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Patent Agency Ranking
公开(公告)号：US20160164184A1
公开(公告)日：2016-06-09
申请号：US14961911
申请日：2015-12-08
Applicant: Industrial Technology Research Institute
Inventor： Wei-Yu Li , Tune-Hune Kao , Meng-Chi Huang , Wei Chung , Min-Chieh Chou
IPC: H01Q9/36
CPC classification number: H01Q1/243 , H01Q1/52 , H01Q9/0442
Abstract: A beam antenna comprising a first material layer, a second material layer, a first radiating conductor unit and an energy transmission conductor layer is provided. The first material layer has a signal source and a first conductor layer. The second material layer has a first thin-film layer, where the first thin-film layer is adhered on a surface of the second material layer. The first thin-film layer further comprises an insulating gel and a plurality of trigger particles. The first radiating conductor unit is adhered on a surface of the first thin-file layer, and the first thin-file layer is located between the first radiating conductor unit and the second material layer. The energy transmission conductor structure is disposed between the first and the second material layers, which has a first terminal and a second terminal that electrically coupled or connected to the signal source and the first radiating conductor unit respectively.
Abstract translation: 提供一种包括第一材料层，第二材料层，第一辐射导体单元和能量传输导体层的波束天线。 第一材料层具有信号源和第一导体层。 第二材料层具有第一薄膜层，其中第一薄膜层粘附在第二材料层的表面上。 第一薄膜层还包括绝缘凝胶和多个触发颗粒。 第一辐射导体单元粘附在第一薄文件层的表面上，第一薄文件层位于第一辐射导体单元和第二材料层之间。 能量传输导体结构设置在第一和第二材料层之间，第一和第二材料层分别具有电耦合或连接到信号源和第一辐射导体单元的第一端子和第二端子。
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公开(公告)号：US11959941B2
公开(公告)日：2024-04-16
申请号：US17561997
申请日：2021-12-27
Applicant: Industrial Technology Research Institute
Inventor： Min-Chieh Chou , Meng-Chi Huang , Tune-Hune Kao , Yue-Zhen Huang
CPC classification number: G01R1/07342 , G01R1/0735
Abstract: A probe card includes a flexible inorganic material layer, a metal micro structure, and a circuit board. The flexible inorganic material layer has a first surface and a second surface opposite to each other. The metal micro structure is disposed on the first surface. The circuit board is disposed on the second surface, and the circuit board is electrically connected to the metal micro structure. The test signal is adapted to be conducted to the circuit board through the flexible inorganic material layer.
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公开(公告)号：US20170196085A1
公开(公告)日：2017-07-06
申请号：US15461495
申请日：2017-03-17
Applicant: Industrial Technology Research Institute
Inventor： Meng-Chi Huang , Tune-Hune Kao
CPC classification number: H05K1/115 , H05K1/0366 , H05K1/0373 , H05K1/09 , H05K1/162 , H05K1/165 , H05K3/0026 , H05K3/0032 , H05K3/0035 , H05K3/107 , H05K3/421 , H05K3/423 , H05K2201/09036
Abstract: An insulating colloidal material and a multilayer circuit structure are provided, wherein the insulating colloidal material includes a resin, trigger particles, and an organic solvent. The trigger particles are selected from the group consisting of organometallic particles and ionic compounds. The ratio of the trigger particles to the insulating colloidal material is between 0.1 wt % and 10 wt %. At least one insulating colloidal layer in the multilayer circuit structure contains the trigger particles.
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公开(公告)号：US20170127513A1
公开(公告)日：2017-05-04
申请号：US14972112
申请日：2015-12-17
Applicant: Industrial Technology Research Institute
Inventor： Meng-Chi Huang , Tune-Hune Kao
CPC classification number: H05K1/115 , H05K1/0366 , H05K1/0373 , H05K1/09 , H05K1/162 , H05K1/165 , H05K3/0026 , H05K3/0032 , H05K3/0035 , H05K3/107 , H05K3/421 , H05K3/423 , H05K2201/09036
Abstract: An insulating colloidal material and a multilayer circuit structure are provided, wherein the insulating colloidal material includes a resin, trigger particles, and an organic solvent. The trigger particles are selected from any one of the group consisting of organometallic particles and ionic compounds. The ratio of the trigger particles to the insulating colloidal material is between 0.1 wt % and 10 wt %. At least one insulating colloidal layer in the multilayer circuit structure contains the trigger particles.
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公开(公告)号：US09642250B1
公开(公告)日：2017-05-02
申请号：US14972112
申请日：2015-12-17
Applicant: Industrial Technology Research Institute
Inventor： Meng-Chi Huang , Tune-Hune Kao
CPC classification number: H05K1/115 , H05K1/0366 , H05K1/0373 , H05K1/09 , H05K1/162 , H05K1/165 , H05K3/0026 , H05K3/0032 , H05K3/0035 , H05K3/107 , H05K3/421 , H05K3/423 , H05K2201/09036
Abstract: An insulating colloidal material and a multilayer circuit structure are provided, wherein the insulating colloidal material includes a resin, trigger particles, and an organic solvent. The trigger particles are selected from any one of the group consisting of organometallic particles and ionic compounds. The ratio of the trigger particles to the insulating colloidal material is between 0.1 wt % and 10 wt %. At least one insulating colloidal layer in the multilayer circuit structure contains the trigger particles.
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