公开(公告)号：US20230197622A1

公开(公告)日：2023-06-22

申请号：US17559431

申请日：2021-12-22

Applicant: Intel Corporation

Inventor： Karumbu Meyyappan ,  Jeffory L, Smalley ,  Gregorio Murtagian ,  Srikant Nekkanty ,  Pooya Tadayon ,  Eric J.M. Moret ,  Bijoyraj Sahu

IPC: H01L23/538 ,  H01L23/498 ,  H01R12/52 ,  H01L25/00 ,  H01L25/18 ,  H01L25/065 ,  H01R12/58 ,  H05K3/32 ,  H05K1/18

CPC classification number: H01L23/5384 ,  H01L23/49827 ,  H01L23/5385 ,  H01R12/52 ,  H01L25/50 ,  H01L25/18 ,  H01L25/0655 ,  H01R12/58 ,  H05K3/32 ,  H05K1/181 ,  H05K2201/10189 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/1053

Abstract: An electronic system and associated methods are disclosed. In one example, the electronic system includes an interposer including electrically conductive interposer interconnect, a first interposer surface, and a second interposer surface; a processor package including at least one processor integrated circuit (IC), the processor package attached to the first interposer surface and electrically connected to the interposer interconnect; a first liquid metal well array including multiple liquid metal wells attached to a second interposer surface and the interposer interconnect; a second liquid metal well array including a first array surface attached to the first interposer surface and the interposer interconnect; and a packaged companion IC to the processor IC attached to a second array surface of the second liquid metal well array.

公开(公告)号：US20230187850A1

公开(公告)日：2023-06-15

申请号：US17549427

申请日：2021-12-13

Applicant: Intel Corporation

Inventor： Ziyin Lin ,  Aaron Michael Garelick ,  Karumbu Meyyappan ,  Gregorio Murtagian ,  Srikant Nekkanty ,  Taylor Rawlings ,  Jeffory L. Smalley ,  Pooya Tadayon ,  Dingying Xu

IPC: H01R3/08 ,  H01L23/498 ,  H01L23/32 ,  H01R43/00

CPC classification number: H01R3/08 ,  H01L23/49816 ,  H01L23/32 ,  H01L23/49833 ,  H01R43/005

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a socket that includes one or more liquid metal filled reservoirs. In selected examples, the electronic devices and sockets include configurations to aid in reducing ingress of moisture.

公开(公告)号：US09859636B2

公开(公告)日：2018-01-02

申请号：US14757915

申请日：2015-12-24

Applicant: INTEL CORPORATION

Inventor： Thomas A. Boyd ,  Jeffory L. Smalley ,  Russell S. Aoki ,  Karumbu Meyyappan

IPC: H01R12/72 ,  H01R12/70 ,  H01R13/631 ,  H01R13/635 ,  H01R13/648 ,  H01R43/26

CPC classification number: H01R12/721 ,  H01R12/7005 ,  H01R12/774 ,  H01R13/508 ,  H01R13/631 ,  H01R13/635 ,  H01R13/6485 ,  H01R43/26

Abstract: An example apparatus for connecting linear edge cards includes a housing to hold at least one set of conductive contacts facing perpendicularly towards a mating plane. The apparatus further includes an activator bar coupled to the housing, the activator bar to hold two parts of the housing apart via two opposing normal forces. The apparatus also includes a contact load spring coupled to the housing, the contact load spring to apply two forces parallel to the direction of the conductive contacts and against the two opposing normal forces of the activator bar. The apparatus further includes an ejector spring coupled to the contact load spring and the activator bar. The ejector spring is to apply a force perpendicular to the two opposing normal forces of the activator bar and in a direction of an opening of the housing.