more vibration elements to enhance the audio output of a computing device. These vibration element(s) may comprise any conventional vibrating element including a mass element (i.e., counterweight) electrically driven via an actuator to produce the vibrations. The size of the mass element/counterweight may be selected based on the desired strength and frequency for the vibration components (i.e., lower frequencies may utilized larger/heavier mechanisms). Computing devices may process audio data and separately output some of the data for speakers (higher frequency data), and some of the data for vibration elements (lower frequency data). The surface where the device is placed creates a sounding board structure and the vibration elements generate the sensation of physical motion at low, sub-bass and sub-audio frequencies. This physical motion may be perceived by the user as low-frequency audio data, thereby enhancing the audio output of the speakers.

    Abstract translation: 本发明的实施例利用一个或多个振动元件来增强计算设备的音频输出。 这些振动元件可以包括任何常规的振动元件，包括通过致动器电驱动以产生振动的质量元件（即配重）。 可以基于振动分量的期望强度和频率来选择质量元件/配重的尺寸（即，较低频率可以使用较大/较重的机构）。 计算设备可以处理音频数据并单独输出扬声器的一些数据（较高频率数据），以及用于振动元件的一些数据（较低频率数据）。 设备放置的表面产生声板结构，并且振动元件在低音，次低音和次音频频率下产生物理运动的感觉。 该物理运动可被用户感知为低频音频数据，从而增强扬声器的音频输出。

    VAPOR CHAMBER FOR DUAL CAVITY HEAT SOURCES
    17.
    发明公开
    VAPOR CHAMBER FOR DUAL CAVITY HEAT SOURCES 审中-公开

    公开(公告)号：US20230207424A1

    公开(公告)日：2023-06-29

    申请号：US18145231

    申请日：2022-12-22

    Applicant: Intel Corporation

    Inventor： Linghe Sui ,  Jun Liu ,  Jiancheng Tao ,  Tao Wang ,  Chunlin Bai ,  Hongjun She ,  Dengfeng Huang

    IPC: H01L23/427 ,  H01L25/18

    CPC classification number: H01L23/427 ,  H01L25/18

    Abstract: A vapor chamber architecture for multiple cavity/heat source system designs. The vapor chamber architecture can be customized in dimensions to cool two or more spatially separated, and potentially heterogeneous, heat sources in a system floor plan. The vapor chamber architecture can additionally be customized to concurrently manage the cooling requirements for the two or more heat sources that have different power consumptions and sizes. The provided vapor chamber architecture can be manufactured using etching processes, additive manufacturing processes, or the like.

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