公开(公告)号：US20250168981A1

公开(公告)日：2025-05-22

申请号：US19024569

申请日：2025-01-16

Applicant: InnoLux Corporation

Inventor： Cheng-Chi WANG ,  Kuan-Feng LEE ,  Jui-Jen YUEH

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/40

Abstract: An electronic device is provided. The electronic device includes a substrate structure, a control unit, a first circuit structure, and an electronic unit. The substrate structure has a conductive via pattern and a dummy via pattern. The control unit is electrically connected to the conductive via pattern. The first circuit structure is electrically connected to the conductive via pattern. The electronic unit is electrically connected to the control unit through the first circuit structure. The dummy via pattern is electrically insulated from the first circuit structure.

公开(公告)号：US20240170385A1

公开(公告)日：2024-05-23

申请号：US18145198

申请日：2022-12-22

Applicant: InnoLux Corporation

Inventor： Te-Hsun LIN ,  Wen-Hsiang LIAO ,  Mei-Yen CHEN ,  Ming-Hsien SHIH ,  Yung-Feng CHEN ,  Cheng-Chi WANG

IPC: H01L23/498 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2924/15174

Abstract: A semiconductor package device is provided. The semiconductor package device includes a chip and a redistribution layer disposed on the chip and electrically connected to the chip. The redistribution layer includes a plurality of first metal lines and a plurality of second metal lines, wherein at least one of the second metal lines is disposed between two adjacent first metal lines. The included angle between the at least one of the second metal lines and the two adjacent first metal lines is greater than or equal to 0 degrees and less than or equal to 10 degrees. The first width of one of the two adjacent first metal lines is greater than the second width of the at least one of the second metal lines.

公开(公告)号：US20240102194A1

公开(公告)日：2024-03-28

申请号：US18231099

申请日：2023-08-07

Applicant: YUAN ZE UNIVERSITY ,  Innolux Corporation

Inventor： Cheng-EN HO ,  Yu-Lian CHEN ,  Cheng-Chi WANG ,  Yu-Jen CHANG ,  Yung-Sheng LU ,  Cheng-Yu LEE ,  Yu-Ming LIN

IPC: C25D5/18 ,  C25D5/48 ,  C25D17/02

CPC classification number: C25D5/18 ,  C25D5/48 ,  C25D17/02

Abstract: A plating system and a method thereof are disclosed. The plating system performs a N-stage plating drilling filling process in which a M-th stage plating drilling filling process with a M-th current density is performed on a hole of a substrate for a M-th plating time to form a M-th plating layer on the to-be-plated layer, wherein N is a positive integer equal to or greater than 3, and M is a positive integer positive integer in a range of 1 to N. Therefore, the technical effect of providing a higher drilling filling rate than conventional plating filling technology under a condition that a total thickness of plating layers is fixed can be achieved.

公开(公告)号：US20240071840A1

公开(公告)日：2024-02-29

申请号：US17958424

申请日：2022-10-02

Applicant: InnoLux Corporation

Inventor： Cheng-Chi WANG ,  Tzu-Yen CHIU

IPC: H01L21/66 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L22/20 ,  H01L21/561 ,  H01L21/568 ,  H01L24/11 ,  H01L24/19 ,  H01L2224/117 ,  H01L2224/11901 ,  H01L2924/1011

Abstract: A method for manufacturing an electronic device includes: providing a base layer, wherein the base layer includes a plurality of first dies and a plurality of second dies, and a number of the plurality of first dies is greater than a number of the plurality of second dies; forming a circuit layer on the base layer; and performing an electricity test to confirm whether the circuit layer is electrically connected to one of the plurality of second dies.

公开(公告)号：US20230413433A1

公开(公告)日：2023-12-21

申请号：US17890242

申请日：2022-08-17

Applicant: InnoLux Corporation

Inventor： Cheng-Chi WANG ,  Cheng-Hsien HO ,  Kuo-Sheng YEH ,  Jui-Jen YUEH

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/40

CPC classification number: H05K1/11 ,  H05K3/4007 ,  H05K1/182

Abstract: An electronic device includes a first electronic unit, a second electronic unit, a bonding pad, an insulating layer and a circuit layer. The bonding pad is disposed between the first electronic unit and the second electronic unit. The insulating layer is disposed corresponding to the first electronic unit, to the second electronic unit and to the bonding pad. The first electronic unit is electrically connected with the second electronic unit through the circuit layer and through the bonding pad.

公开(公告)号：US20250140645A1

公开(公告)日：2025-05-01

申请号：US19006108

申请日：2024-12-30

Applicant: InnoLux Corporation

Inventor： Chin-Lung TING ,  Chung-Kuang WEI ,  Cheng-Chi WANG ,  Yeong-E CHEN ,  Yi-Hung LIN

IPC: H01L23/44 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L25/075 ,  H05K1/02

Abstract: An electronic device including a circuit layer, an electronic element, a first flow-path structure and a fluid material is disclosed. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The first flow-path structure includes a first flow path, and the electronic element is disposed in the first flow-path structure. The fluid material is disposed in the first flow path. The fluid material is used for performing heat exchange with the electronic element. The circuit layer includes an input hole and an output hole, and the fluid material enters the first flow path through the input hole and exits the first flow path through the output hole.

公开(公告)号：US20250046623A1

公开(公告)日：2025-02-06

申请号：US18919664

申请日：2024-10-18

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Cheng-En CHENG ,  Yu-Ting LIU ,  Cheng-Chi WANG

IPC: H01L21/48 ,  H01L21/66 ,  H01L21/683 ,  H01L23/544

Abstract: The application relates to a method for manufacturing an electronic device, and in particular, to a method for manufacturing an electronic device with a carrier substrate. The method includes: providing a carrier substrate; forming a first base layer on the carrier substrate; forming a working unit on the first base layer, performing a detection step on the working unit to identify whether a defect is present, wherein the detection step includes automated optical inspection (AOI), electrical detection, or a combination thereof; and repairing the electronic device.

公开(公告)号：US20230411230A1

公开(公告)日：2023-12-21

申请号：US17815297

申请日：2022-07-27

Applicant: InnoLux Corporation

Inventor： Cheng-Chi WANG ,  Cheng-Hsien HO ,  Kuo-Sheng YEH ,  Ching-Wei CHEN ,  Chin-Ming HUANG

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/3135 ,  H01L24/20 ,  H01L24/24 ,  H01L24/25 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3121 ,  H01L2224/214 ,  H01L2224/244 ,  H01L2224/211 ,  H01L2224/24137 ,  H01L2224/25175 ,  H01L2224/19 ,  H01L2224/82101 ,  H01L24/82

Abstract: An electronic device includes a protective layer, an electronic unit and at least one anchor structure disposed in the protective layer, and a connecting member disposed on the protective layer. The electronic unit includes a first electronic unit and a second electronic unit that are electrically connected through the connecting member. The at least one anchor structure is between the first electronic unit and the second electronic unit. The connecting member has a first conductive layer, and the first conductive layer contacts the surface of the first electronic unit, the surface of the anchor structure and the surface of the protective layer.

公开(公告)号：US20230043187A1

公开(公告)日：2023-02-09

申请号：US17528167

申请日：2021-11-16

Applicant: InnoLux Corporation

Inventor： Cheng-Chi WANG ,  Kuang-Ming FAN ,  Liang-Lu CHEN ,  Chia-Lin YANG

IPC: H01L21/66 ,  H01L23/00

Abstract: The present disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a connecting element. The connecting element includes a first conductive line segment, a second conductive line segment, and a first connecting line segment. The first conductive line segment is electrically connected to the second conductive line segment through the first connecting line segment. In a vertical projection direction, the first connecting line segment has a first height, the first conductive line segment has a second height, and the first height is different from the second height.

公开(公告)号：US20220130715A1

公开(公告)日：2022-04-28

申请号：US17503398

申请日：2021-10-18

Applicant: InnoLux Corporation

Inventor： Cheng-Chi WANG ,  Yeong-E CHEN ,  Cheng-En CHENG

IPC: H01L21/768 ,  H01L21/027 ,  H01L21/288 ,  H01L21/683

Abstract: The present disclosure discloses a method for manufacturing an electronic device, including: setting a basic working area; providing a supporting platform having a plurality of vacuum valves; disposing a substrate on the supporting platform; applying vacuum attraction to a portion of the substrate through a portion of the plurality of vacuum valves, wherein the portion of the substrate corresponding to the vacuum attraction is defined as an attracted region; and performing an exposure on a portion of the attracted region, wherein an area of the attracted region is larger than the basic working area and smaller than an area of the supporting platform.