公开(公告)号：US10908206B2

公开(公告)日：2021-02-02

申请号：US16302555

申请日：2016-05-17

Applicant: Intel Corporation

Inventor： Mayue Xie ,  Chengqing Hu ,  Jong-Ru Guo ,  Zuoguo Wu ,  Deepak Goyal

IPC: G01R31/28 ,  G01R31/11 ,  H04B10/071

Abstract: Disclosed herein are systems and methods for the characterization of transmission media, among other embodiments. For example, a system for characterizing a transmission medium may include: a waveform generator to generate an initial input waveform; waveform pre-processing circuitry to process the initial waveform to generate a processed input waveform for provision to the transmission medium, wherein the processed input waveform has a maximum amplitude greater than a maximum amplitude of the initial input waveform; and waveform output circuitry to display or store data representative of an initial output waveform, wherein the initial output waveform is output from the transmission medium as a reflection or transmission of the processed input waveform.

公开(公告)号：US10746780B2

公开(公告)日：2020-08-18

申请号：US15776979

申请日：2015-11-18

Applicant: Intel Corporation

Inventor： Mayue Xie ,  Simranjit S. Khalsa ,  Hemachandar Tanukonda Devarajulu ,  Deepak Goyal ,  Zhiguo Qian

IPC: G01R31/11 ,  G01R31/28 ,  G01R31/311

Abstract: An apparatus comprises a signal generator circuit, a test probe, a signal sensor circuit, and a defect detection circuit. The signal generator circuit is configured to generate an impulse test signal having an impulse waveform and adjust a bandwidth of the impulse test signal. The test probe is electrically coupled to the signal generator circuit and configured to apply the impulse test signal to a device under test (DUT). The signal sensor circuit is configured to sense a conducted test signal produced by applying the impulse test signal to the DUT with the test probe. The defect detection circuit is configured to generate an indication of a defect in the DUT using the conducted test signal.

公开(公告)号：US20190293708A1

公开(公告)日：2019-09-26

申请号：US16302555

申请日：2016-05-17

Applicant: Intel Corporation

Inventor： Mayue Xie ,  Chengqing Hu ,  Jong-Ru Guo ,  Zuoguo Wu ,  Deepak Goyal

IPC: G01R31/28 ,  G01R31/11

Abstract: Disclosed herein are systems and methods for the characterization of transmission media, among other embodiments. For example, a system for characterizing a transmission medium may include: a waveform generator to generate an initial input waveform; waveform pre-processing circuitry to process the initial waveform to generate a processed input waveform for provision to the transmission medium, wherein the processed input waveform has a maximum amplitude greater than a maximum amplitude of the initial input waveform; and waveform output circuitry to display or store data representative of an initial output waveform, wherein the initial output waveform is output from the transmission medium as a reflection or transmission of the processed input waveform.

公开(公告)号：US10088518B1

公开(公告)日：2018-10-02

申请号：US15474674

申请日：2017-03-30

Applicant: Intel Corporation

Inventor： Mayue Xie ,  Zhiguo Qian ,  Jong-Ru Guo ,  Zhichao Zhang ,  Zuoguo Wu

IPC: G01R31/08 ,  G01R31/28

Abstract: A die with a transmission circuit, a reception circuit, and a comparison circuit can be provided. The transmission circuit can be configured to transmit a first signal through a first channel at a first transmission rate and a first transmission amplitude. The reception circuit can be in communication with the transmission circuit through the first channel. The reception circuit can receive a second signal at a first reception rate and at a first reception amplitude. The comparison circuit can be in communication with the transmission circuit and the reception circuit. The comparison circuit can be configured to: determine a first rate error value, determine a first amplitude error value, compare the first rate error value with a rate threshold to determine a first rate error occurrence, and compare the first amplitude error value with an amplitude threshold to determine a first amplitude error occurrence.

公开(公告)号：US10026664B2

公开(公告)日：2018-07-17

申请号：US15421338

申请日：2017-01-31

Applicant: INTEL CORPORATION

Inventor： Mayue Xie ,  Zhiyong Wang ,  Yuan-Chuan Steven Chen

IPC: G01R31/02 ,  H01L21/66 ,  H01L27/02 ,  H01L23/50 ,  H01L29/861 ,  H01L49/02 ,  G01R31/26

Abstract: Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.

公开(公告)号：US09564381B2

公开(公告)日：2017-02-07

申请号：US14876728

申请日：2015-10-06

Applicant: Intel Corporation

Inventor： Mayue Xie ,  Zhiyong Wang ,  Yuan-Chuan Steven Chen

IPC: G01R31/02 ,  H01L21/66 ,  H01L23/48 ,  G01R31/26 ,  H01L27/02 ,  H01L23/50 ,  H01L27/06 ,  H01L49/02 ,  H01L29/861

CPC classification number: H01L22/34 ,  G01R31/2642 ,  H01L22/32 ,  H01L23/48 ,  H01L23/50 ,  H01L27/0207 ,  H01L27/0255 ,  H01L27/0296 ,  H01L27/0676 ,  H01L28/20 ,  H01L29/861 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.

Abstract translation: 描述了一种装置，包括：输入垫; 输出板 电线，其耦合到所述输入焊盘和所述输出焊盘，所述导线定位在半导体管芯的周围，所述焊丝基本上沿着所述半导体管芯的周边延伸; 以及一个或多个二极管，其耦合在所述导线的各个部分处，并且沿着所述半导体管芯的周边定位并围绕所述半导体管芯。

公开(公告)号：US20160274044A1

公开(公告)日：2016-09-22

申请号：US14664726

申请日：2015-03-20

Applicant: Intel Corporation

Inventor： Mayue Xie ,  Deepak Goyal ,  Thomas J. Begala

IPC: G01N25/00

CPC classification number: G01N25/72

Abstract: Circuit device inspection system using temperature gradients. In some embodiments, a system may include an infrared camera, first and second temperature sources, controller circuitry to cause the infrared camera to capture an infrared image of a region of a circuit device and to cause the first and second temperature sources to generate first and second temperature outputs to be applied to first and second locations on the circuit device, and processing circuitry to generate temperature gradient data. The temperature gradient data may be indicative of discontinuities in traces in the circuit device.

Abstract translation: 电路设备检查系统采用温度梯度。 在一些实施例中，系统可以包括红外相机，第一和第二温度源，控制器电路，用于使红外相机捕获电路设备的区域的红外图像，并且使第一和第二温度源首先产生和 要施加到电路装置上的第一和第二位置的第二温度输出，以及用于产生温度梯度数据的处理电路。 温度梯度数据可以指示电路装置中的迹线中的不连续性。