公开(公告)号：US20240364000A1

公开(公告)日：2024-10-31

申请号：US18140361

申请日：2023-04-27

Applicant: Intel Corporation

Inventor： Bernd WAIDHAS ,  Thomas WAGNER ,  Georg SEIDEMANN ,  Harald GOSSNER ,  Telesphor KAMGAING ,  Shuhei YAMADA ,  Tae Young YANG

IPC: H01Q1/42 ,  H01Q1/22 ,  H01Q9/04

CPC classification number: H01Q1/422 ,  H01Q1/2283 ,  H01Q9/0407

Abstract: Embodiments disclosed herein include a die module. In an embodiment, the die module comprises a die with a first surface and a second surface. In an embodiment, a first pad is on the second surface of the die, and a dielectric layer is over the second surface of the die and the first pad. In an embodiment, an antenna module is over the dielectric layer, where the antenna module comprises a second pad that is aligned over the first pad.

公开(公告)号：US20230420396A1

公开(公告)日：2023-12-28

申请号：US18253954

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Tolga ACIKALIN ,  Arnaud AMADJIKPE ,  Brent R. CARLTON ,  Chia-Pin CHIU ,  Timothy F. COX ,  Kenneth P. FOUST ,  Bryce D. HORINE ,  Telesphor KAMGAING ,  Renzhi LIU ,  Jason A. MIX ,  Sai VADLAMANI ,  Tae Young YANG ,  Zhen ZHOU

IPC: H01L23/66 ,  H01Q9/42 ,  H01Q1/22 ,  H01Q9/36 ,  H01Q21/24 ,  H01L25/065 ,  H01L23/00 ,  H01L23/538

CPC classification number: H01L23/66 ,  H01Q9/42 ,  H01Q1/2283 ,  H01Q9/36 ,  H01Q21/24 ,  H01L25/0652 ,  H01L2924/1421 ,  H01L24/16 ,  H01L23/5381 ,  H01L2223/6677 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L25/0655

Abstract: In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a cover structure housing the first device and the second device. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a radio frequency signal interface wirelessly communicatively coupling the first device and the second device. The radio frequency signal interface includes the first antenna and the second antenna.

公开(公告)号：US20220199556A1

公开(公告)日：2022-06-23

申请号：US17131863

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Zhen ZHOU ,  Tae Young YANG ,  Tolga ACIKALIN ,  Johanny ESCOBAR PELAEZ ,  Kenneth P. FOUST ,  Chia-Pin CHIU ,  Renzhi LIU ,  Cheng-Yuan CHIN

IPC: H01L23/66 ,  H01L29/93 ,  H01L23/14 ,  H01Q15/00 ,  H01Q1/42 ,  H01Q15/14 ,  H01Q1/22

Abstract: In various aspects, a package system includes at least a first package and a second package arranged on a same side of the package carrier. Each of the first package and the second package comprises an antenna to transmit and/or receive radio frequency signals. A cover may be arranged at a distance over the first package and the second package at the same side of the package carrier as the first package and the second package. The cover comprises at least one conductive element forming a predefined pattern on a side of the cover facing the first package and the second package. The predefined pattern is configured as a frequency selective surface. The package system further includes a radio frequency signal interface wirelessly connecting the antennas of the first package and the second package. The radio frequency signal interface comprises the at least one conductive element.