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公开(公告)号:US11276918B2
公开(公告)日:2022-03-15
申请号:US15930931
申请日:2020-05-13
Applicant: Intel Corporation
Inventor: Debabani Choudhury , Richard D. Roberts , Ulun Karacaoglu
IPC: H01Q1/24 , H01Q21/24 , H01Q1/22 , H01Q21/20 , H01Q21/06 , H01Q25/00 , H01Q3/26 , H04B7/06 , H01Q1/38 , H01Q9/04 , H01Q3/34 , H01Q25/04
Abstract: Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Other embodiments may be described and claimed.
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公开(公告)号:US10693217B2
公开(公告)日:2020-06-23
申请号:US16100731
申请日:2018-08-10
Applicant: Intel Corporation
Inventor: Debabani Choudhury , Richard D. Roberts , Ulun Karacaoglu
IPC: H01Q1/24 , H01Q21/24 , H01Q1/22 , H01Q21/20 , H01Q21/06 , H01Q25/00 , H01Q3/26 , H04B7/06 , H01Q1/38 , H01Q9/04 , H01Q3/34 , H01Q25/04
Abstract: Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Other embodiments may be described and claimed.
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公开(公告)号:US10673124B2
公开(公告)日:2020-06-02
申请号:US15640413
申请日:2017-06-30
Applicant: INTEL CORPORATION
Inventor: Warren Lee , Kwan Ho Lee , Ulun Karacaoglu , Manish A. Hiranandani , Songnan Yang
Abstract: Techniques for integrating a plurality of radio antennas in an electronic device are described. An example of an electronic device includes a display housing with a display screen and top bezel disposed above the display screen, and a plurality of components disposed in the top bezel. The plurality of components include a first cellular communication antenna disposed on a first side of the top bezel, and a second cellular communication antenna disposed on a second side of the top bezel opposite the first side. The plurality of components also include a first WiFi antenna disposed adjacent to the second cellular communication antenna, and a second WiFi antenna disposed adjacent to the second cellular communication antenna on an opposite side from the first WiFi antenna.
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公开(公告)号:US20190140343A1
公开(公告)日:2019-05-09
申请号:US16100731
申请日:2018-08-10
Applicant: Intel Corporation
Inventor: Debabani Choudhury , Richard D. Roberts , Ulun Karacaoglu
IPC: H01Q1/24 , H01Q25/00 , H01Q21/06 , H01Q21/20 , H01Q1/22 , H01Q3/26 , H01Q21/24 , H01Q1/38 , H01Q25/04 , H01Q3/34 , H04B7/06 , H01Q9/04
CPC classification number: H01Q1/246 , H01Q1/2283 , H01Q1/2291 , H01Q1/38 , H01Q3/26 , H01Q3/34 , H01Q9/0407 , H01Q21/065 , H01Q21/067 , H01Q21/205 , H01Q21/24 , H01Q25/00 , H01Q25/04 , H04B7/0682
Abstract: Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Other embodiments may be described and claimed.
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公开(公告)号:US10244488B2
公开(公告)日:2019-03-26
申请号:US14499101
申请日:2014-09-27
Applicant: Intel Corporation
Inventor: Kwan Ho Lee , Yasuharu Omi , Ulun Karacaoglu , Pronay Dutta , Simin Xiong
Abstract: Technologies for the calibration of a body presence sensor include a mobile computing device configured to calibrate the body presence sensor based on a present physical configuration mode of the mobile computing device. The mobile computing device may be adjustable into multiple physical configuration modes based on the intended use of the mobile computing device. The mobile computing device controls a transmit power level of an associated communication circuit based on whether the body presence sensor detects a body presence within proximity to the mobile computing device.
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公开(公告)号:US20180108466A1
公开(公告)日:2018-04-19
申请号:US15793443
申请日:2017-10-25
Applicant: Intel Corporation
Inventor: Anand S. Konanur , Ulun Karacaoglu , Songnan Yang
CPC classification number: H01F5/003 , H01Q1/2216 , H01Q1/2266 , H01Q7/00 , H04B5/0081 , Y10T29/49016
Abstract: A Near Field Communications (NFC) antenna coil, having a first loop; and a second loop connected to the first loop to form a spiral shape, wherein the first loop and the second loop have different sizes to be mutually couplable with a first antenna pairing coil and a second antenna pairing coil, respectively.
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公开(公告)号:US20170179573A1
公开(公告)日:2017-06-22
申请号:US15439113
申请日:2017-02-22
Applicant: Intel Corporation
Inventor: Anand S. Konanur , Ulun Karacaoglu , Songnan Yang
CPC classification number: H04W4/80 , H01Q1/2291 , H01Q5/321 , H01Q5/40 , H01Q7/00 , H01Q9/16 , H01Q21/28 , H04B5/0031 , H04W88/06
Abstract: Described herein are techniques related to near field coupling and WLAN dual-band operations. For example, a WLAN dual-band utilizes the same coil antenna that is utilized for near field communications (NFC) functions. The WLAN dual-band may be integrated into an NFC module to form a single module.
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公开(公告)号:US09685995B2
公开(公告)日:2017-06-20
申请号:US14797608
申请日:2015-07-13
Applicant: Intel Corporation
Inventor: Songnan Yang , Hao-Han Hsu , Ulun Karacaoglu , Anand Konanur , Eric Hong
CPC classification number: H04B5/0081 , H01Q1/22 , H01Q1/2216 , H01Q1/2266 , H01Q1/243 , H01Q1/44 , H01Q1/48 , H01Q7/00 , H04M1/026 , H04M1/0266 , H04W4/80
Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
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公开(公告)号:US09661446B2
公开(公告)日:2017-05-23
申请号:US14839413
申请日:2015-08-28
Applicant: Intel Corporation
Inventor: Anand S. Konanur , Ulun Karacaoglu , Songnan Yang
IPC: H04B5/00 , H04M1/00 , H04W4/00 , H01Q7/00 , H01Q5/40 , H01Q21/28 , H04W88/06 , H01Q5/321 , H01Q9/16
CPC classification number: H04W4/80 , H01Q1/2291 , H01Q5/321 , H01Q5/40 , H01Q7/00 , H01Q9/16 , H01Q21/28 , H04B5/0031 , H04W88/06
Abstract: Described herein are techniques related to near field coupling and WLAN dual-band operations. For example, a WLAN dual-band utilizes the same coil antenna that is utilized for near field communications (NFC) functions. The WLAN dual-band may be integrated into an NFC module to form a single module.
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公开(公告)号:US09627742B2
公开(公告)日:2017-04-18
申请号:US14871532
申请日:2015-09-30
Applicant: INTEL CORPORATION
Inventor: Anand Konanur , Ulun Karacaoglu , Songnan Yang , Shawn McEuen
CPC classification number: H01Q1/243 , H01Q1/2266 , H01Q1/40 , H01Q21/28
Abstract: Embodiments of systems and methods for providing in-mold laminate antennas are generally described herein. Other embodiments may be described and claimed.
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